The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The different thermal drivers are showing an error in case the
get_temp() fails. Actually no traces should be displayed in the
backend ops but in the call site of this ops.
Furthermore, the message is often a dev_dbg message where the
tz->device is used, thus using the internal of the structure from the
driver.
Show a debug message if the thermal_zone_get_temp() fails to read the
sensor temperature, so code showing the message is factored out and
the tz->device accesss is in the scope of the thermal core framework.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter).
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select REGMAP
which is not user-visible instead of depending on it (Randy Dunlap).
-----BEGIN PGP SIGNATURE-----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=dH0U
-----END PGP SIGNATURE-----
Merge tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These fix two issues in the Intel thermal control drivers.
Specifics:
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter)
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select
REGMAP which is not user-visible instead of depending on it (Randy
Dunlap)"
* tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: BXT_PMIC: select REGMAP instead of depending on it
thermal: intel: quark_dts: fix error pointer dereference
REGMAP is a hidden (not user visible) symbol. Users cannot set it
directly thru "make *config", so drivers should select it instead of
depending on it if they need it.
Consistently using "select" or "depends on" can also help reduce
Kconfig circular dependency issues.
Therefore, change the use of "depends on REGMAP" to "select REGMAP".
Fixes: b474303ffd ("thermal: add Intel BXT WhiskeyCove PMIC thermal driver")
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If alloc_soc_dts() fails, then we can just return. Trying to free
"soc_dts" will lead to an Oops.
Fixes: 8c18769396 ("thermal: intel Quark SoC X1000 DTS thermal driver")
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv
-----BEGIN PGP SIGNATURE-----
iQIzBAABCgAdFiEEo6/YBQwIrVS28WGKmmx57+YAGNkFAmPtSN8ACgkQmmx57+YA
GNkOSw/+JS5tElm/ZP7c3uWYp6uwvcb0jUlKW/U3aCtPiPEcYDLEqIEXwcNdaDMh
m4rW3GYlW0IRL3FsyuYkSLx+EIIUIfs40wldYXJOqRDj0XasndiloIwltOQJGfd9
C/UVM0FpJdxMJrcBMFgwLLQCIbAVnhHP34i6ppDRgxW/MfTeiCaaG6fnS70iv6mC
oh2N7FoZSKDtTrFtlR5TqFiK5v/W1CgNJVuglkFB0ceFpjyBpp/8AT0FGS887xCz
IYSTqm4Q/79vaZXI1Y2oog257cgdwsVqgPrnK5CuSFhTnAcJMCekiFelHq8Yhyuk
Rw7j/B3KO3AOaxmR75c6SZdeZ+VHgUMRC/RKe3fay0sm3Zea2kAIPXA6Zn+r/cxb
8M94V59qBz+f8XmpXRTK1UR3s3EbwFIuNyuDIkeorMtpSKtvqJXmZxGDwNIfXr2F
/voo++MKjzdtdxdW/D/5Tc9DC0Pyb4HLi0EYj2QCzA03njmfLDF1w73NfzMec+GD
R1zAd3FEbiJQx8Hin0PSPjYXpfMnkjkGAEcE9N9Ralg4ewNWAxfOFsAhHKTZNssL
pitTAvHR/+dXtvkX7FUi2l/6fqn8nJUrg/xRazPPp3scRbpuk8m6P4MNr3/lsaHk
HTQ/hYwDdecWLvKXjw5y9yIr3yhLmPPcloTVIIFFjsM0t8b+d9E=
=p6Xp
-----END PGP SIGNATURE-----
Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC driver updates from Arnd Bergmann:
"As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv"
* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
power: supply: Introduce Qualcomm PMIC GLINK power supply
soc: apple: rtkit: Do not copy the reg state structure to the stack
soc: sunxi: SUN20I_PPU should depend on PM
memory: renesas-rpc-if: Remove redundant division of dummy
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
...
The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported. We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.
Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The commit 74c8e6bffb ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.
Fix this by removing the unneeded second access.
Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.
The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.
Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.
Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.
According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.
A thermal domains can be the MCU or the AP.
Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.
The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.
The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.
The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
On MT8195 Tomato Chromebook:
Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge thermal control changes related to Intel platforms for 6.3-rc1:
- Rework ACPI helper functions for thermal control to retrieve a trip
point temperature instead of initializing a trip point objetc (Rafael
Wysocki).
- Clean up and improve the int340x thermal driver ((Rafael Wysocki).
- Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).
- Fix the Intel powerclamp thermal driver and make it use the common
idle injection framework (Srinivas Pandruvada).
