The IGEP COM Module has an 512MB NAND flash memory.
Add a device node for this NAND and its partition layout.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.
This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
Javier Martinez Canillas