- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas
Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of
a couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał
Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well
as the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of
cleanups and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
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Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
This property is required for every thermal sensor as it's used when
using phandles.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210415112121.4999-1-zajec5@gmail.com
Users of common properties shouldn't have a type definition as the
common schemas already have one. Drop all the unnecessary type
references in the tree.
A meta-schema update to catch these is pending.
Cc: Maxime Ripard <mripard@kernel.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Krzysztof Kozlowski <krzk@kernel.org>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Cheng-Yi Chiang <cychiang@chromium.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Stefan Wahren <wahrenst@gmx.net>
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Odelu Kukatla <okukatla@codeaurora.org>
Cc: linux-gpio@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-can@vger.kernel.org
Cc: netdev@vger.kernel.org
Cc: linux-remoteproc@vger.kernel.org
Cc: alsa-devel@alsa-project.org
Cc: linux-usb@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Suman Anna <s-anna@ti.com>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Reviewed-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Acked-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Link: https://lore.kernel.org/r/20210316194858.3527845-1-robh@kernel.org
Properties with standard unit suffixes already have a type and don't need
type references. Fix a few more cases which have gotten added.
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Kevin Tsai <ktsai@capellamicro.com>
Cc: linux-iio@vger.kernel.org
Cc: linux-input@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: Luca Ceresoli <luca@lucaceresoli.net>
Acked-by: Sebastian Reichel <sre@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20210316194824.3526913-1-robh@kernel.org
When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build
host fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device(). In preparation for
this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
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Merge tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build host
fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device().
In preparation for this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
* tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (35 commits)
driver core: platform: Drop of_device_node_put() wrapper
of: Remove of_dev_{get,put}()
dt-bindings: usb: Change descibe to describe in usbmisc-imx.txt
dt-bindings: can: rcar_canfd: Group tuples in pin control properties
dt-bindings: power: renesas,apmu: Group tuples in cpus properties
dt-bindings: mtd: spi-nor: Convert to DT schema format
dt-bindings: Use portable sort for version cmp
dt-bindings: ethernet-controller: fix fixed-link specification
dt-bindings: irqchip: Add node name to PRUSS INTC
dt-bindings: interconnect: Fix the expected number of cells
dt-bindings: Fix errors in 'if' schemas
dt-bindings: iommu: renesas,ipmmu-vmsa: Make 'power-domains' conditionally required
dt-bindings: Fix undocumented compatible strings in examples
kbuild: Add support to build overlays (%.dtbo)
scripts: dtc: Remove the unused fdtdump.c file
scripts: dtc: Build fdtoverlay tool
scripts/dtc: Update to upstream version v1.6.0-51-g183df9e9c2b9
scripts: dtc: Fetch fdtoverlay.c from external DTC project
dt-bindings: thermal: sun8i: Fix misplaced schema keyword in compatible strings
dt-bindings: iio: dac: Fix AD5686 references
...
Add bindings for thermal monitor, part of Qualcomm PMIC5 chips. It is a
close counterpart of VADC part of those PMICs.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210205000118.493610-2-dmitry.baryshkov@linaro.org
The zte zx platform is getting removed, so this driver is no
longer needed.
Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
The tango platform is getting removed, so the driver is no
longer needed.
Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
Add support for R-Car V3U. The V3U IP differs a bit from its siblings in
such way that it have 4 TSC nodes and the interrupts are not routed to
the INTC-AP but to the ECM.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126223028.3119044-2-niklas.soderlund+renesas@ragnatech.se
- Factor out common required properties,
- "interrupts", "clocks", and "power-domains" are required on R-Mobile
APE6, too,
- Invert logic to simplify descriptions.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201028153541.1736279-1-geert+renesas@glider.be
Add binding documentation for the MediaTek MT8516 SoC.
