Commit Graph

2252 Commits

Author SHA1 Message Date
Linus Torvalds 601c1aa855 More thermal control updates for 6.2-rc1
- Avoid clearing the HFI status bit on systems without HFI support
    which triggers unchecked MSR access errors (Srinivas Pandruvada).
 
  - Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
    Weiss, Neil Armstrong).
 
  - Use devm_platform_get_and_ioremap_resource on the ST platform to
    group two calls into a single one (Minghao Chi).
 
  - Use GENMASK instead of bitmaps and validate the temperature after
    reading it in the imx8mm_thermal driver (Marcus Folkesson).
 
  - Convert generic-adc-thermal to DT schema (Rob Herring).
 
  - Fix debug print message with inverted logic in the k3_j72xx_bandgap
    driver (Keerthy).
 
  - Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel).
 
  - Add support for IPQ8074 in the tsens thermal driver along with the DT
    bindings (Robert Marko).
 
  - Fix and rework the debugfs code in the tsens driver (Christian
    Marangi).
 
  - Add calibration and DT documentation for the imx8mm driver (Marek
    Vasut).
 
  - Add DT bindings and compatible for the Mediatek SoCs mt7981 and
    mt7983 (Daniel Golle).
 
  - Don't show an error message if it happens at probe time while it
    will be deferred on the QCom SPMI ADC driver (Johan Hovold).
 
  - Add HWMon support for the imx8mm board (Alexander Stein).
 
  - Remove pointless include from the power allocator governor (Christophe
    JAILLET).
 
  - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
    (Krzysztof Kozlowski).
 
  - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss).
 
  - Demote error log of thermal zone register to debug in the tsens QCom
    driver (Manivannan Sadhasivam).
 
  - Consolidate the the efuse values and the errata handling in the TI
    Bandgap driver (Bryan Brattlof).
 
  - Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
    bindings (Lad Prabhakar).
 
  - Fix the irq handler return value in the LMh driver (Bjorn Andersson).
 
  - Delete empty platform remove callback from imx_sc_thermal (Uwe
    Kleine-König).
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Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull more thermal control updates from Rafael Wysocki:
 "These are updates of assorted thermal drivers, mostly for ARM
  platforms, generally isolated and fairly straightforward, and the
  recent Intel HFI driver fix for systems without HFI support.

  Specifics:

   - Avoid clearing the HFI status bit on systems without HFI support
     which triggers unchecked MSR access errors (Srinivas Pandruvada)

   - Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
     Weiss, Neil Armstrong)

   - Use devm_platform_get_and_ioremap_resource on the ST platform to
     group two calls into a single one (Minghao Chi)

   - Use GENMASK instead of bitmaps and validate the temperature after
     reading it in the imx8mm_thermal driver (Marcus Folkesson)

   - Convert generic-adc-thermal to DT schema (Rob Herring)

   - Fix debug print message with inverted logic in the k3_j72xx_bandgap
     driver (Keerthy)

   - Fix memory leak on thermal_of_zone_register() failure (Ido
     Schimmel)

   - Add support for IPQ8074 in the tsens thermal driver along with the
     DT bindings (Robert Marko)

   - Fix and rework the debugfs code in the tsens driver (Christian
     Marangi)

   - Add calibration and DT documentation for the imx8mm driver (Marek
     Vasut)

   - Add DT bindings and compatible for the Mediatek SoCs mt7981 and
     mt7983 (Daniel Golle)

   - Don't show an error message if it happens at probe time while it
     will be deferred on the QCom SPMI ADC driver (Johan Hovold)

   - Add HWMon support for the imx8mm board (Alexander Stein)

   - Remove pointless include from the power allocator governor
     (Christophe JAILLET)

   - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
     (Krzysztof Kozlowski)

   - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)

   - Demote error log of thermal zone register to debug in the tsens
     QCom driver (Manivannan Sadhasivam)

   - Consolidate the the efuse values and the errata handling in the TI
     Bandgap driver (Bryan Brattlof)

   - Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
     bindings (Lad Prabhakar)

   - Fix the irq handler return value in the LMh driver (Bjorn
     Andersson)

   - Delete empty platform remove callback from imx_sc_thermal (Uwe
     Kleine-König)"

* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
  thermal/drivers/imx_sc_thermal: Drop empty platform remove function
  thermal/drivers/qcom/lmh: Fix irq handler return value
  dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
  thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
  dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
  dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
  dt-bindings: thermal: k3-j72xx: elaborate on binding description
  thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
  thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
  thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
  thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
  thermal/drivers/qcom: Demote error log of thermal zone register to debug
  thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
  dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
  thermal/core/power allocator: Remove a useless include
  thermal/drivers/imx8mm: Add hwmon support
  thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
  dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
  thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
  thermal/drivers/imx: Add support for loading calibration data from OCOTP
  ...
2022-12-15 10:16:04 -08:00
Rafael J. Wysocki bd7bcc4f96 - Add the sm8450 QCom compatible string in the DT bindings (Luca
Weiss)
 
 - Use devm_platform_get_and_ioremap_resource on the ST platform to
   group two calls into a single one (Minghao Chi)
 
 - Add the sm8550 QCom compatible string in the DT bindings (Neil
   Armstrong)
 
 - Use GENMASK instead of bitmaps and validate the temperature after
   reading it (Marcus Folkesson)
 
 - Convert generic-adc-thermal to DT schema (Rob Herring)
 
 - Fix the debug print message where the logic is inverted (Keerthy)
 
 - Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel)
 
 - Add support for IPQ8074 in the tsens driver along with the DT
   bindings (Robert Marko)
 
 - Fix and rework the debugfs code in the tsens driver (Christian
   Marangi)
 
 - Add calibration and DT documentation for the imx8mm driver (Marek
   Vasut)
 
 - Add DT bindings and compatible for the Mediatek SoCs mt7981 and
   mt7983 (Daniel Golle)
 
 - Don't show an error message if it happens at probe time while it
   will be deferred on the QCom SPMI ADC driver (Johan Hovold)
 
 - Add the HWMon support on the imx8mm board (Alexander Stein)
 
 - Remove a pointless include in the power allocator governor
   (Christophe JAILLET)
 
 - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
   (Krzysztof Kozlowski)
 
 - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
 
 - Demote error log of thermal zone register to debug on the tsens QCom
   driver (Manivannan Sadhasivam)
 
