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extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 246 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000436.674189849@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
While debugging some PM issues and trying to remove all the loaded modules, I ran
across the following when unloading ti-soc-thermal:
Unable to handle kernel NULL pointer dereference at virtual address 000000b4
...
[<c08db340>] (kobject_put) from [<bf28954c>] (ti_thermal_unregister_cpu_cooling+0x20/0x28 [ti_soc_thermal])
[<bf28954c>] (ti_thermal_unregister_cpu_cooling [ti_soc_thermal]) from [<bf287c88>] (ti_bandgap_remove+0x3c/0x104 [ti_soc_thermal])
[<bf287c88>] (ti_bandgap_remove [ti_soc_thermal]) from [<c0610d48>] (platform_drv_remove+0x24/0x3c)
[<c0610d48>] (platform_drv_remove) from [<c060f114>] (device_release_driver_internal+0x160/0x208)
[<c060f114>] (device_release_driver_internal) from [<c060f200>] (driver_detach+0x38/0x6c)
[<c060f200>] (driver_detach) from [<c060e2d4>] (bus_remove_driver+0x4c/0xa0)
[<c060e2d4>] (bus_remove_driver) from [<c01f2370>] (SyS_delete_module+0x168/0x238)
[<c01f2370>] (SyS_delete_module) from [<c0108240>] (ret_fast_syscall+0x0/0x28)
Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the
frequency table, etc. Most of the callers of CPU cooling driver's
registration routines have the cpufreq policy with them, but they only
pass the policy->related_cpus cpumask. The __cpufreq_cooling_register()
routine then gets the policy by itself and uses it.
It would be much better if the callers can pass the policy instead
directly. This also fixes a basic design flaw, where the policy can be
freed while the CPU cooling driver is still active.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
ti_thermal_expose_sensor always takes the
devm_thermal_zone_of_sensor_register call for registration
with the device tree nodes present for all the bandgap sensors
for omap3/4/5 and dra7 family. There are large chunks of unused
code. Removing all of them.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently slope and offset values for calculating the hot spot
temperature of a thermal zone is being taken directly from driver
data. So fetch them from device tree.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This changes the driver to use the devm_ version
of thermal_zone_of_sensor_register and cleans
up the local points and unregister calls.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-omap@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Tested-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simplify code by removing goto's where they point to simple return.
Avoid confusing |= on error values.
Correct whitespace.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The cpufreq_cooling_unregister() function tests whether its argument is NULL
and then returns immediately. Thus the test around the call is not needed.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Avoid printing the error message in the EPROBE_DEFER case
where registering cpu cooling at ti-soc-thermal thermal driver.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In this patch, the cpu_cooling code checks for the usability of cpufreq
layer before proceeding with the CPU cooling device registration. The
main reason is: CPU cooling device is not usable if cpufreq cannot
switch frequencies.
Similar checks are spread in thermal drivers. Thus, the advantage now
is to have the check in a single place: cpu cooling device registration.
For this reason, this patch also updates the existing drivers that
depend on CPU cooling to simply propagate the error code of the cpu
cooling registration call. Therefore, in case cpufreq is not ready, the
thermal drivers will still return -EPROBE_DEFER, in an attempt to try
again when cpufreq layer gets ready.
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.
The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.
This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Alexandre Courbot <acourbot@nvidia.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.
The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.
In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch changes the behavior of TI SoC thermal driver
when there is a PCB thermal zone.
Instead of reporting an error code when reading from
PCB temperature sensor fails, this patch will make
the driver attempt to compose the hotspot extrapolation
based on bandgap readings only.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.
Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL()
macro. This macro can lead to dangerous results, like returning
success (0) during a failure scenario (NULL pointer handling).
For this reason this patch is changing the driver after
revisiting the code. These are the cases:
i. For cases in which IS_ERR_OR_NULL() is used for checking
return values of functions that returns either PTR_ERR()
or a valid pointer, it has been translated to IS_ERR() check only.
ii. For cases that a NULL check is still needed, it has been
translated to if (!ptr || IS_ERR(ptr)).
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Thomas Gleixner