The SoC thermal IP is similar to MT2701.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201021164231.3029956-2-fparent@baylibre.com
MT8516 Thermal IP does not support reset. Make the resets property
optional in order to be able to support MT8516 SoC.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201021164231.3029956-1-fparent@baylibre.com
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional
statement on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update
the Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing Xiangfeng)
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Merge tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Fix Kconfig typo "acces" -> "access" (Colin Ian King)
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional statement
on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update the
Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing
Xiangfeng)
* tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal: core: Adding missing nlmsg_free() in thermal_genl_sampling_temp()
thermal: ti-soc-thermal: Enable addition power management
thermal: sun8i: Add A100's THS controller support
thermal: sun8i: add TEMP_CALIB_MASK for calibration data in sun50i_h6_ths_calibrate
dt-bindings: thermal: sun8i: Add binding for A100's THS controller
thermal: cooling: Remove unused variable *tz
thermal: int340x: Add keep alive response method
thermal: core: Add new event for sending keep alive notifications
thermal: int340x: Provide notification for OEM variable change
thermal: core: remove unnecessary mutex_init()
thermal/idle_inject: Fix comment of idle_duration_us and name of latency_ns
thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config
thermal: stm32: simplify the return expression of stm_thermal_prepare()
dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 support
thermal: rcar_thermal: Add missing braces to conditional statement
thermal: Use kobj_to_dev() instead of container_of()
thermal: imx8mm: Use dev_err_probe() to simplify error handling
thermal: imx: Use dev_err_probe() to simplify error handling
drivers: thermal: Kconfig: fix spelling mistake "acces" -> "access"
In order to add meta-schema checks for additional/unevaluatedProperties
being present, all schema need to make this explicit. As common/shared
schema are included by other schemas, they should always allow for
additionalProperties.
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Sebastian Reichel <sre@kernel.org>
Acked-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Link: https://lore.kernel.org/r/20201005183830.486085-5-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
DTSes with new i.MX 8M SoCs introduce their own compatibles so add them
to fix dtbs_check warnings like:
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible:0: 'fsl,imx8mn-tmu' is not one of ['fsl,imx8mm-tmu', 'fsl,imx8mp-tmu']
From schema: Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: ['fsl,imx8mn-tmu', 'fsl,imx8mm-tmu'] is too long
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: Additional items are not allowed ('fsl,imx8mm-tmu' was unexpected)
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events, temperature
and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
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Merge tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add support to enable/disable the thermal zones resulting on core
code and drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events,
temperature and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian
Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz
Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
* tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits)
thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support
thermal: mediatek: Add tsensor support for V2 thermal system
thermal: mediatek: Prepare to add support for other platforms
thermal: Update power allocator and devfreq cooling to SPDX licensing
MAINTAINERS: update entry to thermal governors file name prefixing
thermal: core: Add thermal zone enable/disable notification
thermal: qcom: tsens-v0_1: Add support for MSM8939
dt-bindings: tsens: qcom: Document MSM8939 compatible
thermal: core: Fix thermal zone lookup by ID
thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id
thermal: imx8mm: Support module autoloading
thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor()
MAINTAINERS: Add maintenance information for IPA
thermal: rcar_gen3_thermal: Do not shadow thcode variable
dt-bindings: thermal: Get rid of thermal.txt and replace references
thermal: core: Move initialization after core initcall
thermal: netlink: Improve the initcall ordering
net: genetlink: Move initialization to core_initcall
thermal: rcar_gen3_thermal: Add r8a774e1 support
thermal/drivers/clock_cooling: Remove clock_cooling code
...
- Improve device links cycle detection and breaking. Add more
bindings for device link dependencies.
- Refactor parsing 'no-map' in __reserved_mem_alloc_size()
- Improve DT unittest 'ranges' and 'dma-ranges' test case to check
differing cell sizes
- Various http to https link conversions
- Add a schema check to prevent 'syscon' from being used by itself
without a more specific compatible
- A bunch more DT binding conversions to schema
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Merge tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull Devicetree updates from Rob Herring:
- Improve device links cycle detection and breaking. Add more bindings
for device link dependencies.
- Refactor parsing 'no-map' in __reserved_mem_alloc_size()
- Improve DT unittest 'ranges' and 'dma-ranges' test case to check
differing cell sizes
- Various http to https link conversions
- Add a schema check to prevent 'syscon' from being used by itself
without a more specific compatible
- A bunch more DT binding conversions to schema
* tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits)
of: reserved-memory: remove duplicated call to of_get_flat_dt_prop() for no-map node
of: unittest: Use bigger address cells to catch parser regressions
dt-bindings: memory-controllers: Convert mmdc to json-schema
dt-bindings: mtd: Convert imx nand to json-schema
dt-bindings: mtd: Convert gpmi nand to json-schema
dt-bindings: iio: io-channel-mux: Fix compatible string in example code
of: property: Add device link support for pinctrl-0 through pinctrl-8
of: property: Add device link support for multiple DT bindings
dt-bindings: phy: ti: phy-gmii-sel: convert bindings to json-schema
dt-bindings: mux: mux.h: drop a duplicated word
dt-bindings: misc: Convert olpc,xo1.75-ec to json-schema
dt-bindings: aspeed-lpc: Replace HTTP links with HTTPS ones
dt-bindings: drm/bridge: Replace HTTP links with HTTPS ones
drm/tilcdc: Replace HTTP links with HTTPS ones
dt-bindings: iommu: renesas,ipmmu-vmsa: Add r8a774e1 support
dt-bindings: fpga: Replace HTTP links with HTTPS ones
dt-bindings: virtio: Replace HTTP links with HTTPS ones
dt-bindings: media: imx274: Add optional input clock and supplies
dt-bindings: i2c-gpio: Use 'deprecated' keyword on deprecated properties
dt-bindings: interrupt-controller: Fix typos in loongson,liointc.yaml
...