 - Consolidate the TI Bandgap driver regarding how is handled the efuse
   values and the errata handling (Bryan Brattlof)
 
 - Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT
   bindings (Lad Prabhakar)
 
 - Fix the irq handler return value in the LMh driver (Bjorn Andersson)
 
 - Delete platform remove callback as it is empty (Uwe Kleine-König)
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Merge tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal driver changes for 6.2-rc1 from Daniel Lezcano:

"- Add the sm8450 QCom compatible string in the DT bindings (Luca
   Weiss)

 - Use devm_platform_get_and_ioremap_resource on the ST platform to
   group two calls into a single one (Minghao Chi)

 - Add the sm8550 QCom compatible string in the DT bindings (Neil
   Armstrong)

 - Use GENMASK instead of bitmaps and validate the temperature after
   reading it (Marcus Folkesson)

 - Convert generic-adc-thermal to DT schema (Rob Herring)

 - Fix the debug print message where the logic is inverted (Keerthy)

 - Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel)

 - Add support for IPQ8074 in the tsens driver along with the DT
   bindings (Robert Marko)

 - Fix and rework the debugfs code in the tsens driver (Christian
   Marangi)

 - Add calibration and DT documentation for the imx8mm driver (Marek
   Vasut)

 - Add DT bindings and compatible for the Mediatek SoCs mt7981 and
   mt7983 (Daniel Golle)

 - Don't show an error message if it happens at probe time while it
   will be deferred on the QCom SPMI ADC driver (Johan Hovold)

 - Add the HWMon support on the imx8mm board (Alexander Stein)

 - Remove a pointless include in the power allocator governor
   (Christophe JAILLET)

 - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
   (Krzysztof Kozlowski)

 - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)

 - Demote error log of thermal zone register to debug on the tsens QCom
   driver (Manivannan Sadhasivam)

 - Consolidate the TI Bandgap driver regarding how is handled the efuse
   values and the errata handling (Bryan Brattlof)

 - Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT
   bindings (Lad Prabhakar)

 - Fix the irq handler return value in the LMh driver (Bjorn Andersson)

 - Delete platform remove callback as it is empty (Uwe Kleine-König)"

* tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (34 commits)
  thermal/drivers/imx_sc_thermal: Drop empty platform remove function
  thermal/drivers/qcom/lmh: Fix irq handler return value
  dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
  thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
  dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
  dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
  dt-bindings: thermal: k3-j72xx: elaborate on binding description
  thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
  thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
  thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
  thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
  thermal/drivers/qcom: Demote error log of thermal zone register to debug
  thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
  dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
  thermal/core/power allocator: Remove a useless include
  thermal/drivers/imx8mm: Add hwmon support
  thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
  dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
  thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
  thermal/drivers/imx: Add support for loading calibration data from OCOTP
  ...
2022-12-14 17:05:45 +01:00
Uwe Kleine-König 5011a11029 thermal/drivers/imx_sc_thermal: Drop empty platform remove function
A remove callback just returning 0 is equivalent to no remove callback
at all. So drop the useless function.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Link: https://lore.kernel.org/r/20221212220217.3777176-1-u.kleine-koenig@pengutronix.de
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:27:30 +01:00
Bjorn Andersson 46a891e45b thermal/drivers/qcom/lmh: Fix irq handler return value
After enough invocations the LMh irq is eventually reported as bad, because the
handler doesn't return IRQ_HANDLED, fix this.

Fixes: 53bca371cd ("thermal/drivers/qcom: Add support for LMh driver")
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220316180322.88132-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:41 +01:00
Minghao Chi 33dc955c5a thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.

Signed-off-by: Minghao Chi <chi.minghao@zte.com.cn>
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202211171409524332954@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:41 +01:00
Bryan Brattlof 366444ebe7 thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
Some of TI's J721E SoCs require a software trimming procedure for the
temperature monitors to function properly. To determine if a particular
J721E is not affected by this erratum, both bits in the WKUP_SPARE_FUSE0
region must be set. Other SoCs, not affected by this erratum, will not
need this region.

Map the 'fuse_base' region only when the erratum fix is needed.

Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-5-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:41 +01:00
Bryan Brattlof 156f0e2fda thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
'fuse_base' is only needed during the initial probe function to provide
data for a software trimming method for some of TI's devices affected by
the i2128 erratum. The devices not affected will not use this region

Remove fuse_base from the main k3_j72xx_bandgap structure

Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-4-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Bryan Brattlof 311f328ffc thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
Some of TI's J721E SoCs require a software trimming method to report
temperatures accurately. Currently we are using a few different data
types to indicate when we should apply the erratum.

Change the 'workaround_needed' variable's data type to a bool to align
with how we are using this variable currently.

Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-3-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Bryan Brattlof 46cab93ab4 thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
The k3_thermal_get_temp() function can be simplified to return only
the result of k3_bgp_read_temp() without needing the 'ret' variable

Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-2-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Manivannan Sadhasivam 2baad24963 thermal/drivers/qcom: Demote error log of thermal zone register to debug
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for
the channel is not represented in DT. This is perfectly fine since not all
sensors needs to be used for thermal zones but only a few in real world.

So demote the error log to debug to avoid spamming users.

Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Luca Weiss 8763f8acbf thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
On gen2 chips the stage2 threshold is not 140 degC but 125 degC.

Make the warning message clearer by using this variable and also by
including the temperature that was checked for.

Fixes: aa92b3310c ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals")
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Christophe JAILLET de04f680b0 thermal/core/power allocator: Remove a useless include
This file does not use rcu, so there is no point in including
<linux/rculist.h>.

Remove it.

Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/9adeec47cb5a8193016272d5c8bf936235c1711d.1669459337.git.christophe.jaillet@wanadoo.fr
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Alexander Stein de95d1341a thermal/drivers/imx8mm: Add hwmon support
Expose thermal sensors as HWMON devices.

Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Link: https://lore.kernel.org/r/20220726122331.323093-1-alexander.stein@ew.tq-group.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Johan Hovold 6f89416462 thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
Drivers should not be logging errors on probe deferral. Switch to using
dev_err_probe() to log failures when parsing the devicetree to avoid
errors like:

	qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517

when a channel is not yet available.

Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Reviewed-by: Manivannan Sadhasivam <mani@kernel.org>
Reviewed-by: Andrew Halaney <ahalaney@redhat.com>
Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Geert Uytterhoeven 3f9cb57962 thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
It does not make sense to have a comma after a sentinel, as any new
elements must be added before the sentinel.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/1d6de2a80b919cb11199e56ac06ad21c273ebe57.1669045586.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Marek Vasut 4032916488 thermal/drivers/imx: Add support for loading calibration data from OCOTP
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values in OCOTP. Add support for reading the OCOTP calibration
data and programming those into the TMU hardware.

The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4,
the programming differs in each case.

Based on U-Boot commits:
70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR")
ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP")

Reviewed-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Christian Marangi 89992d95ed thermal/drivers/qcom/tsens: Rework debugfs file structure
The current tsens debugfs structure is composed by:
- a tsens dir in debugfs with a version file
- a directory for each tsens istance with sensors file to dump all the
  sensors value.

This works on the assumption that we have the same version for each
istance but this assumption seems fragile and with more than one tsens
istance results in the version file not tracking each of them.

A better approach is to just create a subdirectory for each tsens
istance and put there version and sensors debugfs file.

Using this new implementation results in less code since debugfs entry
are created only on successful tsens probe.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Christian Marangi c7e077e921 thermal/drivers/qcom/tsens: Fix wrong version id dbg_version_show
For VER_0 the version was incorrectly reported as 0.1.0.

Fix that and correctly report the major version for this old tsens
revision.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Christian Marangi de48d8766a thermal/drivers/qcom/tsens: Init debugfs only with successful probe
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a
double or a wrong init of the debugfs information. Init debugfs only
with successful probe fixing warning about directory already present.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Robert Marko 6840455deb thermal/drivers/tsens: Add IPQ8074 support
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP
it only has one IRQ, that is used for up/low as well as critical.
It also does not support negative trip temperatures.

Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:40 +01:00
Robert Marko f63baced38 thermal/drivers/tsens: Allow configuring min and max trips
IPQ8074 and IPQ6018 dont support negative trip temperatures and support
up to 204 degrees C as the max trip temperature.

So, instead of always setting the -40 as min and 120 degrees C as max
allow it to be configured as part of the features.

Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:40 +01:00
Robert Marko 4360af3527 thermal/drivers/tsens: Add support for combined interrupt
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for
signaling both up/low and critical trips.

Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:40 +01:00
Ido Schimmel 7ef2f023c2 thermal/of: Fix memory leak on thermal_of_zone_register() failure
The function does not free 'of_ops' upon failure, leading to a memory
leak [1].

Fix by freeing 'of_ops' in the error path.

[1]
unreferenced object 0xffff8ee846198c80 (size 128):
  comm "swapper/0", pid 1, jiffies 4294699704 (age 70.076s)
  hex dump (first 32 bytes):
    00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00  ................
    d0 3f 6e 8c ff ff ff ff 00 00 00 00 00 00 00 00  .?n.............
  backtrace:
    [<00000000d136f562>] __kmalloc_node_track_caller+0x42/0x120
    [<0000000063f31678>] kmemdup+0x1d/0x40
    [<00000000e6d24096>] thermal_of_zone_register+0x49/0x520
    [<000000005e78c755>] devm_thermal_of_zone_register+0x54/0x90
    [<00000000ee6b209e>] pmbus_add_sensor+0x1b4/0x1d0
    [<00000000896105e3>] pmbus_add_sensor_attrs_one+0x123/0x440
    [<0000000049e990a6>] pmbus_add_sensor_attrs+0xfe/0x1d0
    [<00000000466b5440>] pmbus_do_probe+0x66b/0x14e0
    [<0000000084d42285>] i2c_device_probe+0x13b/0x2f0
    [<0000000029e2ae74>] really_probe+0xce/0x2c0
    [<00000000692df15c>] driver_probe_device+0x19/0xd0
    [<00000000547d9cce>] __device_attach_driver+0x6f/0x100
    [<0000000020abd24b>] bus_for_each_drv+0x76/0xc0
    [<00000000665d9563>] __device_attach+0xfc/0x180
    [<000000008ddd4d6a>] bus_probe_device+0x82/0xa0
    [<000000009e61132b>] device_add+0x3fe/0x920

Fixes: 3fd6d6e2b4 ("thermal/of: Rework the thermal device tree initialization")
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Reviewed-by: Vadim Pasternak <vadimp@nvidia.com>
Link: https://lore.kernel.org/r/20221020103658.802457-1-idosch@nvidia.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:39 +01:00
Keerthy a7c42af78b thermal/drivers/k3_j72xx_bandgap: Fix the debug print message
The debug print message to check the workaround applicability is inverted.
Fix the same.

Fixes: ffcb2fc86e ("thermal: k3_j72xx_bandgap: Add the bandgap driver support")
Reported-by: Bryan Brattlof <bb@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20221010034126.3550-1-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:39 +01:00
Marcus Folkesson d37edc7370 thermal/drivers/imx8mm_thermal: Validate temperature range
Check against the upper temperature limit (125 degrees C) before
consider the temperature valid.

Fixes: 5eed800a68 ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit")
Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:39 +01:00
Marcus Folkesson 1f455f144f thermal/drivers/imx8mm_thermal: Use GENMASK() when appropriate
GENMASK() is preferred to use for bitmasks.

Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com>
Link: https://lore.kernel.org/r/20221014081620.1599511-1-marcus.folkesson@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:39 +01:00
Srinivas Pandruvada 904f309ae7 thermal: intel: Don't set HFI status bit to 1
When CPU doesn't support HFI (Hardware Feedback Interface), don't include
BIT 26 in the mask to prevent clearing. otherwise this results in:
    unchecked MSR access error: WRMSR to 0x1b1
      (tried to write 0x0000000004000aa8)
      at rIP: 0xffffffff8b8559fe (throttle_active_work+0xbe/0x1b0)

Fixes: 6fe1e64b60 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Linus Torvalds <torvalds@linux-foundation.org>
Tested-by: Linus Torvalds <torvalds@linux-foundation.org>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-12-14 14:50:15 +01:00
Linus Torvalds 691806e977 Thermal control updates for 6.2-rc1
- Fix race conditions related to thermal device operations that are not
    protected against thermal device removal (Guenter Roeck).
 