- Add two module parameters, cpumask and max_idle, to the Intel powerclamp
thermal driver to allow it to affect only a specific subset of CPUs
instead of all of them (Srinivas Pandruvada).
- Make the Intel quark_dts thermal driver Use generic trip point
objects instead of its own trip point representation (Daniel
Lezcano).
- Add toctree entry for thermal documents and fix two issues in the
Intel powerclamp driver documentation (Bagas Sanjaya).
* thermal-intel: (25 commits)
Documentation: powerclamp: Fix numbered lists formatting
Documentation: powerclamp: Escape wildcard in cpumask description
Documentation: admin-guide: Add toctree entry for thermal docs
thermal: intel: powerclamp: Add two module parameters
Documentation: admin-guide: Move intel_powerclamp documentation
thermal: intel: powerclamp: Fix duration module parameter
thermal: intel: powerclamp: Return last requested state as cur_state
thermal: intel: quark_dts: Use generic trip points
thermal: intel: powerclamp: Use powercap idle-inject feature
powercap: idle_inject: Add update callback
powercap: idle_inject: Export symbols
thermal: intel: powerclamp: Fix cur_state for multi package system
thermal: intel: intel_pch: Drop struct board_info
thermal: intel: intel_pch: Rename board ID symbols
thermal: intel: intel_pch: Fold suspend and resume routines into their callers
thermal: intel: intel_pch: Fold two functions into their callers
thermal: intel: intel_pch: Eliminate device operations object
thermal: intel: intel_pch: Rename device operations callbacks
thermal: intel: intel_pch: Eliminate redundant return pointers
thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
...
Merge thermal control core changes for 6.3-rc1:
- Clean up thermal device unregistration code (Viresh Kumar).
- Fix and clean up thermal control core initialization error code
paths (Daniel Lezcano).
- Relocate the trip points handling code into a separate file (Daniel
Lezcano).
- Make the thermal core fail registration of thermal zones and cooling
devices if the thermal class has not been registered (Rafael Wysocki).
- Make the core thermal control code use sysfs_emit_at() instead of
scnprintf() where applicable (ye xingchen).
* thermal-core:
thermal: core: Use sysfs_emit_at() instead of scnprintf()
thermal: Fail object registration if thermal class is not registered
thermal/core: Move the thermal trip code to a dedicated file
thermal/core: Remove unneeded ida_destroy()
thermal/core: Fix unregistering netlink at thermal init time
thermal: core: Use device_unregister() instead of device_del/put()
thermal: core: Move cdev cleanup to thermal_release()
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
-----BEGIN PGP SIGNATURE-----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=+KgT
-----END PGP SIGNATURE-----
gpgsig -----BEGIN PGP SIGNATURE-----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=8eLr
-----END PGP SIGNATURE-----
Merge tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/drivers
More Qualcomm driver updates for 6.3
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
* tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux:
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
soc: qcom: pmic_glink: Introduce base PMIC GLINK driver
dt-bindings: soc: qcom: Introduce PMIC GLINK binding
soc: qcom: dcc: Drop driver for now
Link: https://lore.kernel.org/r/20230210182242.2023901-1-andersson@kernel.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
In some use cases, it is desirable to only inject idle on certain set
of CPUs. For example on Alder Lake systems, it is possible that we force
idle only on P-Cores for thermal reasons. Also the idle percent can be
more than 50% if we only choose partial set of CPUs in the system.
Introduce 2 new module parameters for this purpose. They can be only
changed when the cooling device is inactive.
cpumask (Read/Write): A bit mask of CPUs to inject idle. The format of
this bitmask is same as used in other subsystems like in
/proc/irq/*/smp_affinity. The mask is comma separated 32 bit groups.
Each CPU is one bit. For example for 256 CPU system the full mask is:
ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff
The rightmost mask is for CPU 0-32.
max_idle (Read/Write): Maximum injected idle time to the total CPU time
ratio in percent range from 1 to 100. Even if the cooling device max_state
is always 100 (100%), this parameter allows to add a max idle percent
limit. The default is 50, to match the current implementation of powerclamp
driver. Also doesn't allow value more than 75, if the cpumask includes
every CPU present in the system.
Also when the cpumask doesn't include every CPU, there is no use of
compensation using package C-state idle counters. Hence don't start
package C-state polling thread even for a single package or a single die
system in this case.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Follow the advice in Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
After the switch to use the powercap/idle-inject framework in the Intel
powerclamp driver, the idle duration unit is microsecond.
However, the module parameter for idle duration is in milliseconds, so
convert it to microseconds in the "set" callback and back to milliseconds
in a new "get" callback.