As usual, there are many patches addressing minor issues in existing
DTS files, such as DTC warnings, or adding support for additional
peripherals.
There are three added SoCs in existing product families:
- Amazon:
Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs,
otherwise known as AL73400 or first-generation Graviton, and following
the already supported Cortex-A1`5 and Cortex-A57 based Alpine chips.
This one is added together with the official Evaluation platform.
- Qualcomm:
The Snapdragon SDM630 platform is a family of mid-range mobile phone
chips from 2017 based on Cortex-A53 or Kryo 260 CPUs.
A total of five end-user products are added based on these, all
Android phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and
XA2 Ultra.
- Renesas:
RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G
family, and apparently closely related to the RZ/G2N and RZ/G2M
models we already support but has a faster GPU and additional
on-chip peripherals.
It is added along with the HopeRun HiHope RZ/G2H development board
A small number of new boards for already supported SoCs also debut:
- Allwinner sunxi:
Only one new machine, revision v1.2 of the Pine64 PinePhone
(non-Android) smartphone, containing minor changes compared to
earlier versions.
- Amlogic Meson:
WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box
- Aspeed:
EthanolX is AMD's EPYC data center rerence platform, using an
ASpeed AST2600 baseboard management controller.
- Mediatek:
Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook
based on the MT8183 (Helio P60t) SoC.
- Nvidia Tegra:
ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android
tablets from around 2012 using Tegra 3 and Tegra 2, respectively.
Thanks to PostmarketOS, these can now run mainline kernels
and become useful again.
The Jetson Xavier NX Developer Kit uses a SoM and carrier board
for the Tegra194, their latest 64-bit chip based on Carmel CPU
cores and Volta graphics.
- NXP i.MX:
Five new boards based on the 32-bit i.MX6 series are added:
The MYiR MYS-6ULX single-board computer, and four different
models of industrial computers from Protonic.
- Qualcomm:
MikroTik RouterBoard 3011 is a rackmounted router based on the
32-bit IPQ8064 networking SoC
Three older phones get added, the Snapdragon 808 (msm8992) based
Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running
Windows Phone, and the Snapdragon 810 (msm8994) based Sony
Xperia Z5.
- Renesas:
In addition to the HiHope RZ/G2H board mentioned above, we gain
support for board versions 3.0 and 4.0 of the earlier RZ/G2M and
RZ/G2N reference boards.
Beacon EmbeddedWorks adds another SoM+Carrier development board
for RZ/G2M.
- Rockchips:
Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it
is based on, using the high-end 32-bit rk3288 SoC.
Notable updates to existing platforms are usually for added on-chip
peripherals, including:
- ASpeed AST2xxx (various)
- Allwinner (cpufreq, thermal, Pinephone touchscreen)
- Amlogic Meson (audio, gpu dvdfs, board updates)
- Arm Versatile
- Broadcom (board updates for switch ports, Raspberry pi clock updates)
- Hisilicon (various)
- Intel/Altera SoCFPGA (various)
- Marvell Armada 7xxx/8xxx (smmu)
- Marvell MMP (GPU on mmp2/mmp3)
- Mediatek mt8183 (USB, pericfg)
- NXP Layerscape (VPU, thermal, DSPI)
- NXP i.MX (VPU, bindings, board updates)
- Nvidia Tegra194 (GPU)
- Qualcomm (GPU, Interconnect, ...)
- Renesas R-Car (SPI, IPMMU, board updates)
- STMicroelectronics STM32 (various)
- Samsung Exynos (various)
- Socionext Uniphier (updates to serial, and pcie)
- TI K3 (serdes, usb3, audio, sd, chipid)
- TI OMAP (IPU/DSP remoteproc changes, dropping platform data)
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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Merge tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC DT updates from Arnd Bergmann:
"As usual, there are many patches addressing minor issues in existing
DTS files, such as DTC warnings, or adding support for additional
peripherals.
There are three added SoCs in existing product families:
- Amazon:
Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs,
otherwise known as AL73400 or first-generation Graviton, and
following the already supported Cortex-A1`5 and Cortex-A57 based
Alpine chips. This one is added together with the official
Evaluation platform.
