Commit Graph

54 Commits

Author SHA1 Message Date
Javi Merino c708a98f01 thermal: document struct thermal_zone_device and thermal_governor
Document struct thermal_zone_device and struct thermal_governor fields
and their use by the thermal framework code.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-22 10:12:05 +08:00
Eduardo Valentin a116b5d44f thermal: core: introduce thermal_of_cooling_device_register
This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.

This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Eduardo Valentin 4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Eduardo Valentin a8892d8389 thermal: thermal_core: allow binding with limits on bind_params
When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:10:24 -04:00
Eduardo Valentin ccba4ffd9e drivers: thermal: make usage of CONFIG_THERMAL_HWMON optional
When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.

This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.

In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.

Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:10:11 -04:00
Linus Torvalds b29bdba519 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management update from Zhang Rui:
 "The most important one is to build thermal core and governor and cpu
  cooling code into one module.  This fixes a regression that thermal
  core does not work if it is built as module, since 3.7.  I'll backport
  them to stable kernel once those changes are in upstream.

  The largest batch is the thermal kernel-doc & coding style
  updates/cleanups from Eduardo.

  Highlights:

   - build all thermal framework code into one module to fix a
     regression that thermal does not work if it is built as module.

   - Marvell Armada 370/XP thermal sensor driver

   - thermal core/cpu cooling kernel-doc & coding style updates and
     cleanups.

   - Add Eduardo Valentin as thermal sub-maintainer, both in mailing
     list and patchwork.  He will help me on arm thermal drivers."

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (68 commits)
  thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL()
  thermal: thermal_core: remove usage of IS_ERR_OR_NULL
  thermal: cpu_cooling: improve line breaking
  thermal: cpu_cooling: alignment improvements
  thermal: cpu_cooling: remove checkpatch.pl warning
  thermal: cpu_cooling: remove trailing blank line
  thermal: cpu_cooling: align on open parenthesis
  thermal: cpu_cooling: standardize comment style
  thermal: cpu_cooling: standardize end of function
  thermal: cpu_cooling: remove trailing white spaces
  Thermal: update documentation for thermal_zone_device_register
  thermal: update kernel-doc for thermal_zone_device_register
  thermal: update kernel-doc for create_trip_attrs
  thermal: update kernel-doc for thermal_cooling_device_register
  thermal: update kernel-doc for thermal_zone_unbind_cooling_device
  thermal: update kernel-doc for thermal_zone_bind_cooling_device
  thermal: use EXPORT_SYMBOL_GPL
  thermal: rename notify_thermal_framework to thermal_notify_framework
  thermal: update driver license
  thermal: use strlcpy instead of strcpy
  ...
2013-05-09 09:40:49 -07:00
Eduardo Valentin 7b73c99377 thermal: rename notify_thermal_framework to thermal_notify_framework
To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:16 +08:00
Eduardo Valentin 837b26bb2e thermal: expose thermal_zone_get_temp API
This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.

Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15 09:39:02 +08:00
Eduardo Valentin 63c4d919cf thermal: introduce thermal_zone_get_zone_by_name helper function
This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15 09:34:28 +08:00
Zhang Rui d13cb03aef Merge branch 'thermal' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next
Conflicts:
	drivers/thermal/cpu_cooling.c
2013-04-15 09:26:58 +08:00
Zhang Rui 80a26a5c22 Thermal: build thermal governors into thermal_sys module
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:43 +08:00
Ezequiel Garcia f8b587055a thermal: Fix compiler warning
The following warning is obtained when CONFIG_NET is not defined:

In file included from drivers/thermal/mvebu_thermal.c:27:0:
include/linux/thermal.h:254:12: warning: 'thermal_generate_netlink_event'
defined but not used [-Wunused-function]

This patch fixes the warning by properly inlining
thermal_generate_netlink_event().

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:08:21 +08:00
Zhang Rui 57df810693 Thermal: exynos: fix cooling state translation
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-03-26 14:33:50 +08:00
Masatake YAMATO 73214f5d9f thermal: shorten too long mcast group name
The original name is too long.

Signed-off-by: Masatake YAMATO <yamato@redhat.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
2013-03-20 17:56:58 -04:00
Amit Daniel Kachhap e6e238c38b thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:42 +08:00
Eduardo Valentin 8ab3e6a08a thermal: Use thermal zone device id in netlink messages
This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-16 10:46:46 +08:00
Zhang Rui d069015e26 Introduce THERMAL_TREND_RAISE_FULL and THERMAL_TREND_DROP_FULL
These two new thermal_trend types are used to tell the governor
that the temeprature is raising/dropping quickly.

