This patch updates the documentation for thermal_zone_bind_cooling_device
and removes the warnings generated by scripts/kernel-doc -v.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As per the comment at the top of this file, this is a GPLv2 driver.
This patch updates the driver license accordingly.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The list is not needed so far. Thus removing it.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Just for style purposes, remove extra curl brackets.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Limit the amount of bytes written to dev_name by
secure writing with snprintf.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update comments for this exported function.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add proper documentation for exported function cpufreq_cooling_register.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update kernel-doc comment and documentation for cpufreq_thermal_notifier.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add documentation for cpufreq_get_cooling_level. As this
is an exported function, it has to be documented.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As this is one of the central functions of this file,
it deserves a proper documentation. This patch improves
the existing comment to format it as a kernel-doc style.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update documentation for is_cpufreq_valid function so
that kernel-doc does not complain about return value.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
level will be used only if GET_FREQ mode is requested.
There is no potential harm with current code. But for
cleaning the compilation log, this patch initializes
level to zero.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Restrict the usage to GPL modules.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Simple fixes for making kernel_doc happy about
struct cpufreq_cooling_device. Includes also a minor
spelling fix.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
clk_{un}prepare APIs are required to migrate to common
clock framework. While at it convert to use devm_clk_get as
it removes some cleanup code.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This code doesn't work on big endian systems because we're storing low
values in the high bits of the unsigned long. It makes it a very high
value instead.
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.
It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.
Build them into one module in this patch.
This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.
No functional change in this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
In multiplatform configurations, we cannot include headers
provided by only the exynos platform. Fortunately a number
of drivers that include those headers do not actually need
them, so we can just remove the inclusions.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
When selecting a target cooling state in get_target_state(), make sure
that the state is at least as high as the minimum when the temperature
is rising and at least as low as the maximum when the temperature is
falling. This is necessary because, in the THREAML_TREND_RAISING and
THERMAL_TREND_DROPPING cases, the current state may only be incremented
or decremented by one even if it is outside the bounds of the thermal
instance. This might occur, for example, if the CPU is heating up
and hits a thermal trip point for the first time when it's frequency
is much higher than the range specified by the thermal instance
corresponding to the trip point.
Signed-off-by: Andrew Bresticker <abrestic@chromium.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.
In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Current rcar_thermal() didn't care about own power.
Without this patch, rcar_thermal doesn't work on APE6 board
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Current rcar_thermal driver didn't care about rcar_theraml_irq_disable()
when registration failure case on _probe(), and _remove().
And, it returns without unregistering thermal zone when
registration failure case on _probe().
This patch fixes these issue.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.
Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.
The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.
Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The currently formula has been taken from the 88AP510 SoC datasheet,
which is not exactly correct. The correct value for the temperature
in Celcius of the sensor present in this SoC is:
Celsius = (322-reg)/1.3625
Signed-off-by: Lior Amsalem <alior@marvell.com>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Acked-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The currently formula has been taken from the 88AP510 SoC datasheet,
which is not exactly correct. The correct value for the temperature
in Celcius of the sensor present in this SoC is:
Celsius = (322-reg)/1.3625
Signed-off-by: Lior Amsalem <alior@marvell.com>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Acked-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The correct value is obtain by first shifting the register by the offset,
later applying the valid mask and finally invert the result.
This check was lacking an extra parenthesis to be strictly correct.
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
thermal_zone_device_register() returns ERR_PTR on error, thus use
IS_ERR rather than IS_ERR_OR_NULL to check return value.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
cpufreq cooling uses different frequencies as different cooling states.
But the per_cpu cpufreq_frequency_table may contain duplicate,
invalid entries, and it may be in either ascending or descending order.
And currently, code for parsing the per_cpu cpufreq_frequency_table
is used in several places and inconsistent.
Now introduce new code to
1. get the maximum cooling states
2. translate cooling state to cpu frequency
3. translate cpu frequency to cooling state
in one place,
with the correct logic of handling per_cpu cpufreq_frequency_table.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
we are returning EINVAL while the thermal_zone_device_register function fail.
instead we can use the return value from the thermal_zone_device_register by
using PTR_ERR.
Signed-off-by: Devendra Naga <devendra.aaru@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
thermal_zone_device_register returns a value contained in the pointer itself
use PTR_ERR to obtain the address and return it at the end.
Signed-off-by: Devendra Naga <devendra.aaru@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Acked-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Andrew Lunn <andrew@lunn.ch>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add the missing unlock before return from function rcar_thermal_update_temp()
in the error handling case.
Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The new intel_powerclamp thermal cooling device driver was merged in
commit 2af78448ff (Pull thermal management updates from Zhang Rui)
without any data conflicts. But there was a more subtle conflict I
missed: the driver uses MAX_USER_RT_PRIO, but commit 8bd75c77b7
("sched/rt: Move rt specific bits into new header file") had moved that
define from <linux/sched.h> to <linux/sched/rt.h>.
Which caused this build failure:
drivers/thermal/intel_powerclamp.c: In function ‘clamp_thread’:
drivers/thermal/intel_powerclamp.c:360:21: error: ‘MAX_USER_RT_PRIO’ undeclared (first use in this function)
drivers/thermal/intel_powerclamp.c:360:21: note: each undeclared identifier is reported only once for each function it appears in
And because I don't do a full "make allmodconfig" build after each pull,
I didn't notice until too late. So now the fix is here, separately from
the merge commit.
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
Pull thermal management updates from Zhang Rui:
"Highlights:
- introduction of Dove thermal sensor driver.
- introduction of Kirkwood thermal sensor driver.
- introduction of intel_powerclamp thermal cooling device driver.
- add interrupt and DT support for rcar thermal driver.
- add thermal emulation support which allows platform thermal driver
to do software/hardware emulation for thermal issues."
* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
thermal: rcar: remove __devinitconst
thermal: return an error on failure to register thermal class
Thermal: rename thermal governor Kconfig option to avoid generic naming
thermal: exynos: Use the new thermal trend type for quick cooling action.
Thermal: exynos: Add support for temperature falling interrupt.
Thermal: Dove: Add Themal sensor support for Dove.
thermal: Add support for the thermal sensor on Kirkwood SoCs
thermal: rcar: add Device Tree support
thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
thermal: rcar: add interrupt support
thermal: rcar: add read/write functions for common/priv data
thermal: rcar: multi channel support
thermal: rcar: use mutex lock instead of spin lock
thermal: rcar: enable CPCTL to use hardware TSC deciding
thermal: rcar: use parenthesis on macro
Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
Thermal: fix a wrong comment
thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
PM: intel_powerclamp: off by one in start_power_clamp()
thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
...
Convert to the much saner new idr interface.
Signed-off-by: Tejun Heo <tj@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
commit 76cc18874 "thermal: rcar: add Device Tree support"
added device tree support for this driver, but also added
an instance of __devinitconst, which is no longer defined
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Zhang Rui <rui.zhang@intel.com>
The return code from the registration of the thermal class is used to
unallocate resources, but this failure isn't passed back to the caller of
thermal_init. Return this failure back to the caller.
This bug was introduced in changeset 4cb18728 which overwrote the return code
when the variable was re-used to catch the return code of the registration of
the genetlink thermal socket family.
Signed-off-by: Richard Guy Briggs <rbriggs@redhat.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.
Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch uses the quick thermal cooling trend type macros. This is needed
as exynos5 and other thermal sensors now supports only interrupt method for
thresold temperature check.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch introduces using temperature falling interrupt in exynos
thermal driver. Former patch, it only use polling way to check
whether if system themperature is fallen. However, exynos SOC also
provides temperature falling interrupt way to do same things by hw.
This feature is not supported in exynos4210.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.
Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Support for loading the Renesas R-Car thermal module via devicetree.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Machine/System power-off is run in thermal frame work if
it become critical temperature.
This patch removed pointless machine_power_off()
from thermal_zone_device_ops :: .notify
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds interrupt support for R-Car thermal driver.
New generation R-Car thermal sensor interrupt controller was
different from old generation.
This patch supports new generation sensor only,
since the old generation interrupt controller had never been used before,
and will never be used in the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
R-Car thermal driver will use struct common in next
feature (interrupt support).
But the register address is different between struct priv and common.
This patch adds read/write functions for struct common,
and use macro technique to avoid wrong register access.
This is preparation patch for next feature (interrupt support),
therefore, there is no user to use this common read/write
function at this point.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
R-Car thermal sensor will be multi channel sensor in next generation.
But "IRQ controlling method" and "register mapping" are
different between old/new chip.
This patch adds multi sensor support.
Then, this driver assumes there is common register
if platform has IRQ resource.
The IRQ will be supported soon.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Current R-Car thermal driver is using spin lock for each
registers read/write, but it is pointless lock.
This lock is required while reading temperature,
but it needs long wait (= 300ms).
So, this patch used mutex lock while reading temperature,
instead of spin lock for each registers.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
If CPCTL was 1 on R-Car thermal, the thermal comparator offset
is automatically decided by hardware.
And this CPCTL is the conditions which validate interrupt.
