This patch fixes the following mutex and NULL pointer
problems in thermal_sys.c:
* mutex_unlock fix in update_temperature function
* mutex_unlock fix in bind_cdev function
* Correct early return to continue in bind_cdev function
* NULL check fix in bind_cdev function
* NULL check fix in bind_tz function
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Reported-by: Sedat Dilek <sedat.dilek@gmail.com>
Reported-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Sedat Dilek <sedat.dilek@gmail.com>
Signed-off-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch removes the throttling logic out of
thermal_sys.c; also refactors the code into smaller
functions so that are easy to read/maintain.
* Seperates the handling of critical and non-critical trips
* Re-arranges the set_polling and device_check methods, so
that all related functions are arranged in one place.
* Removes the 'do_update' and 'trip_update' method, as part
of moving the throttling logic out of thermal_sys.c
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.
* If we do not have platform data and do not have
.bind defined, do not bind.
* If we do not have platform data but .bind is
defined, then use tz->ops->bind.
* If we have platform data, use it to create binding.
The same logic sequence is followed for unbind also.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a policy sysfs attribute to a thermal zone.
This attribute denotes the throttling governor used for the
zone. This is a RW attribute.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
* get_tz_trend: obtain the trend of the given thermal zone
* get_thermal_instance: obtain the instance corresponding
to the given tz, cdev and the trip point.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
To avoid name conflicts:
drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined
While at it, also make the other names more consistent and add
parentheses.
[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.
This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
temp_crit.name and temp_input.name have a length of 16 bytes. Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses. Replace it with sizeof().
Addresses Coverity #115679
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.
Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.
thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.
This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is
1. if the temperature is higher than a trip point,
a. if the trend is THERMAL_TREND_RAISING, use higher cooling
state for this trip point
b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
state for this trip point
2. if the temperature is lower than a trip point, use lower
cooling state for this trip point.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.
So We introduce .get_trend() as a more general solution.
For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.
To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.
Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.
Next patch will set these to real values.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
Convert delayed_work users doing cancel_delayed_work() followed by
queue_delayed_work() to mod_delayed_work().
Most conversions are straight-forward. Ones worth mentioning are,
* drivers/edac/edac_mc.c: edac_mc_workq_setup() converted to always
use mod_delayed_work() and cancel loop in
edac_mc_reset_delay_period() is dropped.
* drivers/platform/x86/thinkpad_acpi.c: No need to remember whether
watchdog is active or not. @fan_watchdog_active and related code
dropped.
* drivers/power/charger-manager.c: Seemingly a lot of
delayed_work_pending() abuse going on here.
[delayed_]work_pending() are unsynchronized and racy when used like
this. I converted one instance in fullbatt_handler(). Please
conver the rest so that it invokes workqueue APIs for the intended
target state rather than trying to game work item pending state
transitions. e.g. if timer should be modified - call
mod_delayed_work(), canceled - call cancel_delayed_work[_sync]().
* drivers/thermal/thermal_sys.c: thermal_zone_device_set_polling()
simplified. Note that round_jiffies() calls in this function are
meaningless. round_jiffies() work on absolute jiffies not delta
delay used by delayed_work.
v2: Tomi pointed out that __cancel_delayed_work() users can't be
safely converted to mod_delayed_work(). They could be calling it
from irq context and if that happens while delayed_work_timer_fn()
is running, it could deadlock. __cancel_delayed_work() users are
dropped.
Signed-off-by: Tejun Heo <tj@kernel.org>
Acked-by: Henrique de Moraes Holschuh <hmh@hmh.eng.br>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Acked-by: Anton Vorontsov <cbouatmailru@gmail.com>
Acked-by: David Howells <dhowells@redhat.com>
Cc: Tomi Valkeinen <tomi.valkeinen@ti.com>
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Jiri Kosina <jkosina@suse.cz>
Cc: Doug Thompson <dougthompson@xmission.com>
Cc: David Airlie <airlied@linux.ie>
Cc: Roland Dreier <roland@kernel.org>
Cc: "John W. Linville" <linville@tuxdriver.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Len Brown <len.brown@intel.com>
Cc: "J. Bruce Fields" <bfields@fieldses.org>
Cc: Johannes Berg <johannes@sipsolutions.net>
all pretty straightforward, except one thing.