While here, also use mutex protection for setting and getting "duration".
The other uses of "duration" are already protected by the mutex.
Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.
Suggested-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Elliot Berman <quic_eberman@quicinc.com>
Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com>
Acked-by: Mukesh Ojha <quic_mojha@quicinc.com>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
When the user is reading cur_state from the thermal cooling device for
Intel powerclamp device:
- It returns the idle ratio from Package C-state counters when
there is active idle injection session.
- -1, when there is no active idle injection session.
This information is not very useful as the package C-state counters vary
a lot from read to read. Instead just return the last requested cur_state.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Make the intel_quark_dts_thermal driver register an array of generic
trip points along with the thermal zone and drop the trip points
thermal zone callbacks that are not used any more from it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are two idle injection implementation in the Linux kernel. One
via intel_powerclamp and the other using powercap/idle_inject. Both
implementation end up in calling play_idle* function from a FIFO
priority thread. Both can't be used at the same time.
It is better to use one idle injection framework for better
maintainability. In this way, there is only one caller for play_idle.
Here powercap/idle_inject can be used for both per-core and for system
wide idle injection. This framework has a well defined interface which
allow registry for per-core or for all CPUs (system wide).
This reduces code complexity in the intel powerclamp driver as all the
per CPU kthreads, delayed work and calls to play_idle can be removed.
The changes include:
- Remove unneeded include files
- Remove per CPU kthread workers: balancing_work and idle_injection_work.
- Reuse the compensation related code by moving from previous worker
thread to idle_injection callback.
- Adjust the idle_duration and runtime by using powercap/idle_inject
interface.
- Remove all variables, which are not required once powercap/idle_inject
is used.
- Add mutex to avoid race during removal of idle injection during module
unload and user action to change idle inject percent. Also for
protection during dynamic adjustment of run and idle time from
update() callback.
- Remove online/offline callbacks to designate control CPU
- Use cpu_present_mask global variable for CPU mask
- Remove hot plug locks
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.
It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.
For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.
Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.
Fixes: b721ca0d19 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because the only member of struct board_info is the name, the
board_info[] array of struct board_info elements can be replaced with
an array of strings.
Modify the code accordingly and drop struct board_info.
No intentional functional impact.
Suggested-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Use capitals in the names of the board ID symbols and add the PCH_
prefix to each of them for consistency.
Also rename the board_ids enum accordingly.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Fold pch_suspend() and pch_resume(), that each have only one caller,
into their respective callers to make the code somewhat easier to
follow.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Fold two functions, pch_hw_init() and pch_get_temp(), that each have
only one caller, into their respective callers to make the code somewhat
easier to follow.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
The same device operations object is pointed to by all of the board
configurations in the driver, so effectively the same operations
callbacks are used by all of them which only adds overhead (that can
be significant due to retpolines) for no real purpose.
For this reason, drop the device operations object and replace the
respective callback invocations by direct calls to the specific
functions that were previously pointed to by callback pointers.
No intentional change in behavior.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Because the same device operations callbacks are used for all supported
boards, they are in fact generic, so rename them to reflect that.
Also rename the operations object itself for consistency.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Both pch_wpt_init() and pch_wpt_get_temp() can return the proper
result via their return values, so they do not need to use return
pointers.
Modify them accordingly.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Modify pch_wpt_add_acpi_psv_trip() to return an int value instead of
using a return pointer for that.
While at it, drop an excessive empty code line.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Instead of using snprintf() to populate the ACPI object name in
int340x_thermal_set_trip_temp(), use an appropriate initializer
and make the function fail if its trip argument is greater than 9,
because ACPI object names can only be 4 characters long and it does
not make sense to even try to evaluate objects with longer names (that
argument is guaranteed to be non-negative, because it comes from the
thermal code that will not pass negative trip numbers to zone
callbacks).
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
The explicit casting from int to unsigned long in
int340x_thermal_get_zone_temp() is pointless, becuase the multiplication
result is cast back to int by the assignment in the same statement, so
drop it.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Rename local variables int34x_thermal_zone in int340x_thermal_zone_add()
and int340x_thermal_zone_remove() to int34x_zone which allows a number
of code lines to be shorter and easier to read and adjust some white
space for consistency.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Improve some inconsistent usage of white space in int340x_thermal_zone.c,
fix up one coding style issue in it (missing braces around an else
branch of a conditional) and while at it replace a !ACPI_FAILURE()
check with an equivalent ACPI_SUCCESS() one.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.