Thermal cooling governors should handle this situation and make
proper decisions, e.g. set cooling state to upper/lower limit directly
instead of one step each time.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:22:36 +08:00
Zhang Rui 1f53ef17d3 Thermal: Fix DEFAULT_THERMAL_GOVERNOR
Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the
default governor selected in kernel config file.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-12-12 15:34:48 +08:00
Durgadoss R f2b4caafd4 Thermal: Add a notification API
This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R dc76548269 Thermal: Make thermal_cdev_update as a global function
This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:06 +08:00
Durgadoss R a4a15485fb Thermal: Add thermal governor registration APIs
This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:05 +08:00
Durgadoss R 50125a9b27 Thermal: Pass zone parameters as argument to tzd_register
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:59:57 +08:00
Durgadoss R ef87394791 Thermal: Add platform level information to thermal.h
This patch adds platform level information to thermal.h
by introducing two structures to hold:
 * bind parameters for a thermal zone,
 * zone level platform parameters

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Durgadoss R 9b4298a088 Thermal: Add get trend, get instance API's to thermal_sys
This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Durgadoss R 23064088d6 Thermal: Refactor thermal.h file
This patch rearranges the code in thermal.h file,
in the following order, so that it is easy to
read/maintain.
1. All #defines
2. All enums
3. All fops structures
4. All device structures
5. All function declarations

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Zhang Rui f4a821ce6e Thermal: Introduce locking for cdev.thermal_instances list.
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 908b9fb792 Thermal: Unify the code for both active and passive cooling
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui ce119f8325 Thermal: Introduce simple arbitrator for setting device cooling state
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui b5e4ae620b Thermal: List thermal_instance in thermal_cooling_device.
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 2d374139d5 Thermal: Rename thermal_zone_device.cooling_devices
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 1b7ddb840c Thermal: Remove tc1/tc2 in generic thermal layer.
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui 601f3d4242 Thermal: Introduce .get_trend() callback.
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui 9d99842f99 Thermal: set upper and lower limits
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Linus Torvalds 4b24ff7110 The tag contains just a few battery-related changes for v3.6. It's is
all pretty straightforward, except one thing.
 
 One of our patches added thermal support for power supply class, but
 thermal/ subsystem changed under our feet. We (well, Stephen, that is)
 caught the issue and it was decided[1] that I'd just delay the battery
 pull request, and then will fix it up by merging upstream back into
 battery tree at the specific commit.
 
 That's not all though: another[2] small fixup for thermal subsystem was
 needed to get rid of a warning in power supply subsystem (the warning
 was not drivers/power's "fault", the thermal registration function just
 needed a proper const annotation, which is also done by a small commit
 on top of the merge.
 
 So, to sum this up:
 - The 'master' branch of the battery tree was in the -next tree for
   weeks, was never rebased, altered etc. It should be all OK;
 - Although, for-v3.6 tag contains the 'master' branch + merge + the
   warning fix.
 
 [1] http://lkml.org/lkml/2012/6/19/23
 [2] http://lkml.org/lkml/2012/6/18/28
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Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6

Pull battery updates from Anton Vorontsov:
 "The tag contains just a few battery-related changes for v3.6.  It's is
  all pretty straightforward, except one thing.

  One of our patches added thermal support for power supply class, but
  thermal/ subsystem changed under our feet.  We (well, Stephen, that
  is) caught the issue and it was decided[1] that I'd just delay the
  battery pull request, and then will fix it up by merging upstream back
  into battery tree at the specific commit.

  That's not all though: another[2] small fixup for thermal subsystem
  was needed to get rid of a warning in power supply subsystem (the
  warning was not drivers/power's "fault", the thermal registration
  function just needed a proper const annotation, which is also done by
  a small commit on top of the merge.

  So, to sum this up:
   - The 'master' branch of the battery tree was in the -next tree for
     weeks, was never rebased, altered etc.  It should be all OK;
   - Although, for-v3.6 tag contains the 'master' branch + merge + the
     warning fix.