  - Fix error code in __thermal_cooling_device_register() (Dan Carpenter).
 
  - Validate new cooling device state (coming from user space) in
    cur_state_store() and reuse the max_state value from cooling device
    structure in the sysfs interface (Viresh Kumar).
 
  - Fix some possible name leaks in error paths in the thermal control
    core code (Yang Yingliang).
 
  - Detect TCC lock bit set in the intel_tcc_cooling driver and make it
    refuse to update the TCC offset in that case (Zhang Rui).
 
  - Add TCC cooling support for RaptorLake-S (Zhang Rui).
 
  - Prevent accidental clearing of HFI status by one of the other
    drivers using the same status register (Srinivas Pandruvada).
 
  - Protect clearing of thermal status bits in Intel thermal control
    drivers (Srinivas Pandruvada).
 
  - Allow the HFI thermal control driver to ACK an HFI event for the
    previously observed timestamp (Srinivas Pandruvada).
 
  - Remove a pointless die_id check from the HFI thermal driver and
    adjust the definition a data structure used by it (Ricardo Neri).
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Merge tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
 "These include thermal core fixes to protect thermal device operations
  against thermal device removal, other thermal core fixes and updates
  of Intel thermal control drivers.

  Specifics:

   - Fix race conditions related to thermal device operations that are
     not protected against thermal device removal (Guenter Roeck)

   - Fix error code in __thermal_cooling_device_register() (Dan
     Carpenter)

   - Validate new cooling device state (coming from user space) in
     cur_state_store() and reuse the max_state value from cooling device
     structure in the sysfs interface (Viresh Kumar)

   - Fix some possible name leaks in error paths in the thermal control
     core code (Yang Yingliang)

   - Detect TCC lock bit set in the intel_tcc_cooling driver and make it
     refuse to update the TCC offset in that case (Zhang Rui)

   - Add TCC cooling support for RaptorLake-S (Zhang Rui)

   - Prevent accidental clearing of HFI status by one of the other
     drivers using the same status register (Srinivas Pandruvada)

   - Protect clearing of thermal status bits in Intel thermal control
     drivers (Srinivas Pandruvada)

   - Allow the HFI thermal control driver to ACK an HFI event for the
     previously observed timestamp (Srinivas Pandruvada)

   - Remove a pointless die_id check from the HFI thermal driver and
     adjust the definition a data structure used by it (Ricardo Neri)"

* tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal: intel: hfi: Remove a pointless die_id check
  thermal: core: fix some possible name leaks in error paths
  thermal: intel: hfi: ACK HFI for the same timestamp
  thermal: intel: Protect clearing of thermal status bits
  thermal: intel: Prevent accidental clearing of HFI status
  thermal/core: Protect thermal device operations against thermal device removal
  thermal/core: Remove thermal_zone_set_trips()
  thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex
  thermal/core: Protect hwmon accesses to thermal operations with thermal zone mutex
  thermal/core: Introduce locked version of thermal_zone_device_update
  thermal/core: Move parameter validation from __thermal_zone_get_temp to thermal_zone_get_temp
  thermal/core: Ensure that thermal device is registered in thermal_zone_get_temp
  thermal/core: Delete device under thermal device zone lock
  thermal/core: Destroy thermal zone device mutex in release function
  thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
  thermal: intel: intel_tcc_cooling: Detect TCC lock bit
  thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
  thermal/core: fix error code in __thermal_cooling_device_register()
  thermal: sysfs: Reuse cdev->max_state
  thermal: Validate new state in cur_state_store()
2022-12-12 13:45:21 -08:00
Linus Torvalds 456ed864fd ACPI updates for 6.2-rc1
- Update the ACPICA code in the kernel to the 20221020 upstream
    version and fix a couple of issues in it:
 
    * Make acpi_ex_load_op() match upstream implementation (Rafael
      Wysocki).
    * Add support for loong_arch-specific APICs in MADT (Huacai Chen).
    * Add support for fixed PCIe wake event (Huacai Chen).
    * Add EBDA pointer sanity checks (Vit Kabele).
    * Avoid accessing VGA memory when EBDA < 1KiB (Vit Kabele).
    * Add CCEL table support to both compiler/disassembler (Kuppuswamy
      Sathyanarayanan).
    * Add a couple of new UUIDs to the known UUID list (Bob Moore).
    * Add support for FFH Opregion special context data (Sudeep Holla).
    * Improve warning message for "invalid ACPI name" (Bob Moore).
    * Add support for CXL 3.0 structures (CXIMS & RDPAS) in the CEDT
      table (Alison Schofield).
    * Prepare IORT support for revision E.e (Robin Murphy).
    * Finish support for the CDAT table (Bob Moore).
    * Fix error code path in acpi_ds_call_control_method() (Rafael
      Wysocki).
    * Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage() (Li
      Zetao).
    * Update the version of the ACPICA code in the kernel (Bob Moore).
 
  - Use ZERO_PAGE(0) instead of empty_zero_page in the ACPI device
    enumeration code (Giulio Benetti).
 
  - Change the return type of the ACPI driver remove callback to void and
    update its users accordingly (Dawei Li).
 
  - Add general support for FFH address space type and implement the low-
    level part of it for ARM64 (Sudeep Holla).
 
  - Fix stale comments in the ACPI tables parsing code and make it print
    more messages related to MADT (Hanjun Guo, Huacai Chen).
 
  - Replace invocations of generic library functions with more kernel-
    specific counterparts in the ACPI sysfs interface (Christophe JAILLET,
    Xu Panda).
 
  - Print full name paths of ACPI power resource objects during
    enumeration (Kane Chen).
 
  - Eliminate a compiler warning regarding a missing function prototype
    in the ACPI power management code (Sudeep Holla).
 
  - Fix and clean up the ACPI processor driver (Rafael Wysocki, Li Zhong,
    Colin Ian King, Sudeep Holla).
 
  - Add quirk for the HP Pavilion Gaming 15-cx0041ur to the ACPI EC
    driver (Mia Kanashi).
 
  - Add some mew ACPI backlight handling quirks and update some existing
    ones (Hans de Goede).
 
  - Make the ACPI backlight driver prefer the native backlight control
    over vendor backlight control when possible (Hans de Goede).
 
  - Drop unsetting ACPI APEI driver data on remove (Uwe Kleine-König).
 