One of our patches added thermal support for power supply class, but
thermal/ subsystem changed under our feet. We (well, Stephen, that is)
caught the issue and it was decided[1] that I'd just delay the battery
pull request, and then will fix it up by merging upstream back into
battery tree at the specific commit.
That's not all though: another[2] small fixup for thermal subsystem was
needed to get rid of a warning in power supply subsystem (the warning
was not drivers/power's "fault", the thermal registration function just
needed a proper const annotation, which is also done by a small commit
on top of the merge.
So, to sum this up:
- The 'master' branch of the battery tree was in the -next tree for
weeks, was never rebased, altered etc. It should be all OK;
- Although, for-v3.6 tag contains the 'master' branch + merge + the
warning fix.
[1] http://lkml.org/lkml/2012/6/19/23
[2] http://lkml.org/lkml/2012/6/18/28
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Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6
Pull battery updates from Anton Vorontsov:
"The tag contains just a few battery-related changes for v3.6. It's is
all pretty straightforward, except one thing.
One of our patches added thermal support for power supply class, but
thermal/ subsystem changed under our feet. We (well, Stephen, that
is) caught the issue and it was decided[1] that I'd just delay the
battery pull request, and then will fix it up by merging upstream back
into battery tree at the specific commit.
That's not all though: another[2] small fixup for thermal subsystem
was needed to get rid of a warning in power supply subsystem (the
warning was not drivers/power's "fault", the thermal registration
function just needed a proper const annotation, which is also done by
a small commit on top of the merge.
So, to sum this up:
- The 'master' branch of the battery tree was in the -next tree for
weeks, was never rebased, altered etc. It should be all OK;
- Although, for-v3.6 tag contains the 'master' branch + merge + the
warning fix.
[1] http://lkml.org/lkml/2012/6/19/23
[2] http://lkml.org/lkml/2012/6/18/28"
* tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits)
thermal: Constify 'type' argument for the registration routine
olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries
olpc-battery: Add VOLTAGE_MAX_DESIGN property
charger-manager: Fix build break related to EXTCON
lp8727_charger: Move header file into platform_data directory
power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT
bq27x00_battery: Add support for BQ27425 chip
charger-manager: Set current limit of regulator for over current protection
charger-manager: Use EXTCON Subsystem to detect charger cables for charging
test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties
test_power: Add support for USB AC source
gpio-charger: Use cansleep version of gpio_set_value
bq27x00_battery: Add support for power average and health properties
sbs-battery: Don't trigger false supply_changed event
twl4030_charger: Allow charger to control the regulator that feeds it
twl4030_charger: Add backup-battery charging
twl4030_charger: Fix some typos
max17042_battery: Support CHARGE_COUNTER power supply attribute
smb347-charger: Add constant charge and current properties
power_supply: Add constant charge_current and charge_voltage properties
...
thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:
CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'
Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.
This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Basically without this patch changing the mode of thermal zone
is not possible as wrong string size is passed to strncmp.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
Use the current logging style.
Remove PREFIX, add pr_fmt, convert the printks. All dmesg output now
prefixed with "thermal_sys: ".
Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
Just a few tidies to make it more like most kernel sources.
A couple of long lines still remain.
Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
These don't add any value as they are used only once and the surrounding
code uses similar variable.
Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
Line continations are not necessary in function calls or statements.
Remove them.
Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
With CONFIG_NET=n:
drivers/thermal/thermal_sys.c:63: warning: 'thermal_event_seqnum' defined but not used
Move 'thermal_event_seqnum' definition inside the '#ifdef CONFIG_NET'
[akpm@linux-foundation.org: make thermal_event_seqnum local to generate_netlink_event()]
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Cc: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
The thermal driver should use a freezable workqueue to schedule
polling to prevent thermal_zone_device_update() from being run
during system suspend, when the devices it relies on may be inactive.
Make it use the system freezable workqueue for this purpose.
Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Signed-off-by: Len Brown <len.brown@intel.com>
THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:
* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
disabled.
* This avoids breaking the thermal kABI in these cases too, which should
make distributions happy.
The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone. But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
We'll soon need to reuse it.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
This patch fixes two minor bugs in thermal_sys:
(a) The flow of goto's in thermal_hwmon_add_sysfs.
(b) Remove the temp*_crit only if there is a get_crit_temp defined, in
thermal_remove_hwmon_sysfs.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.
Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.
Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.
Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
And while touching that function definition do something about the disaster
of formatting there.
Signed-off-by: Alan Cox <alan@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
percpu.h is included by sched.h and module.h and thus ends up being
included when building most .c files. percpu.h includes slab.h which
in turn includes gfp.h making everything defined by the two files
universally available and complicating inclusion dependencies.
percpu.h -> slab.h dependency is about to be removed. Prepare for
this change by updating users of gfp and slab facilities include those
headers directly instead of assuming availability. As this conversion
needs to touch large number of source files, the following script is
used as the basis of conversion.
http://userweb.kernel.org/~tj/misc/slabh-sweep.py
The script does the followings.
* Scan files for gfp and slab usages and update includes such that
only the necessary includes are there. ie. if only gfp is used,
gfp.h, if slab is used, slab.h.
* When the script inserts a new include, it looks at the include
blocks and try to put the new include such that its order conforms
to its surrounding. It's put in the include block which contains
core kernel includes, in the same order that the rest are ordered -
alphabetical, Christmas tree, rev-Xmas-tree or at the end if there
doesn't seem to be any matching order.
* If the script can't find a place to put a new include (mostly
because the file doesn't have fitting include block), it prints out
an error message indicating which .h file needs to be added to the
file.
The conversion was done in the following steps.
1. The initial automatic conversion of all .c files updated slightly
over 4000 files, deleting around 700 includes and adding ~480 gfp.h
and ~3000 slab.h inclusions. The script emitted errors for ~400
files.
2. Each error was manually checked. Some didn't need the inclusion,
some needed manual addition while adding it to implementation .h or
embedding .c file was more appropriate for others. This step added
inclusions to around 150 files.
3. The script was run again and the output was compared to the edits
from #2 to make sure no file was left behind.
4. Several build tests were done and a couple of problems were fixed.
e.g. lib/decompress_*.c used malloc/free() wrappers around slab
APIs requiring slab.h to be added manually.
5. The script was run on all .h files but without automatically
editing them as sprinkling gfp.h and slab.h inclusions around .h
files could easily lead to inclusion dependency hell. Most gfp.h
inclusion directives were ignored as stuff from gfp.h was usually
wildly available and often used in preprocessor macros. Each
slab.h inclusion directive was examined and added manually as
necessary.
6. percpu.h was updated not to include slab.h.
7. Build test were done on the following configurations and failures
were fixed. CONFIG_GCOV_KERNEL was turned off for all tests (as my
distributed build env didn't work with gcov compiles) and a few
more options had to be turned off depending on archs to make things
build (like ipr on powerpc/64 which failed due to missing writeq).
* x86 and x86_64 UP and SMP allmodconfig and a custom test config.
* powerpc and powerpc64 SMP allmodconfig
* sparc and sparc64 SMP allmodconfig
* ia64 SMP allmodconfig
* s390 SMP allmodconfig
* alpha SMP allmodconfig
* um on x86_64 SMP allmodconfig
8. percpu.h modifications were reverted so that it could be applied as
a separate patch and serve as bisection point.
Given the fact that I had only a couple of failures from tests on step
6, I'm fairly confident about the coverage of this conversion patch.
If there is a breakage, it's likely to be something in one of the arch
headers which should be easily discoverable easily on most builds of
the specific arch.
Signed-off-by: Tejun Heo <tj@kernel.org>
Guess-its-ok-by: Christoph Lameter <cl@linux-foundation.org>
Cc: Ingo Molnar <mingo@redhat.com>
Cc: Lee Schermerhorn <Lee.Schermerhorn@hp.com>
Zhang Rui