Commit Graph

1187 Commits

Author SHA1 Message Date
Rocky Hao 4eca8cac25 thermal: rockchip: Support the RV1108 SoC in thermal driver
RV1108 SOC has one Temperature Sensor for CPU.

Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-10-31 19:32:13 -07:00
Mikko Perttunen 7afebede62 thermal: Add Tegra BPMP thermal sensor driver
On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
2017-10-19 16:31:47 +02:00
Arnd Bergmann 531fcdeb71 thermal: imx: add NVMEM dependency
The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable
module:

drivers/thermal/imx_thermal.o: In function `imx_thermal_probe':
imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'

This adds a Kconfig dependency to force it to be a module as well
when its dependency is loadable.

Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-10-18 10:24:13 +08:00
Arvind Yadav d344f3138a thermal/intel_powerclamp: pr_err()/pr_info() strings should end with newlines
pr_err()/pr_info() messages should end with a new-line to avoid
other messages being concatenated.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-10-17 15:56:06 +08:00
Leonard Crestez ae6215576d thermal: imx: Add support for reading OCOTP through nvmem
On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add support for reading those same
values through the nvmem API instead.

The older path is preserved for compatibility with older dts and because
it works correctly on imx6qdl chips.

Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-09-20 09:36:18 +08:00
Zhang Rui b32b5e14b4 Merge branches 'thermal-core', 'thermal-soc', 'thermal-intel' and 'const-thermal-zone-structure' into next 2017-09-08 11:20:04 +08:00
Zhang Rui 7a348799d5 Merge branches 'mediatek-mt2712', 'rockchip-rk3328' and 'uniphier-thermal' into thermal-soc 2017-09-08 11:17:53 +08:00
Zhang Rui 9ef08d7a44 Thermal: int3406_thermal: fix thermal sysfs I/F
there are three concepts represent backlight in int3406_thermal driver.
1. the raw brightness value from native graphics driver.
2. the percentage numbers from ACPI _BCL control method.
3. the consecutive numbers represent cooling states.

int3406_thermal driver
1. uses value from DDDL/DDPC as the lower/upper limit, which is consistent
   with ACPI _BCL control methods.
2. reads current and maximum brightness from the native graphics driver.
3. expose them to thermal sysfs I/F

This patch fixes the code that switches between the raw brightness value
and the cooling state, which results in bogus value in thermal sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-09-01 09:03:29 +08:00
Louis Yu 6760f3f74e thermal: mediatek: minor mtk_thermal.c cleanups
Move independent thermal module reset in the beginning.

Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-31 21:13:53 +08:00
Louis Yu 0a06899334 thermal: mediatek: extend calibration data for mt2712 chip
This patch adds support for mt2712 chip thermal calibration data
and calculation, and is compatible with the existing chips.

Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-31 21:13:47 +08:00
Louis Yu 6cf7f002e7 thermal: mediatek: add Mediatek thermal driver for mt2712
This patch adds support for mt2712 chip to mtk_thermal,
and integrate mt2712 into the same mediatek thermal driver.
MT2712 has only 1 bank and 4 sensors.

Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-31 21:13:43 +08:00
Ed Swierk 595536e0b2 thermal: intel_pch_thermal: Fix enable check on Broadwell-DE
Using the TSDSS flag to determine whether the thermal sensor is
enabled is problematic. Broadwell-DE (Xeon D-1500) does not support
dynamic shutdown and the TSDSS flag always reads 0 (contrary to the
current datasheet). Even on hardware supporting dynamic shutdown, the
driver does nothing to configure it, and the dynamic shutdown state
should not prevent the driver from loading. The ETS flag itself
indicates whether the thermal sensor is enabled, so use it instead of
the TSDSS flag on all hardware platforms.

Signed-off-by: Ed Swierk <eswierk@skyportsystems.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-15 14:32:58 +08:00
Rocky Hao eda519d5f7 thermal: rockchip: Support the RK3328 SOC in thermal driver
RK3328 SOC has one Temperature Sensor for CPU.

Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 16:21:38 +08:00
Julia Lawall 28e6c992eb thermal: bcm2835: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Acked-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:30 +08:00
Julia Lawall c3c04d9db2 thermal: exynos: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:30 +08:00
Julia Lawall e85c995ff9 thermal: zx2967: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:30 +08:00
Julia Lawall a0def10b69 thermal: rcar_gen3_thermal: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const.  Thus the thermal_zone_of_device_ops structure itself can
be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:29 +08:00
Julia Lawall c30d5d5913 thermal: qoriq: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:29 +08:00
Julia Lawall 3fe156f1dd thermal: hisilicon: constify thermal_zone_of_device_ops structures
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const.  Thus the thermal_zone_of_device_ops structure itself can
be const.

Done with the help of Coccinelle.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:38:28 +08:00
Christophe Jaillet 9d9ca1f9f0 thermal: core: Fix resources release in error paths in thermal_zone_device_register()
Reorder error handling code in order to fix some resources leaks in some
cases:
   - 'tz' would leak if 'thermal_zone_create_device_groups()' fails
   - memory allocated by 'thermal_zone_create_device_groups()' would leak
     if 'device_register()' fails

With this patch, we now have 2 error handling paths: one before
'device_register()', and one after it.
This is needed because some resources are released in 'thermal_release()'.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:34:07 +08:00
Christophe Jaillet 6a6cd25b58 thermal: core: Use the new 'thermal_zone_destroy_device_groups()' helper function
Simplify code by using the new 'thermal_zone_destroy_device_groups()'
helper function.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:34:00 +08:00
Christophe Jaillet 32fa5ba317 thermal: core: Add some new helper functions to free resources
In order to easily free resources allocated by
'thermal_zone_create_device_groups()' we need 2 new helper functions.

The first one undoes 'thermal_zone_create_device_groups()'.
The 2nd one undoes 'create_trip_attrs()', which is a function called by
'thermal_zone_create_device_groups()'.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 11:33:49 +08:00
Brian Bian 38e44da591 thermal: int3400_thermal: process "thermal table changed" event
Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.

Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:51:22 +08:00
Kunihiko Hayashi 86da439175 thermal: uniphier: add UniPhier thermal driver
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:49:52 +08:00
Sumeet Pawnikar 1820142f56 Thermal/int340x: Fix few typos and kernel warn message
This patch fix the few typos in trt structure. Also, update
kernel warn message for failed to get device name from acpi
handle.

Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 21:36:34 +08:00
Arvind Yadav 9b877de3e0 thermal: intel_pch_thermal: constify pci_device_id.
pci_device_id are not supposed to change at runtime. All functions
working with pci_device_id provided by <linux/pci.h> work with
const pci_device_id. So mark the non-const structs as const.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 21:31:43 +08:00
Icenowy Zheng 039f6cf5b5 thermal: core: fix some format issues on critical shutdown string
The critical shutdown notice string used to have some spaces missing,
which makes it not so pretty.

Add the spaces to satisfy usual English space rules.

Reported-by: Mingcong Bai <jeffbai@aosc.io>
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 17:18:26 +08:00
Arnd Bergmann 68fd77cf8a thermal: fix INTEL_SOC_DTS_IOSF_CORE dependencies
We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:

warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)

This adds a new depedency.

Fixes: 3a2419f865 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 17:14:26 +08:00
Ed Swierk 23c973f590 thermal: intel_pch_thermal: Read large temp values correctly
On all supported platforms, the TS Reading (TSR) field in the
Temperature (TEMP) register is 9 bits wide. Values above 0x100 (78
degrees C) are plausible, so don't mask out the topmost bit. And the
register itself is 16 bits wide, so use readw() rather than readl().

Signed-off-by: Ed Swierk <eswierk@skyportsystems.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 16:59:08 +08:00
Arvind Yadav a742fc10bd thermal: int340x_thermal: Constify attribute_group structures.
attribute_groups are not supposed to change at runtime. All functions
working with attribute_groups provided by <linux/sysfs.h> work
with const attribute_group. So mark the non-const structs as const.

File size before:
   text	   data	    bss	    dec	    hex	filename
   3152	   1096	      8	   4256	   10a0	processor_thermal_device.o

File size After adding 'const':
   text	   data	    bss	    dec	    hex	filename
   3216	   1032	      8	   4256	   10a0	processor_thermal_device.o

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 16:54:08 +08:00
Arvind Yadav 9fc2230f2e thermal: int340x: constify attribute_group structures.
attribute_groups are not supposed to change at runtime. All functions
working with attribute_groups provided by <linux/sysfs.h> work
with const attribute_group. So mark the non-const structs as const.

File size before:
   text	   data	    bss	    dec	    hex	filename
   1687	    592	      0	   2279	    8e7	int3400_thermal.o

File size After adding 'const':
   text	   data	    bss	    dec	    hex	filename
   1751	    528	      0	   2279	    8e7	int3400_thermal.o

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 16:54:01 +08:00
Linus Torvalds 4d25ec1966 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Improve thermal cpu_cooling interaction with cpufreq core.

   The cpu_cooling driver is designed to use CPU frequency scaling to
   avoid high thermal states for a platform. But it wasn't glued really
   well with cpufreq core.

   For example clipped-cpus is copied from the policy structure and its
   much better to use the policy->cpus (or related_cpus) fields directly
   as they may have got updated. Not that things were broken before this
   series, but they can be optimized a bit more.

   This series tries to improve interactions between cpufreq core and
   cpu_cooling driver and does some fixes/cleanups to the cpu_cooling
   driver. (Viresh Kumar)

 - A couple of fixes and cleanups in thermal core and imx, hisilicon,
   bcm_2835, int340x thermal drivers. (Arvind Yadav, Dan Carpenter,
   Sumeet Pawnikar, Srinivas Pandruvada, Willy WOLFF)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (24 commits)
  thermal: bcm2835: fix an error code in probe()
  thermal: hisilicon: Handle return value of clk_prepare_enable
  thermal: imx: Handle return value of clk_prepare_enable
  thermal: int340x: check for sensor when PTYP is missing
  Thermal/int340x: Fix few typos and kernel-doc style
  thermal: fix source code documentation for parameters
  thermal: cpu_cooling: Replace kmalloc with kmalloc_array
  thermal: cpu_cooling: Rearrange struct cpufreq_cooling_device
  thermal: cpu_cooling: 'freq' can't be zero in cpufreq_state2power()
  thermal: cpu_cooling: don't store cpu_dev in cpufreq_cdev
  thermal: cpu_cooling: get_level() can't fail
  thermal: cpu_cooling: create structure for idle time stats
  thermal: cpu_cooling: merge frequency and power tables
  thermal: cpu_cooling: get rid of 'allowed_cpus'
  thermal: cpu_cooling: OPPs are registered for all CPUs
  thermal: cpu_cooling: store cpufreq policy
  cpufreq: create cpufreq_table_count_valid_entries()
  thermal: cpu_cooling: use cpufreq_policy to register cooling device
  thermal: cpu_cooling: get rid of a variable in cpufreq_set_cur_state()
  thermal: cpu_cooling: remove cpufreq_cooling_get_level()
  ...
2017-07-14 13:12:32 -07:00
Linus Torvalds 6972b007ca Merge (most of) tag 'mfd-next-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
 "New Drivers:
   - Intel Cherry Trail Whiskey Cove PMIC
   - TI LP87565 PMIC

  New Device Support:
   - Add support for Cannonlake to intel-lpss-pci
   - Add support for Simatic IOT2000 to intel_quark_i2c_gpio

  New Functionality:
   - Add Regulator support (axp20x)