  - Use xchg_release() instead of cmpxchg() for updating new GHES cache
    slots (Ard Biesheuvel).
 
  - Clean up the ACPI APEI code (Sudeep Holla, Christophe JAILLET, Jay Lu).
 
  - Add new I2C device enumeration quirks for Medion Lifetab S10346 and
    Lenovo Yoga Tab 3 Pro (YT3-X90F) (Hans de Goede).
 
  - Make the ACPI battery driver notify user space about adding new
    battery hooks and removing the existing ones (Armin Wolf).
 
  - Modify the pfr_update and pfr_telemetry drivers to use ACPI_FREE()
    for freeing acpi_object structures to help diagnostics (Wang ShaoBo).
 
  - Make the ACPI fan driver use sysfs_emit_at() in its sysfs interface
    code (ye xingchen).
 
  - Fix the _FIF package extraction failure handling in the ACPI fan
    driver (Hanjun Guo).
 
  - Fix the PCC mailbox handling error code path (Huisong Li).
 
  - Avoid using PCC Opregions if there is no platform interrupt allocated
    for this purpose (Huisong Li).
 
  - Use sysfs_emit() instead of scnprintf() in the ACPI PAD driver and
    CPPC library (ye xingchen).
 
  - Fix some kernel-doc issues in the ACPI GSI processing code (Xiongfeng
    Wang).
 
  - Fix name memory leak in pnp_alloc_dev() (Yang Yingliang).
 
  - Do not disable PNP devices on suspend when they cannot be re-enabled
    on resume (Hans de Goede).
 
  - Clean up the ACPI thermal driver a bit (Rafael Wysocki).
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Merge tag 'acpi-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull ACPI and PNP updates from Rafael Wysocki:
 "These include new code (for instance, support for the FFH address
  space type and support for new firmware data structures in ACPICA),
  some new quirks (mostly related to backlight handling and I2C
  enumeration), a number of fixes and a fair amount of cleanups all
  over.

  Specifics:

   - Update the ACPICA code in the kernel to the 20221020 upstream
     version and fix a couple of issues in it:
      - Make acpi_ex_load_op() match upstream implementation (Rafael
        Wysocki)
      - Add support for loong_arch-specific APICs in MADT (Huacai Chen)
      - Add support for fixed PCIe wake event (Huacai Chen)
      - Add EBDA pointer sanity checks (Vit Kabele)
      - Avoid accessing VGA memory when EBDA < 1KiB (Vit Kabele)
      - Add CCEL table support to both compiler/disassembler (Kuppuswamy
        Sathyanarayanan)
      - Add a couple of new UUIDs to the known UUID list (Bob Moore)
      - Add support for FFH Opregion special context data (Sudeep
        Holla)
      - Improve warning message for "invalid ACPI name" (Bob Moore)
      - Add support for CXL 3.0 structures (CXIMS & RDPAS) in the CEDT
        table (Alison Schofield)
      - Prepare IORT support for revision E.e (Robin Murphy)
      - Finish support for the CDAT table (Bob Moore)
      - Fix error code path in acpi_ds_call_control_method() (Rafael
        Wysocki)
      - Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage() (Li
        Zetao)
      - Update the version of the ACPICA code in the kernel (Bob Moore)

   - Use ZERO_PAGE(0) instead of empty_zero_page in the ACPI device
     enumeration code (Giulio Benetti)

   - Change the return type of the ACPI driver remove callback to void
     and update its users accordingly (Dawei Li)

   - Add general support for FFH address space type and implement the
     low- level part of it for ARM64 (Sudeep Holla)

   - Fix stale comments in the ACPI tables parsing code and make it
     print more messages related to MADT (Hanjun Guo, Huacai Chen)

   - Replace invocations of generic library functions with more kernel-
     specific counterparts in the ACPI sysfs interface (Christophe
     JAILLET, Xu Panda)

   - Print full name paths of ACPI power resource objects during
     enumeration (Kane Chen)

   - Eliminate a compiler warning regarding a missing function prototype
     in the ACPI power management code (Sudeep Holla)

   - Fix and clean up the ACPI processor driver (Rafael Wysocki, Li
     Zhong, Colin Ian King, Sudeep Holla)

   - Add quirk for the HP Pavilion Gaming 15-cx0041ur to the ACPI EC
     driver (Mia Kanashi)

   - Add some mew ACPI backlight handling quirks and update some
     existing ones (Hans de Goede)

   - Make the ACPI backlight driver prefer the native backlight control
     over vendor backlight control when possible (Hans de Goede)

   - Drop unsetting ACPI APEI driver data on remove (Uwe Kleine-König)

   - Use xchg_release() instead of cmpxchg() for updating new GHES cache
     slots (Ard Biesheuvel)

   - Clean up the ACPI APEI code (Sudeep Holla, Christophe JAILLET, Jay
     Lu)

   - Add new I2C device enumeration quirks for Medion Lifetab S10346 and
     Lenovo Yoga Tab 3 Pro (YT3-X90F) (Hans de Goede)

   - Make the ACPI battery driver notify user space about adding new
     battery hooks and removing the existing ones (Armin Wolf)

   - Modify the pfr_update and pfr_telemetry drivers to use ACPI_FREE()
     for freeing acpi_object structures to help diagnostics (Wang
     ShaoBo)

   - Make the ACPI fan driver use sysfs_emit_at() in its sysfs interface
     code (ye xingchen)

   - Fix the _FIF package extraction failure handling in the ACPI fan
     driver (Hanjun Guo)

   - Fix the PCC mailbox handling error code path (Huisong Li)

   - Avoid using PCC Opregions if there is no platform interrupt
     allocated for this purpose (Huisong Li)

   - Use sysfs_emit() instead of scnprintf() in the ACPI PAD driver and
     CPPC library (ye xingchen)

   - Fix some kernel-doc issues in the ACPI GSI processing code
     (Xiongfeng Wang)

   - Fix name memory leak in pnp_alloc_dev() (Yang Yingliang)

   - Do not disable PNP devices on suspend when they cannot be
     re-enabled on resume (Hans de Goede)

   - Clean up the ACPI thermal driver a bit (Rafael Wysocki)"

