Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Currently when CPU_THERMAL is not defined the thermal sensors
are not even exposed consequently no cooling is possible. CPU_THERMAL
eventually depends on CPUFREQ. CPPUFREQ is not the only cooling
for CPU.
The thermal shutdown for critical temperatures is another
cooling solution which will currently not get enabled if CPU_THERMAL
is not defined. Remove this dependency so as to have the last level
of thermal protection working even without CPUFREQ defined.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table
Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.
All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>