Commit Graph

4 Commits

Author SHA1 Message Date
Thomas Gleixner 2b27bdcc20 treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 336
Based on 1 normalized pattern(s):

  this program is free software you can redistribute it and or modify
  it under the terms of the gnu general public license version 2 as
  published by the free software foundation this program is
  distributed in the hope that it will be useful but without any
  warranty without even the implied warranty of merchantability or
  fitness for a particular purpose see the gnu general public license
  for more details you should have received a copy of the gnu general
  public license along with this program if not write to the free
  software foundation inc 51 franklin st fifth floor boston ma 02110
  1301 usa

extracted by the scancode license scanner the SPDX license identifier

  GPL-2.0-only

has been chosen to replace the boilerplate/reference in 246 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000436.674189849@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-06-05 17:37:07 +02:00
Keerthy 004f772871 thermal: ti-soc-thermal: Remove redundant constants
Now that slope and offset data are being passed from
device tree no need to populate in driver data.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29 22:14:51 -07:00
Eduardo Valentin 8926fa4f9b thermal: ti-soc-thermal: add thermal data for DRA752 chips
This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table

Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.

All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:15:52 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00