* tag 'acpi-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (67 commits)
  ACPI: x86: Add skip i2c clients quirk for Medion Lifetab S10346
  ACPI: APEI: EINJ: Refactor available_error_type_show()
  ACPI: APEI: EINJ: Fix formatting errors
  ACPI: processor: perflib: Adjust acpi_processor_notify_smm() return value
  ACPI: processor: perflib: Rearrange acpi_processor_notify_smm()
  ACPI: processor: perflib: Rearrange unregistration routine
  ACPI: processor: perflib: Drop redundant parentheses
  ACPI: processor: perflib: Adjust white space
  ACPI: processor: idle: Drop unnecessary statements and parens
  ACPI: thermal: Adjust critical.flags.valid check
  ACPI: fan: Convert to use sysfs_emit_at() API
  ACPICA: Fix use-after-free in acpi_ut_copy_ipackage_to_ipackage()
  ACPI: battery: Call power_supply_changed() when adding hooks
  ACPI: use sysfs_emit() instead of scnprintf()
  ACPI: x86: Add skip i2c clients quirk for Lenovo Yoga Tab 3 Pro (YT3-X90F)
  ACPI: APEI: Remove a useless include
  PNP: Do not disable devices on suspend when they cannot be re-enabled on resume
  ACPI: processor: Silence missing prototype warnings
  ACPI: processor_idle: Silence missing prototype warnings
  ACPI: PM: Silence missing prototype warning
  ...
2022-12-12 13:38:17 -08:00
Rafael J. Wysocki 75b15aa0d8 Merge branch 'thermal-intel'
Merge one more Intel thermal control change for 6.2-rc1:

 - Remove a pointless die_id chec from the Intel HFI thermal control
   driver (Ricardo Neri).

* thermal-intel:
  thermal: intel: hfi: Remove a pointless die_id check
2022-12-12 16:54:14 +01:00
Ricardo Neri 3a3073b69c thermal: intel: hfi: Remove a pointless die_id check
die_id is an u16 quantity. On single-die systems the default value of
die_id is 0. No need to check for negative values.

Plus, removing this check makes Coverity happy.

Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-12-02 20:47:52 +01:00
Rafael J. Wysocki 7d4b19ab6b Merge Intel thermal control drivers changes for v6.2
- Add Raptor Lake-S support to the intel_tcc_cooling driver (Zhang
   Rui).

 - Make the intel_tcc_cooling driver detect TCC locking (Zhang Rui).

 - Address Coverity warning in intel_hfi_process_event() (Ricardo Neri).

 - Prevent accidental clearing of HFI in the package thermal interrupt
   status (Srinivas Pandruvada).

 - Protect the clearing of status bits in MSR_IA32_PACKAGE_THERM_STATUS
   and MSR_IA32_THERM_STATUS (Srinivas Pandruvada).

 - Allow the HFI interrupt handler to ACK an event for the same
   timestamp (Srinivas Pandruvada).

* thermal-intel:
  thermal: intel: hfi: ACK HFI for the same timestamp
  thermal: intel: Protect clearing of thermal status bits
  thermal: intel: Prevent accidental clearing of HFI status
  thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
  thermal: intel: intel_tcc_cooling: Detect TCC lock bit
  thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
2022-12-02 19:39:07 +01:00
Yang Yingliang 4748f9687c thermal: core: fix some possible name leaks in error paths
In some error paths before device_register(), the names allocated
by dev_set_name() are not freed. Move dev_set_name() front to
device_register(), so the name can be freed while calling
put_device().

Fixes: 1dd7128b83 ("thermal/core: Fix null pointer dereference in thermal_release()")
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-25 19:51:41 +01:00
Srinivas Pandruvada c0e3acdcde thermal: intel: hfi: ACK HFI for the same timestamp
Some processors issue more than one HFI interrupt with the same
timestamp. Each interrupt must be acknowledged to let the hardware issue
new HFI interrupts. But this can't be done without some additional flow
modification in the existing interrupt handling.

For background, the HFI interrupt is a package level thermal interrupt
delivered via a LVT. This LVT is common for both the CPU and package
level interrupts. Hence, all CPUs receive the HFI interrupts. But only
one CPU should process interrupt and others simply exit by issuing EOI
to LAPIC.

The current HFI interrupt processing flow:

  1. Receive Thermal interrupt
  2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS
  3. Try and get spinlock, one CPU will enter spinlock and others
     will simply return from here to issue EOI.
    (Let's assume CPU 4 is processing interrupt)
  4. Check the stored time-stamp from the HFI memory time-stamp
  5. if same
  6.      ignore interrupt, unlock and return
  7. Copy the HFI message to local buffer
  8. unlock spinlock
  9. ACK HFI interrupt
 10. Queue the message for processing in a work-queue

It is tempting to simply acknowledge all the interrupts even if they
have the same timestamp. This may cause some interrupts to not be
processed.

Let's say CPU5 is slightly late and reaches step 4 while CPU4 is
between steps 8 and 9.

Currently we simply ignore interrupts with the same timestamp. No
issue here for CPU5. When CPU4 acknowledges the interrupt, the next
HFI interrupt can be delivered.

If we acknowledge interrupts with the same timestamp (at step 6), there
is a race condition. Under the same scenario, CPU 5 will acknowledge
the HFI interrupt. This lets hardware generate another HFI interrupt,
before CPU 4 start executing step 9. Once CPU 4 complete step 9, it
will acknowledge the newly arrived HFI interrupt, without actually
processing it.

Acknowledge the interrupt when holding the spinlock. This avoids
contention of the interrupt acknowledgment.