- Qualcomm:
The Snapdragon SDM630 platform is a family of mid-range mobile
phone chips from 2017 based on Cortex-A53 or Kryo 260 CPUs. A total
of five end-user products are added based on these, all Android
phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and XA2 Ultra.
- Renesas:
RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G
family, and apparently closely related to the RZ/G2N and RZ/G2M
models we already support but has a faster GPU and additional
on-chip peripherals. It is added along with the HopeRun HiHope
RZ/G2H development board
A small number of new boards for already supported SoCs also debut:
- Allwinner sunxi:
Only one new machine, revision v1.2 of the Pine64 PinePhone
(non-Android) smartphone, containing minor changes compared to
earlier versions.
- Amlogic Meson:
WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box
- Aspeed:
EthanolX is AMD's EPYC data center rerence platform, using an
ASpeed AST2600 baseboard management controller.
- Mediatek:
Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook based
on the MT8183 (Helio P60t) SoC.
- Nvidia Tegra:
ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android
tablets from around 2012 using Tegra 3 and Tegra 2, respectively.
Thanks to PostmarketOS, these can now run mainline kernels and
become useful again.
The Jetson Xavier NX Developer Kit uses a SoM and carrier board for
the Tegra194, their latest 64-bit chip based on Carmel CPU cores
and Volta graphics.
- NXP i.MX:
Five new boards based on the 32-bit i.MX6 series are added: The
MYiR MYS-6ULX single-board computer, and four different models of
industrial computers from Protonic.
- Qualcomm:
MikroTik RouterBoard 3011 is a rackmounted router based on the
32-bit IPQ8064 networking SoC
Three older phones get added, the Snapdragon 808 (msm8992) based
Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running
Windows Phone, and the Snapdragon 810 (msm8994) based Sony Xperia
Z5.
- Renesas:
In addition to the HiHope RZ/G2H board mentioned above, we gain
support for board versions 3.0 and 4.0 of the earlier RZ/G2M and
RZ/G2N reference boards. Beacon EmbeddedWorks adds another
SoM+Carrier development board for RZ/G2M.
- Rockchips:
Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it is
based on, using the high-end 32-bit rk3288 SoC.
Notable updates to existing platforms are usually for added on-chip
peripherals, including:
- ASpeed AST2xxx (various)
- Allwinner (cpufreq, thermal, Pinephone touchscreen)
- Amlogic Meson (audio, gpu dvdfs, board updates)
- Arm Versatile
- Broadcom (board updates for switch ports, Raspberry pi clock updates)
- Hisilicon (various)
- Intel/Altera SoCFPGA (various)
- Marvell Armada 7xxx/8xxx (smmu)
- Marvell MMP (GPU on mmp2/mmp3)
- Mediatek mt8183 (USB, pericfg)
- NXP Layerscape (VPU, thermal, DSPI)
- NXP i.MX (VPU, bindings, board updates)
- Nvidia Tegra194 (GPU)
- Qualcomm (GPU, Interconnect, ...)
- Renesas R-Car (SPI, IPMMU, board updates)
- STMicroelectronics STM32 (various)
- Samsung Exynos (various)
- Socionext Uniphier (updates to serial, and pcie)
- TI K3 (serdes, usb3, audio, sd, chipid)
- TI OMAP (IPU/DSP remoteproc changes, dropping platform data)"
* tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (605 commits)
arm64: dts: meson: odroid-n2: add jack audio output support
arm64: dts: meson: odroid-n2: enable audio loopback
ARM: dts: berlin: Align L2 cache-controller nodename with dtschema
arm64: dts: qcom: Add Microsoft Lumia 950 (Talkman) device tree
arm64: dts: qcom: Add Xiaomi Libra (Mi 4C) device tree
arm64: dts: qcom: msm8992: Add RPMCC node
arm64: dts: qcom: msm8992: Add PSCI support.
arm64: dts: qcom: msm8992: Add PMU node
arm64: dts: qcom: msm8992: Add BLSP2_UART2 and I2C nodes
arm64: dts: qcom: msm8992: Add SPMI PMIC arbiter device
arm64: dts: qcom: msm8992: Add a SCM node
arm64: dts: qcom: msm8992: Add a proper CPU map
arm64: dts: qcom: bullhead: Move UART pinctrl to SoC
arm64: dts: qcom: bullhead: Add qcom,msm-id
arm64: dts: qcom: msm8992: Fix SDHCI1
arm64: dts: qcom: msm8992: Modernize the DTS style
arm64: dts: qcom: Add support for Sony Xperia Z5 (SoMC Sumire-RoW)
arm64: dts: qcom: Move msm8994-smd-rpm contents to lg-bullhead.
arm64: dts: qcom: msm8994: Add support for SMD RPM
arm64: dts: qcom: msm8992: Add a label to rpm-requests
...
