This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.
The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.
In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch changes the behavior of TI SoC thermal driver
when there is a PCB thermal zone.
Instead of reporting an error code when reading from
PCB temperature sensor fails, this patch will make
the driver attempt to compose the hotspot extrapolation
based on bandgap readings only.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Workaround to compute thermal trend even when update interval
is not set. This patch will ensure to compute the thermal trend
when bandgap counter delay is not set.
Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.
Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.
Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table
Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.
All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL()
macro. This macro can lead to dangerous results, like returning
success (0) during a failure scenario (NULL pointer handling).
For this reason this patch is changing the driver after
revisiting the code. These are the cases:
i. For cases in which IS_ERR_OR_NULL() is used for checking
return values of functions that returns either PTR_ERR()
or a valid pointer, it has been translated to IS_ERR() check only.
ii. For cases that a NULL check is still needed, it has been
translated to if (!ptr || IS_ERR(ptr)).
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In order to read the history buffer, it is required to
freeze BG FSM. This patch adds the missing piece of code
to freeze the FSM and also a contention area to avoid
other parts of the code to access the DTEMPs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Eduardo Valentin