Updated flow:

  1. Receive HFI Thermal interrupt
  2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS
  3. Try and get spin-lock
     Let's assume CPU 4 is processing interrupt
  4.1 Read MSR_IA32_PACKAGE_THERM_STATUS and check HFI status bit
  4.2	If hfi status is 0
  4.3		unlock spinlock
  4.4		return
  4.5 Check the stored time-stamp from the HFI memory time-stamp
  5. if same
  6.1      ACK HFI Interrupt,
  6.2	unlock spinlock
  6.3	return
  7. Copy the HFI message to local buffer
  8. ACK HFI interrupt
  9. unlock spinlock
 10. Queue the message for processing in a work-queue

To avoid taking the lock unnecessarily, intel_hfi_process_event() checks
the status of the HFI interrupt before taking the lock. If CPU5 is late,
when it starts processing the interrupt there are two scenarios:

 a) CPU4 acknowledged the HFI interrupt before CPU5 read
    MSR_IA32_THERM_STATUS. CPU5 exits.

 b) CPU5 reads MSR_IA32_THERM_STATUS before CPU4 has acknowledged the
    interrupt. CPU5 will take the lock if CPU4 has released it. It then
    re-reads MSR_IA32_THERM_STATUS. If there is not a new interrupt,
    the HFI status bit is clear and CPU5 exits. If a new HFI interrupt
    was generated it will find that the status bit is set and it will
    continue to process the interrupt. In this case even if timestamp
    is not changed, the ACK can be issued as this is a new interrupt.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Tested-by: Arshad, Adeel<adeel.arshad@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23 20:13:22 +01:00
Srinivas Pandruvada 930d06bf07 thermal: intel: Protect clearing of thermal status bits
The clearing of the package thermal status is done by Read-Modify-Write
operation. This may result in clearing of some new status bits which are
being or about to be processed.

For example, while clearing of HFI status, after read of thermal status
register, a new thermal status bit is set by the hardware. But during
write back, the newly generated status bit will be set to 0 or cleared.
So, it is not safe to do read-modify-write.

Since thermal status Read-Write bits can be set to only 0 not 1, it is
safe to set all other bits to 1 which are not getting cleared.

Create a common interface for clearing package thermal status bits. Use
this interface to replace existing code to clear thermal package status
bits.

It is safe to call from different CPUs without protection as there is no
read-modify-write. Also wrmsrl results in just single instruction. For
example while CPU 0 and CPU 3 are clearing bit 1 and 3 respectively. If
CPU 3 wins the race, it will write 0x4000aa2, then CPU 1 will write
0x4000aa8. The bits which are not part of clear are set to 1. The default
mask for bits, which can be written here is 0x4000aaa.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23 20:09:06 +01:00
Srinivas Pandruvada 6fe1e64b60 thermal: intel: Prevent accidental clearing of HFI status
When there is a package thermal interrupt with PROCHOT log, it will be
processed and cleared. It is possible that there is an active HFI event
status, which is about to get processed or getting processed. While
clearing PROCHOT log bit, it will also clear HFI status bit. This means
that hardware is free to update HFI memory.

When clearing a package thermal interrupt, some processors will generate
a "general protection fault" when any of the read only bit is set to 1.

The driver maintains a mask of all read-write bits which can be set.

This mask doesn't include HFI status bit. This bit will also be cleared,
as it will be assumed read-only bit. So, add HFI status bit 26 to the
mask.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23 20:09:06 +01:00
Dawei Li 6c0eb5ba35 ACPI: make remove callback of ACPI driver void
For bus-based driver, device removal is implemented as:
1 device_remove()->
2   bus->remove()->
3     driver->remove()

Driver core needs no inform from callee(bus driver) about the
result of remove callback. In that case, commit fc7a6209d5
("bus: Make remove callback return void") forces bus_type::remove
be void-returned.

Now we have the situation that both 1 & 2 of calling chain are
void-returned, so it does not make much sense for 3(driver->remove)
to return non-void to its caller.

So the basic idea behind this change is making remove() callback of
any bus-based driver to be void-returned.

This change, for itself, is for device drivers based on acpi-bus.

Acked-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Lee Jones <lee@kernel.org>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Reviewed-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Dawei Li <set_pte_at@outlook.com>
Reviewed-by: Maximilian Luz <luzmaximilian@gmail.com>  # for drivers/platform/surface/*
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23 19:11:22 +01:00
Arnd Bergmann a6eeafba11 firmware: tegra: Changes for v6.2-rc1
This adds new BPMP ABI so that newer features can be enabled.
 Furthermore, the BPMP driver is updated to use iosys-map helpers to
 allow working with shared memory regions that are located in system
 memory.
 
 Apart from that, several minor cleanups are included.
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Merge tag 'tegra-for-6.2-firmware-v2' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux into soc/drivers

firmware: tegra: Changes for v6.2-rc1

This adds new BPMP ABI so that newer features can be enabled.
Furthermore, the BPMP driver is updated to use iosys-map helpers to
allow working with shared memory regions that are located in system
memory.

Apart from that, several minor cleanups are included.

* tag 'tegra-for-6.2-firmware-v2' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
  firmware: tegra: Remove surplus dev_err() when using platform_get_irq_byname()
  firmware: tegra: Update BPMP ABI
  firmware: tegra: bpmp: Do not support big-endian
  firmware: tegra: bpmp: Use iosys-map helpers
  firmware: tegra: bpmp: Prefer u32 over uint32_t

Link: https://lore.kernel.org/r/20221121171239.2041835-2-thierry.reding@gmail.com
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
2022-11-22 22:14:39 +01:00
Guenter Roeck b778b4d782 thermal/core: Protect thermal device operations against thermal device removal
Thermal device operations may be called after thermal zone device removal.
After thermal zone device removal, thermal zone device operations must
no longer be called. To prevent such calls from happening, ensure that
the thermal device is registered before executing any thermal device
operations.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck 91b3aafc22 thermal/core: Remove thermal_zone_set_trips()
Since no callers of thermal_zone_set_trips() are left, remove the function.
Document __thermal_zone_set_trips() instead. Explicitly state that the
thermal zone lock must be held when calling the function, and that the
pointer to the thermal zone must be valid.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck 05eeee2b51 thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex
Protect access to thermal operations against thermal zone removal by
acquiring the thermal zone device mutex. After acquiring the mutex, check
if the thermal zone device is registered and abort the operation if not.

With this change, we can call __thermal_zone_device_update() instead of
thermal_zone_device_update() from trip_point_temp_store() and from
emul_temp_store(). Similar, we can call __thermal_zone_set_trips() instead
of thermal_zone_set_trips() from trip_point_hyst_store().

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck ea37bec51f thermal/core: Protect hwmon accesses to thermal operations with thermal zone mutex
In preparation to protecting access to thermal operations against thermal
zone device removal, protect hwmon accesses to thermal zone operations
with the thermal zone mutex. After acquiring the mutex, ensure that the
thermal zone device is registered before proceeding.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck 1c439dec35 thermal/core: Introduce locked version of thermal_zone_device_update
In thermal_zone_device_set_mode(), the thermal zone mutex is released only
to be reacquired in the subsequent call to thermal_zone_device_update().