  Fix-ups:
   - Rework IRQ handling (intel_soc_pmic_bxtwc, rtsx_pcr, cros_ec)
   - Remove unused/unwelcome code (ipaq-micro, wm831x-core, da9062-core)
   - Provide deregistration on unbind (rn5t618)
   - Rework DT code/documentation (arizona)
   - Constify things (fsl-imx25-tsadc)
   - MAINTAINERS updates (DA9062/61)
   - Kconfig configuration adaptions (INTEL_SOC_PMIC, MFD_AXP20X_I2C)
   - Switch to DMI matching (intel_quark_i2c_gpio)
   - Provide an appropriate level of error checking (wm831x-{i2c,spi},
     twl4030-irq, tc6393xb)
   - Make use of devm_* (resource handling) calls (intel_soc_pmic_bxtwc,
     stm32-timers, atmel-flexcom, cros_ec, fsl-imx25-tsadc,
     exynos-lpass, palmas, qcom-spmi-pmic, smsc-ece1099,
     motorola-cpcap)"

[ Skipped the last commit in that series that added eight thousand
  lines of pointless repeated register definitions.  - Linus ]

* tag 'mfd-next-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (38 commits)
  mfd: Add LP87565 PMIC support
  mfd: cros_ec: Free IRQ on exit
  dt-bindings: vendor-prefixes: Add arctic to vendor prefix
  mfd: da9061: Fix to remove BBAT_CONT register from chip model
  mfd: da9061: Fix to remove BBAT_CONT register from chip model
  mfd: axp20x-i2c: Document that this must be builtin on x86
  mfd: Add Cherry Trail Whiskey Cove PMIC driver
  mfd: tc6393xb: Handle return value of clk_prepare_enable
  mfd: intel_quark_i2c_gpio: Add support for SIMATIC IOT2000 platform
  mfd: intel_quark_i2c_gpio: Use dmi_system_id table for retrieving frequency
  mfd: motorola-cpcap: Use devm_of_platform_populate()
  mfd: smsc-ece: Use devm_of_platform_populate()
  mfd: qcom-spmi-pmic: Use devm_of_platform_populate()
  mfd: palmas: Use devm_of_platform_populate()
  mfd: exynos: Use devm_of_platform_populate()
  mfd: fsl-imx25: Use devm_of_platform_populate()
  mfd: cros_ec: Use devm_of_platform_populate()
  mfd: atmel: Use devm_of_platform_populate()
  mfd: stm32-timers: Use devm_of_platform_populate()
  mfd: intel_soc_pmic: Select designware i2c-bus driver
  ...
2017-07-07 13:30:05 -07:00
Zhang Rui 5d72ed3567 Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into next 2017-07-05 15:01:06 +08:00
Zhang Rui 467aebee87 Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2017-07-05 14:51:32 +08:00
Linus Torvalds 362f6729cb USB/PHY patches for 4.13-rc1
Here is the big patchset of USB and PHY driver updates for 4.13-rc1.
 
 On the PHY side, they decided to move files around to "make things
 easier" in their tree.  Hopefully that wasn't a mistake, but in
 linux-next testing, we haven't had any reported problems.
 
 There's the usual set of gadget and xhci and musb updates in here as
 well, along with a number of smaller updates for a raft of different USB
 drivers.  Full details in the shortlog, nothing really major.
 
 All of these have been in linux-next for a while with no reported
 issues.
 
 Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'usb-4.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb

Pull USB/PHY updates from Greg KH:
 "Here is the big patchset of USB and PHY driver updates for 4.13-rc1.

  On the PHY side, they decided to move files around to "make things
  easier" in their tree. Hopefully that wasn't a mistake, but in
  linux-next testing, we haven't had any reported problems.

  There's the usual set of gadget and xhci and musb updates in here as
  well, along with a number of smaller updates for a raft of different
  USB drivers. Full details in the shortlog, nothing really major.

  All of these have been in linux-next for a while with no reported
  issues"

* tag 'usb-4.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb: (173 commits)
  Add USB quirk for HVR-950q to avoid intermittent device resets
  USB hub_probe: rework ugly goto-into-compound-statement
  usb: host: ohci-pxa27x: Handle return value of clk_prepare_enable
  USB: serial: cp210x: add ID for CEL EM3588 USB ZigBee stick
  usbip: Fix uninitialized variable bug in vhci
  usb: core: read USB ports from DT in the usbport LED trigger driver
  dt-bindings: leds: document new trigger-sources property
  usb: typec: ucsi: Add ACPI driver
  usb: typec: Add support for UCSI interface
  usb: musb: compress return logic into one line
  USB: serial: propagate late probe errors
  USB: serial: refactor port endpoint setup
  usb: musb: tusb6010_omap: Convert to DMAengine API
  ARM: OMAP2+: DMA: Add slave map entries for 24xx external request lines
  usb: musb: tusb6010: Handle DMA TX completion in DMA callback as well
  usb: musb: tusb6010_omap: Allocate DMA channels upfront
  usb: musb: tusb6010_omap: Create new struct for DMA data/parameters
  usb: musb: tusb6010_omap: Use one musb_ep_select call in tusb_omap_dma_program
  usb: musb: tusb6010: Add MUSB_G_NO_SKB_RESERVE to quirks
  usb: musb: Add quirk to avoid skb reserve in gadget mode
  ...
2017-07-03 19:30:55 -07:00
Dan Carpenter 1fe3854a83 thermal: bcm2835: fix an error code in probe()
This causes a static checker because we're passing a valid pointer to
PTR_ERR().  "err" is already the correct error code, so we can just
delete this line.

Fixes: bcb7dd9ef2 ("thermal: bcm2835: add thermal driver for bcm2835 SoC")
Acked-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-06-30 16:46:11 -07:00
Arvind Yadav 919054fdfc thermal: hisilicon: Handle return value of clk_prepare_enable
clk_prepare_enable() can fail here and we must check its return value.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-06-30 16:46:10 -07:00
Arvind Yadav e3bdc8d762 thermal: imx: Handle return value of clk_prepare_enable
clk_prepare_enable() can fail here and we must check its return value.

Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-06-30 16:41:55 -07:00
Srinivas Pandruvada 4ca0e75e46 thermal: int340x: check for sensor when PTYP is missing
For INT3403 sensor PTYP field is mandatory. But some platforms didn't
have this field for sensors. This cause load failure for int3403 driver.

This change checks for the presence of _TMP method and if present, then
treats this device as a sensor.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-06-29 10:53:38 +08:00
Sumeet Pawnikar 86326031e3 Thermal/int340x: Fix few typos and kernel-doc style
This patch fix the few typos in function header of
acpi_parse_trt. Also, fix the typo in kernel debug
message for acpi_parse_art.

Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-06-29 10:50:36 +08:00
Willy WOLFF 0d76d6e1ee thermal: fix source code documentation for parameters
Some parameters are not documented, or not present at all, in thermal
governors code.

Signed-off-by: Willy Wolff <willy.mh.wolff@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-06-29 10:46:31 +08:00
Kuppuswamy Sathyanarayanan c4949630fe mfd: intel_soc_pmic_bxtwc: Remove thermal second level IRQs
Since all second level thermal IRQs are consumed by the same
device(bxt_wcove_thermal), there is no need to expose them as separate
interrupts. We can just export only the first level IRQs for thermal and
let the device(bxt_wcove_thermal) driver handle the second level IRQs
based on thermal interrupt status register. Also, just using only the
first level IRQ will eliminate the bug involved in requesting only the
second level IRQ and not explicitly enable the first level IRQ. For
more info on this issue please read the details at,

https://lkml.org/lkml/2017/2/27/148

This patch also makes relevant change in bxt_wcove_thermal driver to use
only first level PMIC thermal IRQ.

Signed-off-by: Kuppuswamy Sathyanarayanan <sathyanarayanan.kuppuswamy@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Andy Shevchenko <andy.shevchenko@gmail.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
2017-06-19 15:44:29 +01:00
Johan Hovold ce046e5d9b thermal: max77620: fix pinmux conflict on reprobe
Use the new helper for reusing a device-tree node of another device
instead of managing the node references explicitly.

This also makes sure that the new of_node_reuse flag is set if the
device is ever reprobed, something which specifically now avoids driver
core from attempting to claim any pinmux resources already claimed by
the parent device.

Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-06-13 11:07:32 +02:00
Johan Hovold c592fafbdb thermal: max77620: fix device-node reference imbalance
The thermal child device reuses the parent MFD-device device-tree node
when registering a thermal zone, but did not take a reference to the
node.

This leads to a reference imbalance, and potential use-after-free, when
the node reference is dropped by the platform-bus device destructor
(once for the child and later again for the parent).

Fix this by dropping any reference already held to a device-tree node
and getting a reference to the parent's node which will be balanced on
reprobe or on platform-device release, whichever comes first.

Note that simply clearing the of_node pointer on probe errors and on
driver unbind would not allow the use of device-managed resources as
specifically thermal_zone_of_sensor_unregister() claims that a valid
device-tree node pointer is needed during deregistration (even if it
currently does not seem to use it).

Fixes: ec4664b3fd ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: stable <stable@vger.kernel.org>     # 4.9
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-06-13 11:07:32 +02:00
Christoph Hellwig 87085ff2e9 thermal: int340x_thermal: fix compile after the UUID API switch
Fix the compile after the switch to the UUID API in commit f4c19ac9
("thermal: int340x_thermal: Switch to use new generic UUID API").

Signed-off-by: Christoph Hellwig <hch@lst.de>
2017-06-09 16:37:31 +02:00
Andy Shevchenko f4c19ac9c2 thermal: int340x_thermal: Switch to use new generic UUID API
There are new types and helpers that are supposed to be used in
new code.

As a preparation to get rid of legacy types and API functions do
the conversion here.

The conversion fixes a potential bug in int340x_thermal as well
since we have to use memcmp() on binary data.

Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Christoph Hellwig <hch@lst.de>
2017-06-09 15:07:54 +02:00
Viresh Kumar f19b1a1735 thermal: cpu_cooling: Replace kmalloc with kmalloc_array
Checkpatch reports following:

WARNING: Prefer kmalloc_array over kmalloc with multiply
+	cpufreq_cdev->freq_table = kmalloc(sizeof(*cpufreq_cdev->freq_table) * i,

Fix that.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:33:04 -07:00
Viresh Kumar d72b401583 thermal: cpu_cooling: Rearrange struct cpufreq_cooling_device
This shrinks the size of the structure on arm64 by 8 bytes by avoiding
padding of 4 bytes at two places.

Also add missing doc comment for freq_table

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:33:02 -07:00
Viresh Kumar cb1b631864 thermal: cpu_cooling: 'freq' can't be zero in cpufreq_state2power()
The frequency table shouldn't have any zero frequency entries and so
such a check isn't required. Though it would be better to make sure
'state' is within limits.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:59 -07:00
Viresh Kumar 53ca1ece60 thermal: cpu_cooling: don't store cpu_dev in cpufreq_cdev
'cpu_dev' is used by only one function, get_static_power(), and it
wouldn't be time consuming to get the cpu device structure within it.
This would help removing cpu_dev from struct cpufreq_cooling_device.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:55 -07:00
Viresh Kumar da27f69d6a thermal: cpu_cooling: get_level() can't fail
The frequency passed to get_level() is returned by cpu_power_to_freq()
and it is guaranteed that get_level() can't fail.

Get rid of error code.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:52 -07:00
Viresh Kumar 81ee14da10 thermal: cpu_cooling: create structure for idle time stats
We keep two arrays for idle time stats and allocate memory for them
separately. It would be much easier to follow if we create an array of
idle stats structure instead and allocate it once.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:48 -07:00
Viresh Kumar 349d39dc57 thermal: cpu_cooling: merge frequency and power tables
The cpu_cooling driver keeps two tables:

- freq_table: table of frequencies in descending order, built from
  policy->freq_table.

- power_table: table of frequencies and power in ascending order, built
  from OPP table.

