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thermal/drivers/cpu_cooling: Rename to cpufreq_cooling 

As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
This commit is contained in:
Daniel Lezcano 2019-12-19 23:53:17 +01:00
parent a4c428e523
commit 23affa2e29
6 changed files with 8 additions and 8 deletions
Show Stats Download Patch File Download Diff File Expand all files Collapse all files

2
Documentation/driver-api/thermal/exynos_thermal.rst
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@ -67,7 +67,7 @@ TMU driver description:
The exynos thermal driver is structured as::
Kernel Core thermal framework
(thermal_core.c, step_wise.c, cpu_cooling.c)
(thermal_core.c, step_wise.c, cpufreq_cooling.c)
^
|
|

2
MAINTAINERS
View File

@ -16349,7 +16349,7 @@ L: linux-pm@vger.kernel.org
S: Supported
F: Documentation/driver-api/thermal/cpu-cooling-api.rst
F: Documentation/driver-api/thermal/cpu-idle-cooling.rst
F: drivers/thermal/cpu_cooling.c
F: drivers/thermal/cpufreq_cooling.c
F: drivers/thermal/cpuidle_cooling.c
F: include/linux/cpu_cooling.h

2
drivers/thermal/Makefile
View File

@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o
# cpufreq cooling
thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o
thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o
thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o
# clock cooling

2
drivers/thermal/clock_cooling.c
View File

@ -7,7 +7,7 @@
* Copyright (C) 2013 Texas Instruments Inc.
* Contact: Eduardo Valentin <eduardo.valentin@ti.com>
*
* Highly based on cpu_cooling.c.
* Highly based on cpufreq_cooling.c.
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
* Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
*/

6
drivers/thermal/cpu_cooling.c → drivers/thermal/cpufreq_cooling.c
View File

@ -1,6 +1,6 @@
// SPDX-License-Identifier: GPL-2.0
/*
* linux/drivers/thermal/cpu_cooling.c
* linux/drivers/thermal/cpufreq_cooling.c
*
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
*
@ -621,7 +621,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
struct thermal_cooling_device *cdev = NULL;
if (!np) {
pr_err("cpu_cooling: OF node not available for cpu%d\n",
pr_err("cpufreq_cooling: OF node not available for cpu%d\n",
policy->cpu);
return NULL;
}
@ -631,7 +631,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
cdev = __cpufreq_cooling_register(np, policy, em);
if (IS_ERR(cdev)) {
pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n",
pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n",
policy->cpu, PTR_ERR(cdev));
cdev = NULL;
}

2
include/linux/clock_cooling.h
View File

@ -7,7 +7,7 @@
* Copyright (C) 2013 Texas Instruments Inc.
* Contact: Eduardo Valentin <eduardo.valentin@ti.com>
*
* Highly based on cpu_cooling.c.
* Highly based on cpufreq_cooling.c.
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
* Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
*/