As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
In order to use thermal trips defined in the thermal structure, rename
the 'trips' field to 'num_trips' to have the 'trips' field containing the
thermal trip points.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
All NVIDIA Tegra30 SoCs have a two-channel on-chip sensor unit which
monitors temperature and voltage of the SoC. Sensors control CPU frequency
throttling, which is activated by hardware once preprogrammed temperature
level is breached, they also send signal to Power Management controller to
perform emergency shutdown on a critical overheat of the SoC die. Add
driver for the Tegra30 TSENSOR module, exposing it as a thermal sensor.
Tested-by: Andreas Westman Dorcsak <hedmoo@yahoo.com> # Asus TF700T
Tested-by: Maxim Schwalm <maxim.schwalm@gmail.com> # Asus TF700T
Tested-by: Svyatoslav Ryhel <clamor95@gmail.com> # Asus TF201T
Tested-by: Ihor Didenko <tailormoon@rambler.ru> # Asus TF300T
Tested-by: Ion Agorria <ion@agorria.com> # Asus TF201T
Tested-by: Matt Merhar <mattmerhar@protonmail.com> # Ouya
Tested-by: Peter Geis <pgwipeout@gmail.com> # Ouya
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-4-digetx@gmail.com
Daniel Lezcano