If the OPPs are used for the CPU device then both these tables are
actually built using the OPP core and should have the same frequency
entries. And there is no need to keep separate tables for this.

Lets merge them both.

Note that the new table is in descending order of frequencies and so the
'for' loops were required to be fixed at few places to make it work.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:44 -07:00
Viresh Kumar ba76dd9ddd thermal: cpu_cooling: get rid of 'allowed_cpus'
'allowed_cpus' is a copy of policy->related_cpus and can be replaced by
it directly. At some places we are only concerned about online CPUs and
policy->cpus can be used there.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:41 -07:00
Viresh Kumar 02bacb21c6 thermal: cpu_cooling: OPPs are registered for all CPUs
The OPPs are registered for all CPUs of a cpufreq policy now and we
don't need to run the loop in build_dyn_power_table(). Just check for
the policy->cpu and we should be fine.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:37 -07:00
Viresh Kumar b12b651949 thermal: cpu_cooling: store cpufreq policy
The cpufreq policy can be used by the cpu_cooling driver, lets store it
in the cpufreq_cooling_device structure.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:33 -07:00
Viresh Kumar 55d8529313 cpufreq: create cpufreq_table_count_valid_entries()
We need such a routine at two places already, lets create one.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:28 -07:00
Viresh Kumar 4d753aa7b6 thermal: cpu_cooling: use cpufreq_policy to register cooling device
The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the
frequency table, etc. Most of the callers of CPU cooling driver's
registration routines have the cpufreq policy with them, but they only
pass the policy->related_cpus cpumask. The __cpufreq_cooling_register()
routine then gets the policy by itself and uses it.

It would be much better if the callers can pass the policy instead
directly. This also fixes a basic design flaw, where the policy can be
freed while the CPU cooling driver is still active.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:24 -07:00
Viresh Kumar 18f301c934 thermal: cpu_cooling: get rid of a variable in cpufreq_set_cur_state()
'cpu' is used at only one place and there is no need to keep a separate
variable for it.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:20 -07:00
Viresh Kumar 3e08b2df12 thermal: cpu_cooling: remove cpufreq_cooling_get_level()
There is only one user of cpufreq_cooling_get_level() and that already
has pointer to the cpufreq_cdev structure. It can directly call
get_level() instead and we can get rid of cpufreq_cooling_get_level().

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:04 -07:00
Viresh Kumar 04bdbdf93c thermal: cpu_cooling: replace cool_dev with cdev
Objects of "struct thermal_cooling_device" are named a bit
inconsistently. Lets use cdev everywhere.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:31:59 -07:00
Viresh Kumar 1dea432a67 thermal: cpu_cooling: Name cpufreq cooling devices as cpufreq_cdev
Objects of "struct cpufreq_cooling_device" are named a bit
inconsistently. Lets use cpufreq_cdev everywhere. Also note that the
lists containing such devices is renamed similarly too.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:31:55 -07:00
Viresh Kumar fb8ea30821 thermal: cpu_cooling: rearrange globals
Just to make it look better.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:31:49 -07:00
Viresh Kumar 289d72afdd thermal: cpu_cooling: Avoid accessing potentially freed structures
After the lock is dropped, it is possible that the cpufreq_dev gets
freed before we call get_level() and that can cause kernel to crash.

Drop the lock after we are done using the structure.

Cc: 4.2+ <stable@vger.kernel.org> # 4.2+
Fixes: 02373d7c69 ("thermal: cpu_cooling: fix lockdep problems in cpu_cooling")
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:31:05 -07:00
Jon Mason a54c51863e thermal: broadcom: ns-thermal: default on iProc SoCs
Tweak the Kconfig description to mention support for NSP and make the
default on for iProc based platforms.

Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-23 20:09:34 -07:00
Markus Elfring 8b8656d64c ti-soc-thermal: Fix a typo in a comment line
Add a missing character in this description for a function.

Acked-by: Keerthy <j-keerthy@ti.com>
Tested-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-23 20:07:32 -07:00
Markus Elfring 57e521151b ti-soc-thermal: Delete error messages for failed memory allocations in ti_bandgap_build()
The script "checkpatch.pl" pointed information out like the following.

WARNING: Possible unnecessary 'out of memory' message

Thus remove such statements here.

Link: http://events.linuxfoundation.org/sites/events/files/slides/LCJ16-Refactor_Strings-WSang_0.pdf
Acked-by: Keerthy <j-keerthy@ti.com>
Tested-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-23 20:07:14 -07:00
Markus Elfring 748c23d886 ti-soc-thermal: Use devm_kcalloc() in ti_bandgap_build()
A multiplication for the size determination of a memory allocation
indicated that an array data structure should be processed.
Thus use the corresponding function "devm_kcalloc".

This issue was detected by using the Coccinelle software.

Acked-by: Keerthy <j-keerthy@ti.com>
Tested-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-23 20:06:56 -07:00
Colin Ian King c4b379d064 thermal: core: make thermal_emergency_poweroff static
Making thermal_emergency_poweroff static fixes sparse warning:

  drivers/thermal/thermal_core.c:6: warning: symbol
  'thermal_emergency_poweroff' was not declared. Should it be static?

Fixes: ef1d87e06a ("thermal: core: Add a back up thermal shutdown mechanism")
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Colin Ian King <colin.king@canonical.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-23 20:03:35 -07:00
Masahiro Yamada 0e77488867 thermal: qoriq: remove useless call for of_thermal_get_trip_points()
Building this driver with W=1 reports:
  warning: variable 'trip' set but not used [-Wunused-but-set-variable]

The call for of_thermal_get_trip_points() is useless.

Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-23 20:02:03 -07:00
Linus Torvalds 6a776e47a0 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Fix a problem where orderly_shutdown() is called for multiple times
   due to multiple critical overheating events raised in a short period
   by platform thermal driver. (Keerthy)

 - Introduce a backup thermal shutdown mechanism, which invokes
   kernel_power_off()/emergency_restart() directly, after
   orderly_shutdown() being issued for certain amount of time(specified
   via Kconfig). This is useful in certain conditions that userspace may
   be unable to power off the system in a clean manner and leaves the
   system in a critical state, like in the middle of driver probing
   phase. (Keerthy)

 - Introduce a new interface in thermal devfreq_cooling code so that the
   driver can provide more precise data regarding actual power to the
   thermal governor every time the power budget is calculated. (Lukasz
   Luba)

 - Introduce BCM 2835 soc thermal driver and northstar thermal driver,
   within a new sub-folder. (Rafał Miłecki)

 - Introduce DA9062/61 thermal driver. (Steve Twiss)

 - Remove non-DT booting on TI-SoC driver. Also add support to fetching
   coefficients from DT. (Keerthy)

 - Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)

 - Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
   Brian Bian)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
  thermal: core: Add a back up thermal shutdown mechanism
  thermal: core: Allow orderly_poweroff to be called only once
  Thermal: Intel SoC DTS: Change interrupt request behavior
  trace: thermal: add another parameter 'power' to the tracing function
  thermal: devfreq_cooling: add new interface for direct power read
  thermal: devfreq_cooling: refactor code and add get_voltage function
  thermal: mt8173: minor mtk_thermal.c cleanups
  thermal: bcm2835: move to the broadcom subdirectory
  thermal: broadcom: ns: specify myself as MODULE_AUTHOR
  thermal: da9062/61: Thermal junction temperature monitoring driver
  Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
  thermal: broadcom: add Northstar thermal driver
  dt-bindings: thermal: add support for Broadcom's Northstar thermal
  thermal: bcm2835: add thermal driver for bcm2835 SoC
  dt-bindings: Add thermal zone to bcm2835-thermal example
  thermal: rcar_gen3_thermal: add suspend and resume support
  thermal: rcar_gen3_thermal: store device match data in private structure
  thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
  thermal: rcar_gen3_thermal: record and check number of TSCs found
  thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
  ...
2017-05-12 11:58:45 -07:00
Zhang Rui cb15c81a0c Merge branch 'thermal-soc' into next 2017-05-06 19:31:19 +08:00
Zhang Rui e4cb5bb286 Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2017-05-06 19:30:53 +08:00
Zhang Rui bb4d5e38de Merge branch 'backup-thermal-shutdown' into next 2017-05-05 20:30:09 +08:00
Zhang Rui a6128f47f7 Merge branches 'thermal-core' and 'thermal-intel' into next 2017-05-05 20:30:03 +08:00
Keerthy ef1d87e06a thermal: core: Add a back up thermal shutdown mechanism
orderly_poweroff is triggered when a graceful shutdown
of system is desired. This may be used in many critical states of the
kernel such as when subsystems detects conditions such as critical
temperature conditions. However, in certain conditions in system
boot up sequences like those in the middle of driver probes being
initiated, userspace will be unable to power off the system in a clean
manner and leaves the system in a critical state. In cases like these,
the /sbin/poweroff will return success (having forked off to attempt
powering off the system. However, the system overall will fail to
completely poweroff (since other modules will be probed) and the system
is still functional with no userspace (since that would have shut itself
off).

However, there is no clean way of detecting such failure of userspace
powering off the system. In such scenarios, it is necessary for a backup
workqueue to be able to force a shutdown of the system when orderly
shutdown is not successful after a configurable time period.

Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05 16:01:45 +08:00
Keerthy e441fd6866 thermal: core: Allow orderly_poweroff to be called only once
thermal_zone_device_check --> thermal_zone_device_update -->
handle_thermal_trip --> handle_critical_trips --> orderly_poweroff

The above sequence happens every 250/500 mS based on the configuration.
The orderly_poweroff function is getting called every 250/500 mS.
With a full fledged file system it takes at least 5-10 Seconds to
power off gracefully.

In that period due to the thermal_zone_device_check triggering
periodically the thermal work queues bombard with
orderly_poweroff calls multiple times eventually leading to
failures in gracefully powering off the system.

Make sure that orderly_poweroff is called only once.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05 16:01:44 +08:00
Brian Bian 68b2440b2a Thermal: Intel SoC DTS: Change interrupt request behavior
The interrupt request call in Intel SoC DTS driver may fail if
there is no underlying BIOS support. However, the user space
thermal daemon can still use the thermal zones created by the
SoC DTS driver in polling mode, therefore, instead of bailing
out on interrupt request failures, it is better just to log
a warning message and continue the init process.

Signed-off-by: Brian Bian <brian.bian@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05 16:00:10 +08:00
Lukasz Luba 771ffa14ea trace: thermal: add another parameter 'power' to the tracing function
This patch adds another parameter to the trace function:
trace_thermal_power_devfreq_get_power().

In case when we call directly driver's code for the real power,
we do not have static/dynamic_power values. Instead we get total
power in the '*power' value. The 'static_power' and
'dynamic_power' are set to 0.

Therefore, we have to trace that '*power' value in this scenario.

CC: Steven Rostedt <rostedt@goodmis.org>
CC: Ingo Molnar <mingo@redhat.com>
CC: Zhang Rui <rui.zhang@intel.com>
CC: Eduardo Valentin <edubezval@gmail.com>
Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
2017-05-05 15:54:45 +08:00
Lukasz Luba 2be83da85a thermal: devfreq_cooling: add new interface for direct power read
This patch introduces a new interface for device drivers connected to
devfreq_cooling in the thermal framework: get_real_power().

Some devices have more sophisticated methods (like power counters)
to approximate the actual power that they use.
In the previous implementation we had a pre-calculated power
table which was then scaled by 'utilization'
('busy_time' and 'total_time' taken from devfreq 'last_status').

With this new interface the driver can provide more precise data
regarding actual power to the thermal governor every time the power
budget is calculated. We then use this value and calculate the real
resource utilization scaling factor.

