Commit Graph

3 Commits

Author SHA1 Message Date
Krzysztof Kozlowski ca07ee4e3d thermal: exynos: Rename Samsung and Exynos to lowercase
Fix up inconsistent usage of upper and lowercase letters in "Samsung"
and "Exynos" names.

"SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked
names.  Therefore they should be written with lowercase letters starting
with capital letter.

The lowercase "Exynos" name is promoted by its manufacturer Samsung
Electronics Co., Ltd., in advertisement materials and on website.

Although advertisement materials usually use uppercase "SAMSUNG", the
lowercase version is used in all legal aspects (e.g. on Wikipedia and in
privacy/legal statements on
https://www.samsung.com/semiconductor/privacy-global/).

Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
2020-01-27 10:24:32 +01:00
Daniel Lezcano 23affa2e29 thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
2020-01-27 10:24:32 +01:00
Mauro Carvalho Chehab eaf7b46083 docs: thermal: add it to the driver API
The file contents mostly describes driver internals.

Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>
Signed-off-by: Jonathan Corbet <corbet@lwn.net>
2019-07-31 13:25:15 -06:00