Introduce __thermal_zone_device_update(), which is similar to
thermal_zone_device_update() but has to be called with the thermal device
mutex held. Call the new function from thermal_zone_device_set_mode()
to avoid the extra thermal device mutex release/acquire sequence in that
function.

With the new function in place, re-implement thermal_zone_device_update()
as wrapper around __thermal_zone_device_update() to acquire and release
the thermal device mutex.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck ed97d10a8b thermal/core: Move parameter validation from __thermal_zone_get_temp to thermal_zone_get_temp
All callers of __thermal_zone_get_temp() already validated the
thermal zone parameters. Move validation to thermal_zone_get_temp()
where it is actually needed. Also add kernel documentation for
__thermal_zone_get_temp(), listing the requirement that the
function must be called with validated parameters and with thermal
device mutex held.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck 1c6b300607 thermal/core: Ensure that thermal device is registered in thermal_zone_get_temp
Calls to thermal_zone_get_temp() are not protected against thermal zone
device removal. As result, it is possible that the thermal zone operations
callbacks are no longer valid when thermal_zone_get_temp() is called.
This may result in crashes such as

BUG: unable to handle page fault for address: ffffffffc04ef420
 #PF: supervisor read access in kernel mode
 #PF: error_code(0x0000) - not-present page
PGD 5d60e067 P4D 5d60e067 PUD 5d610067 PMD 110197067 PTE 0
Oops: 0000 [#1] PREEMPT SMP NOPTI
CPU: 1 PID: 3209 Comm: cat Tainted: G        W         5.10.136-19389-g615abc6eb807 #1 02df41ac0b12f3a64f4b34245188d8875bb3bce1
Hardware name: Google Coral/Coral, BIOS Google_Coral.10068.92.0 11/27/2018
RIP: 0010:thermal_zone_get_temp+0x26/0x73
Code: 89 c3 eb d3 0f 1f 44 00 00 55 48 89 e5 41 57 41 56 53 48 85 ff 74 50 48 89 fb 48 81 ff 00 f0 ff ff 77 44 48 8b 83 98 03 00 00 <48> 83 78 10 00 74 36 49 89 f6 4c 8d bb d8 03 00 00 4c 89 ff e8 9f
RSP: 0018:ffffb3758138fd38 EFLAGS: 00010287
RAX: ffffffffc04ef410 RBX: ffff98f14d7fb000 RCX: 0000000000000000
RDX: ffff98f17cf90000 RSI: ffffb3758138fd64 RDI: ffff98f14d7fb000
RBP: ffffb3758138fd50 R08: 0000000000001000 R09: ffff98f17cf90000
R10: 0000000000000000 R11: ffffffff8dacad28 R12: 0000000000001000
R13: ffff98f1793a7d80 R14: ffff98f143231708 R15: ffff98f14d7fb018
FS:  00007ec166097800(0000) GS:ffff98f1bbd00000(0000) knlGS:0000000000000000
CS:  0010 DS: 0000 ES: 0000 CR0: 0000000080050033
CR2: ffffffffc04ef420 CR3: 000000010ee9a000 CR4: 00000000003506e0
Call Trace:
 temp_show+0x31/0x68
 dev_attr_show+0x1d/0x4f
 sysfs_kf_seq_show+0x92/0x107
 seq_read_iter+0xf5/0x3f2
 vfs_read+0x205/0x379
 __x64_sys_read+0x7c/0xe2
 do_syscall_64+0x43/0x55
 entry_SYSCALL_64_after_hwframe+0x61/0xc6

if a thermal device is removed while accesses to its device attributes
are ongoing.

The problem is exposed by code in iwl_op_mode_mvm_start(), which registers
a thermal zone device only to unregister it shortly afterwards if an
unrelated failure is encountered while accessing the hardware.

Check if the thermal zone device is registered after acquiring the
thermal zone device mutex to ensure this does not happen.

The code was tested by triggering the failure in iwl_op_mode_mvm_start()
on purpose. Without this patch, the kernel crashes reliably. The crash
is no longer observed after applying this and the preceding patches.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck 30b2ae07d3 thermal/core: Delete device under thermal device zone lock
Thermal device attributes may still be opened after unregistering
the thermal zone and deleting the thermal device.

Currently there is no protection against accessing thermal device
operations after unregistering a thermal zone. To enable adding
such protection, protect the device delete operation with the
thermal zone device mutex. This requires splitting the call to
device_unregister() into its components, device_del() and put_device().
Only the first call can be executed under mutex protection, since
put_device() may result in releasing the thermal zone device memory.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Guenter Roeck d35f29ed9d thermal/core: Destroy thermal zone device mutex in release function
Accesses to thermal zones, and with it the thermal zone device mutex,
are still possible after the thermal zone device has been unregistered.
For example, thermal_zone_get_temp() can be called from temp_show()
in thermal_sysfs.c if the sysfs attribute was opened before the thermal
device was unregistered.

Move the call to mutex_destroy from thermal_zone_device_unregister()
to thermal_release() to ensure that it is only destroyed after it is
guaranteed to be no longer accessed.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14 19:04:37 +01:00
Zhang Rui e77f069fd6 thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
Add RaptorLake to the list of processor models supported by the Intel
TCC cooling driver.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-09 14:58:02 +01:00
Zhang Rui be6abd3ed6 thermal: intel: intel_tcc_cooling: Detect TCC lock bit
When MSR_IA32_TEMPERATURE_TARGET is locked, TCC Offset can not be
updated even if the PROGRAMMABE Bit is set.

Yield the driver on platforms with MSR_IA32_TEMPERATURE_TARGET locked.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-09 14:58:02 +01:00
Ricardo Neri 54d9135cf2 thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
A Coverity static code scan raised a potential overflow_before_widen
warning when hfi_features::nr_table_pages is used as an argument to
memcpy in intel_hfi_process_event().

Even though the overflow can never happen (the maximum number of pages of
the HFI table is 0x10 and 0x10 << PAGE_SHIFT = 0x10000), using size_t as
the data type of hfi_features::nr_table_pages makes Coverity happy and
matches the data type of the argument 'size' of memcpy().

Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-28 20:11:48 +02:00