It adds compatible for MSM8939 TSENS device.
Signed-off-by: Konrad Dybcio <konradybcio@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Tested-by: Konrad Dybcio <konradybcio@gmail.com> /* on Asus Z00T smartphone */
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629144926.665-2-shawn.guo@linaro.org
Now that we have yaml bindings for the thermal subsystem, get rid of the
old bindings (thermal.txt).
Replace all references to thermal.txt in the Documentation with a link
to the appropriate YAML bindings using the following search and replace
pattern:
- If the reference is specific to the thermal-sensor-cells property,
replace with a pointer to thermal-sensor.yaml
- If the reference is to the cooling-cells property, replace with a
pointer to thermal-cooling-devices.yaml
- If the reference is generic thermal bindings, replace with a
reference to thermal*.yaml.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org
- Sync dtc to upstream to pick up fixes for I2C bus checks and quiet
warnings
- Various fixes for DT binding check warnings
- A couple of build fixes/improvements for binding checks
- ReST formatting improvements for writing-schema.rst
- Document reference fixes
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Merge tag 'devicetree-fixes-for-5.8-2' into dt/next
Devicetree fixes for v5.8, take 2:
- Sync dtc to upstream to pick up fixes for I2C bus checks and quiet
warnings
- Various fixes for DT binding check warnings
- A couple of build fixes/improvements for binding checks
- ReST formatting improvements for writing-schema.rst
- Document reference fixes
Adjust the reg property to fix the following warning seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml: example-0: thermal@42050000:reg:0: [0, 1107623936, 0, 604] is too long
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630122527.28640-1-festevam@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
Remove the soc unit address to fix the following warnings seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/thermal-sensor.example.dts:22.20-49.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Documentation/devicetree/bindings/thermal/thermal-zones.example.dts:23.20-50.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630121804.27887-1-festevam@gmail.com
[robh: also fix thermal-zones.yaml example]
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the qoriq thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device (Matthias
Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error handling
(Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the change
the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace module.h by
export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
(Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
thermal driver - trivial conflicts fixed (Matthew Garrett)
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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
Another round of 'allOf' removals that came in this cycle.
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Signed-off-by: Rob Herring <robh@kernel.org>
Add thermal sensor support for r8a7742 SoC. The Renesas RZ/G1H
(r8a7742) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The thermal-zone binding is a software abstraction to capture the
properties of each zone - how often they should be checked, the
temperature thresholds (trips) at which mitigation actions need to be
taken and the level of mitigation needed at those thresholds.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #cooling-cells is required in each device that acts as a
cooling device - whether active or passive. So any device that can
throttle its performance to passively reduce heat dissipation (e.g.
CPUs, GPUs) and any device that can actively dissipate heat at different
levels (e.g. fans) will contain this property.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #thermal-sensor-cells is required in each device that acts
as a thermal sensor. It is used to uniquely identify the instance of the
thermal sensor inside the system.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
Some devices are not able to cool down by reducing their voltage /
frequency because it could be not available or the system does not
allow voltage scaling. In this configuration, it is not possible to
use this strategy and the idle injection cooling device can be used
instead.
One idle cooling device is now present for the CPU as implemented by
the combination of the idle injection framework belonging to the power
capping framework and the thermal cooling device. The missing part is
the DT binding providing a way to describe how the cooling device will
work on the system.
A first iteration was done by making the cooling device to point to
the idle state. Unfortunately it does not make sense because it would
need to duplicate the idle state description for each CPU in order to
have a different phandle and make the thermal internal framework
happy.
It was proposed to add an cooling-cells to <3>, unfortunately the
thermal framework is expecting a value of <2> as stated by the
documentation and it is not possible from the cooling device generic
code to loop this third value to the back end cooling device.
Another proposal was to add a child 'thermal-idle' node as the SCMI
does. This approach allows to have a self-contained configuration for
the idle cooling device without colliding with the cpufreq cooling
device which is based on the CPU node. In addition, it allows to have
the cpufreq cooling device and the idle cooling device to co-exist
together as shown in the example.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org
The examples template is a 'simple-bus' with a size of 1 cell for
had between 2 and 4 cells which really only errors on I2C or SPI type
devices with a single cell.
The easiest fix in most cases is to change the 'reg' property to for 1 cell
address and size. In some cases with child devices having 2 cells, that
doesn't make sense so a bus node is needed.
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX8MM thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Linus Torvalds