This patch rewrites the DB8500 thermal sensor to be a
pure OF sensor, so that it can be used with thermal zones
defined in the device tree.
This driver was initially merged before we had generic
thermal zone device tree bindings, and now it gets
modernized to the way we do things these days.
The old driver depended on a set of trigger points
provided in the device tree or platform data to
interpolate the current temperature between trigger
points depending on whether the trend was rising or
falling. This was bad because the trigger points should
be used for defining temperature zone policies and
bind to cooling devices.
As the PRCMU (power reset control management unit) can
only issue IRQs when we pass temperature trigger points
upward or downward We instead define a number of
temperature points inside the driver ranging from
15 to 100 degrees celsius. The effect is that when
we register the device we quickly trigger 15, 20 ... up
to the room temperature in succession and then we
get continous event IRQs also under normal operating
conditions, and the temperature of the system is now
reported more accurately (+/- 2.5 degrees celsius)
while in the past the first trigger point was at 70
degrees and the average temperature was simply reported
as 35 degrees celsius (between 70 degrees and 0) until
we passed 70 degrees which didn't accurately represent
the temperature of the system.
As a result of dropping all the trigger points from the
driver and reusing the core DT thermal zone management
code we reduce the code footprint quite a bit.
Cc: Vincent Guittot <vincent.guittot@linaro.org>
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The code gets easier to read like this.
Cc: Vincent Guittot <vincent.guittot@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
At some point there was an attempt to convert the DB8500
thermal sensor to device tree: a probe path was added
and the device tree was augmented for the Snowball board.
The switchover was never completed: instead the thermal
devices came from from the PRCMU MFD device and the probe
on the Snowball was confused as another set of configuration
appeared from the device tree.
Move over to a device-tree only approach, as we fixed up
the device trees.
Cc: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Based on 3 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license as published by
the free software foundation either version 2 of the license or at
your option any later version this program is distributed in the
hope that it will be useful but without any warranty without even
the implied warranty of merchantability or fitness for a particular
purpose see the gnu general public license for more details
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license as published by
the free software foundation either version 2 of the license or at
your option any later version [author] [kishon] [vijay] [abraham]
[i] [kishon]@[ti] [com] this program is distributed in the hope that
it will be useful but without any warranty without even the implied
warranty of merchantability or fitness for a particular purpose see
the gnu general public license for more details
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license as published by
the free software foundation either version 2 of the license or at
your option any later version [author] [graeme] [gregory]
[gg]@[slimlogic] [co] [uk] [author] [kishon] [vijay] [abraham] [i]
[kishon]@[ti] [com] [based] [on] [twl6030]_[usb] [c] [author] [hema]
[hk] [hemahk]@[ti] [com] this program is distributed in the hope
that it will be useful but without any warranty without even the
implied warranty of merchantability or fitness for a particular
purpose see the gnu general public license for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-or-later
has been chosen to replace the boilerplate/reference in 1105 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Reviewed-by: Richard Fontana <rfontana@redhat.com>
Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190527070033.202006027@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
If the driver is built as a module, autoload won't work because the module
alias information is not filled. So user-space can't match the registered
device with the corresponding module.
Export the module alias information using the MODULE_DEVICE_TABLE() macro.
Before this patch:
$ modinfo drivers/thermal/db8500_thermal.ko | grep alias
$
After this patch:
$ modinfo drivers/thermal/db8500_thermal.ko | grep alias
alias: of:N*T*Cstericsson,db8500-thermalC*
alias: of:N*T*Cstericsson,db8500-thermal
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
thermal_zone_device_register() returns ERR_PTR on error, thus use
IS_ERR rather than IS_ERR_OR_NULL to check return value.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically. The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.
Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Linus Walleij