Thermal: Enable Broxton SoC thermal reporting device
Signed-off-by: Amy Wiles <amy.l.wiles@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This commit is contained in:
parent
a96bedf1b8
commit
20bbfaf72c
|
@ -33,6 +33,12 @@
|
|||
/* Braswell thermal reporting device */
|
||||
#define PCI_DEVICE_ID_PROC_BSW_THERMAL 0x22DC
|
||||
|
||||
/* Broxton thermal reporting device */
|
||||
#define PCI_DEVICE_ID_PROC_BXT0_THERMAL 0x0A8C
|
||||
#define PCI_DEVICE_ID_PROC_BXT1_THERMAL 0x1A8C
|
||||
#define PCI_DEVICE_ID_PROC_BXTX_THERMAL 0x4A8C
|
||||
#define PCI_DEVICE_ID_PROC_BXTP_THERMAL 0x5A8C
|
||||
|
||||
struct power_config {
|
||||
u32 index;
|
||||
u32 min_uw;
|
||||
|
@ -404,6 +410,10 @@ static const struct pci_device_id proc_thermal_pci_ids[] = {
|
|||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_HSB_THERMAL)},
|
||||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_SKL_THERMAL)},
|
||||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_BSW_THERMAL)},
|
||||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_BXT0_THERMAL)},
|
||||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_BXT1_THERMAL)},
|
||||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_BXTX_THERMAL)},
|
||||
{ PCI_DEVICE(PCI_VENDOR_ID_INTEL, PCI_DEVICE_ID_PROC_BXTP_THERMAL)},
|
||||
{ 0, },
|
||||
};
|
||||
|
||||
|
|
Loading…
Reference in New Issue