This patch enabled CPCTL.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
"level" parameter of get_cpu_frequency equals cooling state
of cpu cooling device, and it starts from 0.
Fix the misleading comment.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.
This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This value has already been clamped correctly to 0 through 49 in
powerclamp_set_cur_state() so this patch doesn't actually change
anything. But we should fix it anyway for consistency.
set_target_ratio is used as an offset into an array with
MAX_TARGET_RATIO (50) elements.
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Below fixes are done to support falling threshold interrupt,
* Falling interrupt status macro corrected according to exynos5 data sheet.
* The get trend function modified to calculate trip temperature correctly.
* The clearing of interrupt status in the isr is now done after handling
the event that caused the interrupt.
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.
Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.
Please refer to Documentation/thermal/intel_powerclamp.txt for more details.
Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Convert all uses of devm_request_and_ioremap() to the newly introduced
devm_ioremap_resource() which provides more consistent error handling.
devm_ioremap_resource() provides its own error messages so all explicit
error messages can be removed from the failure code paths.
Signed-off-by: Thierry Reding <thierry.reding@avionic-design.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds an extra check in the data structure while registering
a thermal device. The check is to avoid registering zones with a number
of trips greater than zero, but with no .get_trip_temp nor .get_trip_type
callbacks. Receiving such data structure may end in wrong data access.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
No need for spinlocks in this file, then removing its header.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.
This way, the messages will always be bound to a thermal zone.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
devm_clk_get allocates a resource that is released when a driver detaches.
This patch uses devm_clk_get for data that is allocated in the probe
function of a platform device and is only released in the remove function.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds .get_trip_type(), .get_trip_temp(), and .notify()
on rcar_thermal_zone_ops.
Driver will try platform power OFF if it reached to
critical temperature.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
step_wise governor should set the device cooling state to
upper/lower limit directly when THERMAL_TREND_RAISE/DROP_FULL.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
CONFIG_HOTPLUG is going away as an option. As a result, the __dev*
markings need to be removed.
This change removes the use of __devinit, __devexit_p, __devinitdata,
and __devexit from these drivers.
Based on patches originally written by Bill Pemberton, but redone by me
in order to handle some of the coding style issues better, by hand.
Cc: Bill Pemberton <wfp5p@virginia.edu>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Pull trivial branch from Jiri Kosina:
"Usual stuff -- comment/printk typo fixes, documentation updates, dead
code elimination."
* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits)
HOWTO: fix double words typo
x86 mtrr: fix comment typo in mtrr_bp_init
propagate name change to comments in kernel source
doc: Update the name of profiling based on sysfs
treewide: Fix typos in various drivers
treewide: Fix typos in various Kconfig
wireless: mwifiex: Fix typo in wireless/mwifiex driver
messages: i2o: Fix typo in messages/i2o
scripts/kernel-doc: check that non-void fcts describe their return value
Kernel-doc: Convention: Use a "Return" section to describe return values
radeon: Fix typo and copy/paste error in comments
doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c
various: Fix spelling of "asynchronous" in comments.
Fix misspellings of "whether" in comments.
eisa: Fix spelling of "asynchronous".
various: Fix spelling of "registered" in comments.
doc: fix quite a few typos within Documentation
target: iscsi: fix comment typos in target/iscsi drivers
treewide: fix typo of "suport" in various comments and Kconfig
treewide: fix typo of "suppport" in various comments
...
This patch adds rcar_zone_to_priv()
which is a helper macro for gettign private data.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The unit of temperature is Milli-Celsius.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y
with the following drive:
CONFIG_OMAP_BANDGAP=m
generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
This patch changes cpu cooling driver to allow it
to be built as module.
Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
There are predefined cpu_masks that are const data structures.
This patch changes the cpu cooling register function so that
those const cpu_masks can be used, without compilation warnings.
include/linux/cpumask.h
* The following particular system cpumasks and operations manage
* possible, present, active and online cpus.
*
* cpu_possible_mask- has bit 'cpu' set iff cpu is populatable
* cpu_present_mask - has bit 'cpu' set iff cpu is populated
* cpu_online_mask - has bit 'cpu' set iff cpu available to scheduler
* cpu_active_mask - has bit 'cpu' set iff cpu available to migration
*
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically. The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.
Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Silences the following sparse warning:
drivers/thermal/cpu_cooling.c:67:31: warning:
symbol 'notify_device' was not declared. Should it be static?
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
such a list, we can get cpufreq_cooling_device instance by the private
thermal_cooling_device.devdata.
Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In the while loop for counting cpu frequencies, if table[i].frequency equals
CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless
loop, what's more the index i cannot be referred as cpu frequencies number if
there is CPUFREQ_ENTRY_INVALID case.
Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The curly bracket should be aligned with corresponding if else statements.
Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
devm_kfree and devm_iounmap should not have to be explicitly used
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Fixes the following sparse warnings:
drivers/thermal/user_space.c:38:5: warning:
symbol 'notify_user_space' was not declared. Should it be static?
drivers/thermal/user_space.c:46:25: warning:
symbol 'thermal_gov_user_space' was not declared. Should it be static?
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Fixes the following sparse warnings:
drivers/thermal/fair_share.c:80:5: warning:
symbol 'fair_share_throttle' was not declared. Should it be static?
drivers/thermal/fair_share.c:111:25: warning:
symbol 'thermal_gov_fair_share' was not declared. Should it be static?
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Fixes the following sparse warnings:
drivers/thermal/step_wise.c:153:5: warning:
symbol 'step_wise_throttle' was not declared. Should it be static?
drivers/thermal/step_wise.c:172:25: warning:
symbol 'thermal_gov_step_wise' was not declared. Should it be static?
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch fixes the following mutex and NULL pointer
problems in thermal_sys.c:
* mutex_unlock fix in update_temperature function
* mutex_unlock fix in bind_cdev function
* Correct early return to continue in bind_cdev function
* NULL check fix in bind_cdev function
* NULL check fix in bind_tz function
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Reported-by: Sedat Dilek <sedat.dilek@gmail.com>
Reported-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Sedat Dilek <sedat.dilek@gmail.com>
Signed-off-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch removes the throttling logic out of
thermal_sys.c; also refactors the code into smaller
functions so that are easy to read/maintain.
* Seperates the handling of critical and non-critical trips
* Re-arranges the set_polling and device_check methods, so
that all related functions are arranged in one place.
* Removes the 'do_update' and 'trip_update' method, as part
of moving the throttling logic out of thermal_sys.c
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.
This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.
This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.
* If we do not have platform data and do not have
.bind defined, do not bind.
* If we do not have platform data but .bind is
defined, then use tz->ops->bind.
* If we have platform data, use it to create binding.
The same logic sequence is followed for unbind also.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a policy sysfs attribute to a thermal zone.
This attribute denotes the throttling governor used for the
zone. This is a RW attribute.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
* get_tz_trend: obtain the trend of the given thermal zone
* get_thermal_instance: obtain the instance corresponding
to the given tz, cdev and the trip point.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
following were the errors reported
drivers/thermal/rcar_thermal.c: In function ‘rcar_thermal_probe’:
drivers/thermal/rcar_thermal.c:214:10: warning: passing argument 3 of ‘thermal_zone_device_register’ makes integer from pointer without a cast [enabled by default]
include/linux/thermal.h:166:29: note: expected ‘int’ but argument is of type ‘struct rcar_thermal_priv *’
drivers/thermal/rcar_thermal.c:214:10: error: too few arguments to function ‘thermal_zone_device_register’
include/linux/thermal.h:166:29: note: declared here
make[1]: *** [drivers/thermal/rcar_thermal.o] Error 1
make: *** [drivers/thermal/rcar_thermal.o] Error 2
with gcc version 4.6.3 (Ubuntu/Linaro 4.6.3-1ubuntu5)
Signed-off-by: Devendra Naga <develkernel412222@gmail.com>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Commit 0236141837 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:
drivers/built-in.o: In function `cpufreq_get_max_state':
drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
drivers/built-in.o: In function `get_cpu_frequency':
drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'
Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.
It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.
Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
To avoid name conflicts:
drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined
While at it, also make the other names more consistent and add
parentheses.
[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
exynos_unregister_thermal() is functional only when 'th_zone' is not
NULL (ensured by the NULL checks). However, in the event it is NULL, it
gets dereferenced in the for loop. This patch fixes this issue.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
This patch fixes small bug on cpu_cooling. CPU cooling device has own
id generated with idr mathod. However in the previous version, it swapped
to all same id at last stage of probing as 0. This makes id's collision and
also occures error when it releases that id.
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add necessary default platform data support needed for TMU driver. The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4
changes are made generic for exynos series.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:
* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.
Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.
2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,
a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.
A simple data/control flow diagrams is shown below,
Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
| |
\|/ |
Cpufreq cooling device <---------------
TODO:
*Will send the DT enablement patches later after the driver is merged.
This patch:
Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.
This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
temp_crit.name and temp_input.name have a length of 16 bytes. Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses. Replace it with sizeof().
Addresses Coverity #115679
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.
Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Eduardo Valentin