Reviewed-by: Chris Diamand <chris.diamand@arm.com>
Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
2017-05-05 15:54:45 +08:00
Lukasz Luba e34cab4cd1 thermal: devfreq_cooling: refactor code and add get_voltage function
Move the code which gets the voltage for a given frequency.
This code will be resused in few places.

Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
2017-05-05 15:54:45 +08:00
Linus Torvalds d26f552ebb - New Drivers
- Freescale MXS Low Resolution ADC
    - Freescale i.MX23/i.MX28 LRADC touchscreen
    - Motorola CPCAP Power Button
    - TI LMU (Lighting Management Unit)
    - Atmel SMC (Static Memory Controller)
 
  - New Device Support
    - Add support for X-Powers AXP803 to axp20x
    - Add support for Dialog Semi DA9061 to da9062-core
    - Add support for Intel Cougar Mountain to lpc_ich
    - Add support for Intel Gemini Lake to lpc_ich
 
  - New Functionality
    - Add Device Tree support; wm831x-*, axp20x, ti-lmu, da9062, sun4i-gpadc
    - Add IRQ sense support; motorola-cpcap
    - Add ACPI support; cros_ec
    - Add Reset support; altera-a10sr
    - Add ADC support; axp20x
    - Add AC Power support; axp20x
    - Add Runtime PM support; atmel-ebi, exynos-lpass
    - Add Battery Power Supply support; axp20x
    - Add Clock support; exynos-lpass, hi655x-pmic
 
  - Fix-ups
    - Implicitly specify required headers; motorola-cpcap, intel_soc_pmic_bxtwc
    - Add .remove() method; stm32-timers, exynos-lpass
    - Remove unused code; intel_soc_pmic_core, intel-lpss-acpi, ipaq-micro, atmel-smc, menelaus
    - Rename variables for clarity; axp20x
    - Convert pr_warning() to pr_warn(); db8500-prcmu, sta2x11-mfd, twl4030-power
    - Improve formatting; arizona-core, axp20x
    - Use raw_spinlock_*() variants; asic3, t7l66xb, tc6393xb
    - Simplify/refactor code; arizona-core, atmel-ebi
    - Improve error checking; intel_soc_pmic_core
 
  - Bug Fixes
    - Ensure OMAP3630/3730 boards can successfully reboot; twl4030-power
    - Correct max-register value; stm32-timers
    - Extend timeout to account for clock stretching; cros_ec_spi
    - Use correct IRQ trigger type; motorola-cpcap
    - Fix bad use of IRQ sense register; motorola-cpcap
    - Logic error "||" should be "&&"; mxs-lradc-ts
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Merge tag 'mfd-next-4.12' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd

Pull MFD updates from Lee Jones:
 "New Drivers:
   - Freescale MXS Low Resolution ADC
   - Freescale i.MX23/i.MX28 LRADC touchscreen
   - Motorola CPCAP Power Button
   - TI LMU (Lighting Management Unit)
   - Atmel SMC (Static Memory Controller)

  New Device Support:
   - Add support for X-Powers AXP803 to axp20x
   - Add support for Dialog Semi DA9061 to da9062-core
   - Add support for Intel Cougar Mountain to lpc_ich
   - Add support for Intel Gemini Lake to lpc_ich

  New Functionality:
   - Add Device Tree support; wm831x-*, axp20x, ti-lmu, da9062, sun4i-gpadc
   - Add IRQ sense support; motorola-cpcap
   - Add ACPI support; cros_ec
   - Add Reset support; altera-a10sr
   - Add ADC support; axp20x
   - Add AC Power support; axp20x
   - Add Runtime PM support; atmel-ebi, exynos-lpass
   - Add Battery Power Supply support; axp20x
   - Add Clock support; exynos-lpass, hi655x-pmic

  Fix-ups:
   - Implicitly specify required headers; motorola-cpcap, intel_soc_pmic_bxtwc
   - Add .remove() method; stm32-timers, exynos-lpass
   - Remove unused code; intel_soc_pmic_core, intel-lpss-acpi, ipaq-micro, atmel-smc, menelaus
   - Rename variables for clarity; axp20x
   - Convert pr_warning() to pr_warn(); db8500-prcmu, sta2x11-mfd, twl4030-power
   - Improve formatting; arizona-core, axp20x
   - Use raw_spinlock_*() variants; asic3, t7l66xb, tc6393xb
   - Simplify/refactor code; arizona-core, atmel-ebi
   - Improve error checking; intel_soc_pmic_core

  Bug Fixes:
   - Ensure OMAP3630/3730 boards can successfully reboot; twl4030-power
   - Correct max-register value; stm32-timers
   - Extend timeout to account for clock stretching; cros_ec_spi
   - Use correct IRQ trigger type; motorola-cpcap
   - Fix bad use of IRQ sense register; motorola-cpcap
   - Logic error "||" should be "&&"; mxs-lradc-ts"

* tag 'mfd-next-4.12' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (79 commits)
  input: touchscreen: mxs-lradc: || vs && typos
  dt-bindings: Add AXP803's regulator info
  mfd: axp20x: Support AXP803 variant
  dt-bindings: Add device tree binding for X-Powers AXP803 PMIC
  dt-bindings: Make AXP20X compatible strings one per line
  mfd: intel_soc_pmic_core: Fix unchecked return value
  mfd: menelaus: Remove obsolete local_irq_disable() and local_irq_enable()
  mfd: omap-usb-tll: Configure ULPIAUTOIDLE
  mfd: omap-usb-tll: Fix inverted bit use for USB TLL mode
  mfd: palmas: Fixed spelling mistake in error message
  mfd: lpc_ich: Add support for Intel Gemini Lake SoC
  mfd: hi655x: Add the clock cell to provide WiFi and Bluetooth
  mfd: intel_soc_pmic: Fix a mess with compilation units
  mfd: exynos-lpass: Add runtime PM support
  mfd: exynos-lpass: Add missing remove() function
  mfd: exynos-lpass: Add support for clocks
  mfd: exynos-lpass: Remove pad retention control
  iio: adc: add support for X-Powers AXP20X and AXP22X PMICs ADCs
  mfd: cpcap: Fix bad use of IRQ sense register
  mfd: cpcap: Use ack_invert interrupts
  ...
2017-05-03 12:16:25 -07:00
Andy Shevchenko b5238b4185 mfd: intel_soc_pmic: Fix a mess with compilation units
Crystal Cove and Whiskey Cove are two different PMICs which are
installed on Intel Atom SoC based platforms.

