69b0216ac2
While the bonding module is unloading, it is considered that after rtnl_link_unregister all bond devices are destroyed but since no synchronization mechanism exists, a new bond device can be created via bonding_masters before unregister_pernet_subsys which would lead to multiple problems (e.g. NULL pointer dereference, wrong RIP, list corruption). This patch fixes the issue by removing any bond devices left in the netns after bonding_masters is removed from sysfs. Signed-off-by: Nikolay Aleksandrov <nikolay@redhat.com> Acked-by: Veaceslav Falico <vfalico@redhat.com> Signed-off-by: David S. Miller <davem@davemloft.net> |
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.. | ||
Makefile | ||
bond_3ad.c | ||
bond_3ad.h | ||
bond_alb.c | ||
bond_alb.h | ||
bond_debugfs.c | ||
bond_main.c | ||
bond_procfs.c | ||
bond_sysfs.c | ||
bonding.h |