48 lines
1.3 KiB
Makefile
48 lines
1.3 KiB
Makefile
ccflags-$(CONFIG_USB_DWC3_DEBUG) := -DDEBUG
|
|
ccflags-$(CONFIG_USB_DWC3_VERBOSE) += -DVERBOSE_DEBUG
|
|
|
|
obj-$(CONFIG_USB_DWC3) += dwc3.o
|
|
|
|
dwc3-y := core.o
|
|
dwc3-y += host.o
|
|
dwc3-y += gadget.o ep0.o
|
|
|
|
ifneq ($(CONFIG_DEBUG_FS),)
|
|
dwc3-y += debugfs.o
|
|
endif
|
|
|
|
##
|
|
# Platform-specific glue layers go here
|
|
#
|
|
# NOTICE: Make sure your glue layer doesn't depend on anything
|
|
# which is arch-specific and that it compiles on all situations.
|
|
#
|
|
# We want to keep this requirement in order to be able to compile
|
|
# the entire driver (with all its glue layers) on several architectures
|
|
# and make sure it compiles fine. This will also help with allmodconfig
|
|
# and allyesconfig builds.
|
|
#
|
|
# The only exception is the PCI glue layer, but that's only because
|
|
# PCI doesn't provide nops if CONFIG_PCI isn't enabled.
|
|
##
|
|
|
|
obj-$(CONFIG_USB_DWC3) += dwc3-omap.o
|
|
|
|
##
|
|
# REVISIT Samsung Exynos platform needs the clk API which isn't
|
|
# defined on all architectures. If we allow dwc3-exynos.c compile
|
|
# always we will fail the linking phase on those architectures
|
|
# which don't provide clk api implementation and that's unnaceptable.
|
|
#
|
|
# When Samsung's platform start supporting pm_runtime, this check
|
|
# for HAVE_CLK should be removed.
|
|
##
|
|
ifneq ($(CONFIG_HAVE_CLK),)
|
|
obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o
|
|
endif
|
|
|
|
ifneq ($(CONFIG_PCI),)
|
|
obj-$(CONFIG_USB_DWC3) += dwc3-pci.o
|
|
endif
|
|
|