Modify the ACPI thermal helpers accordingly and update their users.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge changes affecting thermal control on Intel platforms for 6.3-rc1:
- Consolidate code accessing the Intel TCC (Thermal Control Circuitry)
MSRs by introducing library functions for that and making the
TCC-related code in thermal drivers use them (Zhang Rui).
- Enhance the x86_pkg_temp_thermal driver to support dynamic tjmax
changes (Zhang Rui).
- Address an "unsigned expression compared with zero" warning in the
intel_soc_dts_iosf thermal driver (Yang Li).
- Update comments regarding two functions in the Intel Menlow thermal
driver (Deming Wang).
- Use sysfs_emit_at() instead of scnprintf() in the int340x thermal
driver (ye xingchen).
- Make the intel_pch thermal driver support the Wellsburg PCH (Tim
Zimmermann).
- Add trip point initialization helper functions for ACPI-defined trip
points and modify two thermal drivers to use them (Rafael Wysocki,
Daniel Lezcano).
- Modify the intel_pch and processor_thermal_device_pci thermal drivers
use generic trip point tables instead of thermal zone trip point
callbacks (Daniel Lezcano).
- Add production mode attribute sysfs attribute to the int340x thermal
driver (Srinivas Pandruvada).
- Rework dynamic trip point updates handling and locking in the int340x
thermal driver (Rafael Wysocki).
- Make the int340x thermal driver use a generic trip points table
instead of thermal zone trip point callbacks (Rafael Wysocki, Daniel
Lezcano).
* thermal-intel:
thermal: intel: int340x: Use generic trip points table
thermal: intel: int340x: Use zone lock for synchronization
thermal: intel: int340x: Rework updating trip points
thermal: ACPI: Initialize trips if temperature is out of range
thermal: intel: processor_thermal_device_pci: Use generic trip point
thermal: intel: int340x: Add production mode attribute
thermal: intel: intel_pch: Use generic trip points
thermal: ACPI: Add ACPI trip point routines
thermal: intel: intel_pch: Add support for Wellsburg PCH
thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()
thermal: intel: menlow: Update function descriptions
thermal: intel: Fix unsigned comparison with less than zero
thermal/x86_pkg_temp_thermal: Add support for handling dynamic tjmax
thermal/x86_pkg_temp_thermal: Use Intel TCC library
thermal/intel/intel_tcc_cooling: Use Intel TCC library
thermal/intel/intel_soc_dts_iosf: Use Intel TCC library
thermal/int340x/processor_thermal: Use Intel TCC library
thermal/intel: Introduce Intel TCC library
Modify int340x_thermal_zone_add() to register the thermal zone along
with a trip points table, which allows the trip-related zone callbacks
to be dropped, because they are not needed any more.
In order to consolidate the code, use ACPI trip library functions to
populate generic trip points in int340x_thermal_read_trips() and to
update them in int340x_thermal_update_trips().
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because the ->get_trip_temp() and ->get_trip_type() thermal zone
callbacks are only invoked from __thermal_zone_get_trip() which is
always called by the thermal core under the zone lock, it is sufficient
for int340x_thermal_update_trips() to acquire the zone lock for mutual
exclusion with those callbacks.
Accordingly, modify int340x_thermal_update_trips() to use the zone lock
instead of the internal trip_mutex and drop the latter which is not
necessary any more.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is generally invalid to change the trip point indices after they have
been exposed via sysfs.
Moreover, the thermal objects in the ACPI namespace cannot go away and
appear on the fly. In practice, the only thing that can happen when the
INT3403_PERF_TRIP_POINT_CHANGED notification is sent by the platform
firmware is a change of the return values of those thermal objects.
For this reason, add a special function for updating the trip point
temperatures after re-evaluating the respective ACPI thermal objects
and change int3403_notify() to invoke it instead of
int340x_thermal_read_trips() that would change the trip point indices
on errors. Also remove the locking from the latter, because it is only
called before registering the thermal zone and it cannot race with the
zone's callbacks.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In some cases it is still useful to register a trip point if the
temperature returned by the corresponding ACPI thermal object (for
example, _HOT) is invalid to start with, because the same ACPI
thermal object may start to return a valid temperature after a
system configuration change (for example, from an AC power source
to battery an vice versa).
For this reason, if the ACPI thermal object evaluated by
thermal_acpi_trip_init() successfully returns a temperature value that
is out of the range of values taken into account, initialize the trip
point using THERMAL_TEMP_INVALID as the temperature value instead of
returning an error to allow the user of the trip point to decide what
to do with it.
Also update pch_wpt_add_acpi_psv_trip() to reject trip points with
invalid temperature values.
Fixes: 7a0e397488 ("thermal: ACPI: Add ACPI trip point routines")
Reported-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>