Sync code to the same with tk4 pub/lts/0017-kabi, except deleted rue
and wujing. Partners can submit pull requests to this branch, and we
can pick the commits to tk4 pub/lts/0017-kabi easly.
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 or
later as published by the free software foundation this program is
distributed in the hope that it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-or-later
has been chosen to replace the boilerplate/reference in 6 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Richard Fontana <rfontana@redhat.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190520075211.856638608@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Increasingly, Linux is running on thermally constrained devices. The simple
thermal relationship between processor and fan has become past for modern
computers.
As hardware vendors cope with the thermal constraints on their products,
more sensors are added, new cooling capabilities are introduced. The
complexity of the thermal relationship can grow exponentially among cooling
devices, zones, sensors, and trip points. They can also change dynamically.
To expose such relationship to the userspace, Linux generic thermal layer
introduced sysfs entry at /sys/class/thermal with a matrix of symbolic
links, trip point bindings, and device instances. To traverse such
matrix by hand is not a trivial task. Testing is also difficult in that
thermal conditions are often exception cases that hard to reach in
normal operations.
TMON is conceived as a tool to help visualize, tune, and test the
complex thermal subsystem.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Jianping Liu