2 Commits

Author	SHA1	Message	Date
Sachin Kamat	45c396ce6b	usb: dwc3: Remove duplicate header file inclusion ... module.h header file was included twice. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Felipe Balbi <balbi@ti.com>	2012-06-22 13:21:43 +03:00
Anton Tikhomirov	d28a9689c9	usb: dwc3: Add Exynos Specific Glue layer ... Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>	2012-03-02 12:11:28 +02:00