f4fb859665
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register() when
device_register() fails by calling thermal_cooling_device_destroy_sysfs()
(Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params (Corentin
Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver and
document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai).
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Merge tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a thermal library and thermal tools to wrap the netlink
interface into event-based callbacks, improve overheat condition
handling during suspend-to-idle on Intel SoCs, add some new hardware
support, fix bugs and clean up code.
Specifics:
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register()
when device_register() fails by calling
thermal_cooling_device_destroy_sysfs() (Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params
(Corentin Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver
and document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai)"
* tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits)
thermal: intel: pch: improve the cooling delay log
thermal: intel: pch: enhance overheat handling
thermal: intel: pch: move cooling delay to suspend_noirq phase
PM: wakeup: expose pm_wakeup_pending to modules
thermal: k3_j72xx_bandgap: Add the bandgap driver support
dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
thermal/core: Fix memory leak in __thermal_cooling_device_register()
dt-bindings: thermal: tsens: Add sc8280xp compatible
dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
thermal/drivers/qcom/lmh: Add sc8180x compatible
thermal/drivers/rz2gl: Fix OTP Calibration Register values
dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
thermal: thermal_of: fix typo on __thermal_bind_params
tools/thermal: remove unneeded semicolon
tools/lib/thermal: remove unneeded semicolon
thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
tools/thermal: Add thermal daemon skeleton
tools/thermal: Add a temperature capture tool
tools/thermal: Add util library
...
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| accounting | ||
| arch | ||
| bootconfig | ||
| bpf | ||
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| certs | ||
| cgroup | ||
| counter | ||
| debugging | ||
| edid | ||
| firewire | ||
| firmware | ||
| gpio | ||
| hv | ||
| iio | ||
| include | ||
| io_uring | ||
| kvm/kvm_stat | ||
| laptop | ||
| leds | ||
| lib | ||
| memory-model | ||
| objtool | ||
| pci | ||
| pcmcia | ||
| perf | ||
| power | ||
| rcu | ||
| scripts | ||
| spi | ||
| testing | ||
| thermal | ||
| time | ||
| tracing | ||
| usb | ||
| virtio | ||
| vm | ||
| wmi | ||
| Makefile | ||