  [1] http://lkml.org/lkml/2012/6/19/23
  [2] http://lkml.org/lkml/2012/6/18/28"

* tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits)
  thermal: Constify 'type' argument for the registration routine
  olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries
  olpc-battery: Add VOLTAGE_MAX_DESIGN property
  charger-manager: Fix build break related to EXTCON
  lp8727_charger: Move header file into platform_data directory
  power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT
  bq27x00_battery: Add support for BQ27425 chip
  charger-manager: Set current limit of regulator for over current protection
  charger-manager: Use EXTCON Subsystem to detect charger cables for charging
  test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties
  test_power: Add support for USB AC source
  gpio-charger: Use cansleep version of gpio_set_value
  bq27x00_battery: Add support for power average and health properties
  sbs-battery: Don't trigger false supply_changed event
  twl4030_charger: Allow charger to control the regulator that feeds it
  twl4030_charger: Add backup-battery charging
  twl4030_charger: Fix some typos
  max17042_battery: Support CHARGE_COUNTER power supply attribute
  smb347-charger: Add constant charge and current properties
  power_supply: Add constant charge_current and charge_voltage properties
  ...
2012-07-31 18:08:25 -07:00
Anton Vorontsov 4b1bf5871f thermal: Constify 'type' argument for the registration routine
thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:

CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'

Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
2012-07-31 05:45:37 -07:00
Durgadoss R 27365a6c7d Thermal: Add Hysteresis attributes
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.

This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24 23:19:26 -04:00
Durgadoss R c56f5c0342 Thermal: Make Thermal trip points writeable
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24 23:17:20 -04:00
Jean Delvare 2d58d7ea91 thermal: Rename generate_netlink_event
It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-01-23 03:15:25 -05:00
Jean Delvare 31f5396ad3 thermal: make THERMAL_HWMON implementation fully internal
THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>.  Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:

* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
  implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
  disabled.

* This avoids breaking the thermal kABI in these cases too, which should
  make distributions happy.

The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone.  But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:57 -04:00
Rafael J. Wysocki af06216a8e ACPI: Fix build for CONFIG_NET unset
Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET.  However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-02-28 18:00:31 -08:00
Len Brown 156d821270 Merge branch 'misc' into release 2011-01-12 05:14:15 -05:00
R.Durgadoss 4cb1872870 thermal: Add event notification to thermal framework
This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.

Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-01-12 00:08:35 -05:00
Alan Cox 5b275ce270 thermal: make ops constant
And while touching that function definition do something about the disaster
of formatting there.

Signed-off-by: Alan Cox <alan@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2010-11-30 18:56:23 -05:00
Matthew Garrett 03a971a289 thermal: support forcing support for passive cooling
Due to poor thermal design or Linux driving hardware outside its thermal
envelope, some systems will reach critical temperature and shut down
under high load. This patch adds support for forcing a polling-based
passive trip point if the firmware doesn't provide one. The assumption
is made that the processor is the most practical means to reduce the
dynamic heat generation, so hitting the passive thermal limit will cause
the CPU to be throttled until the temperature stabalises around the
defined value.

UI is provided via a "passive" sysfs entry in the thermal zone
directory. It accepts a decimal value in millidegrees celsius, or "0" to
disable the functionality. Default behaviour is for this functionality
to be disabled.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-03-27 16:58:22 -04:00
Matthew Garrett b1569e99c7 ACPI: move thermal trip handling to generic thermal layer
The ACPI code currently carries its own thermal trip handling, meaning that
any other thermal implementation will need to reimplement it. Move the code
to the generic thermal layer.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-02-20 18:41:56 -05:00
Matthew Garrett 6503e5df08 thermal: use integers rather than strings for thermal values
The thermal API currently uses strings to pass values to userspace. This
makes it difficult to use from within the kernel. Change the interface
to use integers and fix up the consumers.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Thomas Renninger <trenn@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-02-20 10:52:37 -05:00
Rene Herman 16d7523973 thermal: Create CONFIG_THERMAL_HWMON=n
A bug in libsensors <= 2.10.6 is exposed
when this new hwmon I/F is enabled.
Create CONFIG_THERMAL_HWMON=n
until some time after libsensors 2.10.7 ships
so those users can run the latest kernel.

libsensors 3.x is already fixed -- those users
can use CONFIG_THERMAL_HWMON=y now.

Signed-off-by: Rene Herman <rene.herman@gmail.com>
Acked-by: Mark M. Hoffman <mhoffman@lightlink.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 19:25:42 -04:00
Zhang Rui e68b16abd9 thermal: add hwmon sysfs I/F
Add hwmon sys I/F for generic thermal driver.

Note: we have one hwmon class device for EACH TYPE of the thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:48:01 -04:00
Zhang, Rui 9ec732ff80 thermal: add new get_crit_temp callback
Add a new callback so that the generic thermal can get
the critical trip point info of a thermal zone,
which is needed for building the tempX_crit hwmon sysfs attribute.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:45:49 -04:00
Zhang Rui 63c4ec905d thermal: add the support for building the generic thermal as a module
Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:44:00 -04:00