Moreover there are two independent drivers that by some reason were
supposed (*) to get into one kernel module.

Fix the mess by clarifying Kconfig option for Crystal Cove and split
Whiskey Cove out of it.

(*) It looks like the configuration was never tested with
    INTEL_SOC_PMIC=n. The line in Makefile is actually wrong.

Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI)
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
2017-04-27 11:54:42 +01:00
Dawei Chien 05d7839aa2 thermal: mt8173: minor mtk_thermal.c cleanups
If thermal bank with 4 sensors, thermal driver should read TEMP_MSR3.

However, currently thermal driver would not read TEMP_MSR3 since mt8173
thermal driver only use 3 sensors on each thermal bank at the same time,
so this patch would not effect temperature.
Only if mt mt8173 thermal driver use 4 sensors on any thermal bank, would
read third sensor two times, and lose fourth sensor of vale.

cc: stable@vger.kernel.org
Fixes: b7cf005373 ("thermal: Add Mediatek thermal driver for mt2701.")
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23 09:01:42 -07:00
Rafał Miłecki 6892cf07e7 thermal: bcm2835: move to the broadcom subdirectory
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.

Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23 08:55:37 -07:00
Rafał Miłecki cb9b323b53 thermal: broadcom: ns: specify myself as MODULE_AUTHOR
Just in case someone uses modinfo to find (blame) me.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23 08:54:52 -07:00
Rafael J. Wysocki c97ad0fc4f Merge back cpufreq core changes for v4.12. 2017-04-15 00:23:36 +02:00
Steve Twiss 608567aac3 thermal: da9062/61: Thermal junction temperature monitoring driver
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.

If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.

The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).

This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.

When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.

This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:48:03 -07:00
Rafał Miłecki a94cb7eeec thermal: broadcom: add Northstar thermal driver
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:45:19 -07:00
Stefan Wahren bcb7dd9ef2 thermal: bcm2835: add thermal driver for bcm2835 SoC
Add basic thermal driver for bcm2835 SoC.

This driver currently make sure that tsense HW block is set up
correctly.

Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-01 09:30:28 -07:00
Niklas Söderlund 75f78d6d9e thermal: rcar_gen3_thermal: add suspend and resume support
To restore operation it's easiest to reinitialise all TSCs. In order to
do this the current trip window needs to be stored in the TSC structure
so that it can be restored upon resume.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:49:03 -07:00
Niklas Söderlund cc4d072b66 thermal: rcar_gen3_thermal: store device match data in private structure
The device match data needs to be accessible outside the probe function,
store it in the private data structure.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:48:03 -07:00
Niklas Söderlund 7d4b269776 thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
Enable hardware trip points by implementing the set_trips callback. The
thermal core will take care of setting the initial trip point window and
to update it once the driver reports a TSC has moved outside it.

The interrupt structure for this device is a bit odd. There is not a
dedicated IRQ for each TSC, instead the interrupts are shared between
all TSCs. IRQn is fired if the temp monitored in IRQTEMPn is reached in
any of the TSCs, example IRQ3 is fired if temperature in IRQTEMP3 is
reached in either TSC0, TSC1 or TSC2.

For this reason the usage of interrupts in this driver is an all-on or
all-off design. When an interrupt happens all TSCs are checked and all
thermal zones are updated. This could be refined to be more fine grained
but the thermal core takes care of only updating the thermal zones that
have left their trip point window.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:45:38 -07:00
Niklas Söderlund 97dad1f1d2 thermal: rcar_gen3_thermal: record and check number of TSCs found
Record how many TSCs are found in struct rcar_gen3_thermal_priv, this is
needed to be able to add hardware interrupts for trip points later. Also
add a check to make sure at least one TSC is found.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:42:42 -07:00
Niklas Söderlund d51546c0db thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
Move the check for a TSC resource before allocating memory for a new
TSC. If no TSC is found there is little point in allocating memory for
it.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:41:48 -07:00
Niklas Söderlund 100cfbcf25 thermal: rcar_gen3_thermal: remove unneeded mutex
There is no point in protecting a register read with a lock. This is
most likely a leftover from when the driver was reworked before being
submitted for upstream.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:40:46 -07:00
Niklas Söderlund 78aefd2d59 thermal: rcar_gen3_thermal: add delay in .thermal_init on r8a7796
The .thermal_init needs to be delayed a short amount of time to allow
for the TEMP register to contain something useful. If it's not delayed
these warnings are common during boot:

thermal thermal_zone0: failed to read out thermal zone (-5)
thermal thermal_zone1: failed to read out thermal zone (-5)
thermal thermal_zone2: failed to read out thermal zone (-5)

The warnings are triggered by the first call to .get_temp() while the
TEMP register contains 0 and rcar_gen3_thermal_get_temp() returns -EIO
since a TEMP value of 0 will result in a temperature reading which is
out of specifications.

This should have been done in the initial commit which adds the driver
as the same issue was found and corrected for r8a7795.

Fixes: 564e73d283 ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30 21:39:09 -07:00
Keerthy b263b473bf thermal: ti-soc-thermal: Remove redundant code
ti_thermal_expose_sensor always takes the
devm_thermal_zone_of_sensor_register call for registration
with the device tree nodes present for all the bandgap sensors
for omap3/4/5 and dra7 family. There are large chunks of unused
code. Removing all of them.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29 22:15:18 -07:00
Keerthy 004f772871 thermal: ti-soc-thermal: Remove redundant constants
Now that slope and offset data are being passed from
device tree no need to populate in driver data.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29 22:14:51 -07:00