Commit Graph

2393 Commits

Author SHA1 Message Date
Daniel Lezcano 4a16c190f7 thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.

Actually, it uses the tz->device to add it in the devres list.

It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano 8f3f4ad4ad thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().

Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.

Remove the call and again prevent the drivers to access the thermal
internals.

Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano abda7383ec thermal: Remove debug or error messages in get_temp() ops
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.

The debug message is already displayed from the call site of this
ops. So we can remove it.

On the other side, the error should not be displayed because in
production that can raise tons of messages.

Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.

Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.

Remove those messages.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano 4216e81532 thermal/core: Show a debug message when get_temp() fails
The different thermal drivers are showing an error in case the
get_temp() fails. Actually no traces should be displayed in the
backend ops but in the call site of this ops.

Furthermore, the message is often a dev_dbg message where the
tz->device is used, thus using the internal of the structure from the
driver.

Show a debug message if the thermal_zone_get_temp() fails to read the
sensor temperature, so code showing the message is factored out and
the tz->device accesss is in the scope of the thermal core framework.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano 5f68d0785e thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>  #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano a6ff3c0021 thermal/core: Add a thermal zone 'devdata' accessor
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Linus Torvalds 0a3f9a6b02 More thermal control updates for 6.3-rc1
- Fix an error pointer dereference in the quark_dts Intel thermal
    driver (Dan Carpenter).
 
  - Fix the intel_bxt_pmic_thermal driver Kconfig entry to select REGMAP
    which is not user-visible instead of depending on it (Randy Dunlap).
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Merge tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull more thermal control updates from Rafael Wysocki:
 "These fix two issues in the Intel thermal control drivers.

  Specifics:

   - Fix an error pointer dereference in the quark_dts Intel thermal
     driver (Dan Carpenter)

   - Fix the intel_bxt_pmic_thermal driver Kconfig entry to select
     REGMAP which is not user-visible instead of depending on it (Randy
     Dunlap)"

* tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal: intel: BXT_PMIC: select REGMAP instead of depending on it
  thermal: intel: quark_dts: fix error pointer dereference
2023-03-03 10:41:59 -08:00
Randy Dunlap 1467fb9603 thermal: intel: BXT_PMIC: select REGMAP instead of depending on it
REGMAP is a hidden (not user visible) symbol. Users cannot set it
directly thru "make *config", so drivers should select it instead of
depending on it if they need it.

Consistently using "select" or "depends on" can also help reduce
Kconfig circular dependency issues.

Therefore, change the use of "depends on REGMAP" to "select REGMAP".

Fixes: b474303ffd ("thermal: add Intel BXT WhiskeyCove PMIC thermal driver")
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-01 19:32:00 +01:00
Dan Carpenter f1b930e740 thermal: intel: quark_dts: fix error pointer dereference
If alloc_soc_dts() fails, then we can just return.  Trying to free
"soc_dts" will lead to an Oops.

Fixes: 8c18769396 ("thermal: intel Quark SoC X1000 DTS thermal driver")
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-01 19:28:57 +01:00
Linus Torvalds 11c7052998 ARM: SoC drivers for 6.3
As usual, there are lots of minor driver changes across SoC platforms
 from  NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
 These usually add support for additional chip variations in existing
 drivers, but also add features or bugfixes.
 
 The SCMI firmware subsystem gains a unified raw userspace interface
 through debugfs, which can be used for validation purposes.
 
 Newly added drivers include:
 
  - New power management drivers for StarFive JH7110, Allwinner D1 and
    Renesas RZ/V2M
 
  - A driver for Qualcomm battery and power supply status
 
  - A SoC device driver for identifying Nuvoton WPCM450 chips
 
  - A regulator coupler driver for Mediatek MT81xxv
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Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull ARM SoC driver updates from Arnd Bergmann:
 "As usual, there are lots of minor driver changes across SoC platforms
  from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
  These usually add support for additional chip variations in existing
  drivers, but also add features or bugfixes.

  The SCMI firmware subsystem gains a unified raw userspace interface
  through debugfs, which can be used for validation purposes.

  Newly added drivers include:

   - New power management drivers for StarFive JH7110, Allwinner D1 and
     Renesas RZ/V2M

   - A driver for Qualcomm battery and power supply status

   - A SoC device driver for identifying Nuvoton WPCM450 chips

   - A regulator coupler driver for Mediatek MT81xxv"

* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
  power: supply: Introduce Qualcomm PMIC GLINK power supply
  soc: apple: rtkit: Do not copy the reg state structure to the stack
  soc: sunxi: SUN20I_PPU should depend on PM
  memory: renesas-rpc-if: Remove redundant division of dummy
  soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
  dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
  dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
  firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
  MAINTAINERS: Update qcom CPR maintainer entry
  dt-bindings: firmware: document Qualcomm SM8550 SCM
  dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
  soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
  dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
  soc: qcom: socinfo: Add support for new field in revision 17
  soc: qcom: smd-rpm: Add IPQ9574 compatible
  soc: qcom: pmic_glink: remove redundant calculation of svid
  soc: qcom: stats: Populate all subsystem debugfs files
  dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
  soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
  soc: qcom: pmic_glink: Introduce altmode support
  ...
2023-02-27 10:04:49 -08:00
Alain Volmat 6828e402d0 thermal/drivers/st: Remove syscfg based driver
The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported.  We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.

Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:30:04 +01:00
Daniel Lezcano 9272d2d43b thermal: Remove core header inclusion from drivers
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.

Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.

Remove this inclusion in every place where it is possible.

Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.

The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.

The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:48 +01:00
Yongqin Liu 15cc25829a thermal/drivers/hisi: Drop second sensor hi3660
The commit 74c8e6bffb ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.

Fix this by removing the unneeded second access.

Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:33 +01:00
Niklas Söderlund 47b2d3d2ed thermal/drivers/rcar_gen3_thermal: Fix device initialization
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.

The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.

Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:23 +01:00
Niklas Söderlund aef43e0493 thermal/drivers/rcar_gen3_thermal: Create device local ops struct
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.

Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.

Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:15 +01:00
Niklas Söderlund 1c63f8cd01 thermal/drivers/rcar_gen3_thermal: Do not call set_trips() when resuming
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.

Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:07 +01:00
Geert Uytterhoeven 883d155299 thermal/drivers/rcar_gen3: Add support for R-Car V4H
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.

According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:58 +01:00
Balsam CHIHI f5f633b182 thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver
The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.

A thermal domains can be the MCU or the AP.

Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.

The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.

The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.

The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>

On MT8195 Tomato Chromebook:

Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:42 +01:00
Balsam CHIHI fad399ebdd thermal/drivers/mediatek: Relocate driver to mediatek folder
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:25 +01:00
Rafael J. Wysocki badf1f9050 Merge branch 'thermal-intel'
Merge thermal control changes related to Intel platforms for 6.3-rc1:

 - Rework ACPI helper functions for thermal control to retrieve a trip
   point temperature instead of initializing a trip point objetc (Rafael
   Wysocki).

 - Clean up and improve the int340x thermal driver ((Rafael Wysocki).

 - Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).

 - Fix the Intel powerclamp thermal driver and make it use the common
   idle injection framework (Srinivas Pandruvada).

 - Add two module parameters, cpumask and max_idle, to the Intel powerclamp
   thermal driver to allow it to affect only a specific subset of CPUs
   instead of all of them (Srinivas Pandruvada).

 - Make the Intel quark_dts thermal driver Use generic trip point
   objects instead of its own trip point representation (Daniel
   Lezcano).

 - Add toctree entry for thermal documents and fix two issues in the
   Intel powerclamp driver documentation (Bagas Sanjaya).

* thermal-intel: (25 commits)
  Documentation: powerclamp: Fix numbered lists formatting
  Documentation: powerclamp: Escape wildcard in cpumask description
  Documentation: admin-guide: Add toctree entry for thermal docs
  thermal: intel: powerclamp: Add two module parameters
  Documentation: admin-guide: Move intel_powerclamp documentation
  thermal: intel: powerclamp: Fix duration module parameter
  thermal: intel: powerclamp: Return last requested state as cur_state
  thermal: intel: quark_dts: Use generic trip points
  thermal: intel: powerclamp: Use powercap idle-inject feature
  powercap: idle_inject: Add update callback
  powercap: idle_inject: Export symbols
  thermal: intel: powerclamp: Fix cur_state for multi package system
  thermal: intel: intel_pch: Drop struct board_info
  thermal: intel: intel_pch: Rename board ID symbols
  thermal: intel: intel_pch: Fold suspend and resume routines into their callers
  thermal: intel: intel_pch: Fold two functions into their callers
  thermal: intel: intel_pch: Eliminate device operations object
  thermal: intel: intel_pch: Rename device operations callbacks
  thermal: intel: intel_pch: Eliminate redundant return pointers
  thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
  ...
2023-02-15 17:18:08 +01:00
Rafael J. Wysocki c3bd6d539f Merge branch 'thermal-core'
Merge thermal control core changes for 6.3-rc1:

 - Clean up thermal device unregistration code (Viresh Kumar).

 - Fix and clean up thermal control core initialization error code
   paths (Daniel Lezcano).

 - Relocate the trip points handling code into a separate file (Daniel
   Lezcano).

 - Make the thermal core fail registration of thermal zones and cooling
   devices if the thermal class has not been registered (Rafael Wysocki).

 - Make the core thermal control code use sysfs_emit_at() instead of
   scnprintf() where applicable (ye xingchen).

* thermal-core:
  thermal: core: Use sysfs_emit_at() instead of scnprintf()
  thermal: Fail object registration if thermal class is not registered
  thermal/core: Move the thermal trip code to a dedicated file
  thermal/core: Remove unneeded ida_destroy()
  thermal/core: Fix unregistering netlink at thermal init time
  thermal: core: Use device_unregister() instead of device_del/put()
  thermal: core: Move cdev cleanup to thermal_release()
2023-02-15 17:08:30 +01:00
Arnd Bergmann 68907175ec More Qualcomm driver updates for 6.3
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
 Qualcomm-specific files directly in include/linux.
 
 Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
 provides an interface to the firmware implementing battery management
 and USB Type-C handling. Together with the base driver comes the custom
 altmode support driver.
 
 SMD RPM gains support for IPQ9574, and socinfo is extended with support
 for revision 17 of the information format and soc_id for IPQ5332 and
 IPQ8064 are added.
 
 The qcom_stats  is changes not to fail when not all parts are
 initialized.
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Merge tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/drivers

More Qualcomm driver updates for 6.3

The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.

Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.

SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.

The qcom_stats  is changes not to fail when not all parts are
initialized.

* tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux:
  soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
  dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
  dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
  firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
  MAINTAINERS: Update qcom CPR maintainer entry
  dt-bindings: firmware: document Qualcomm SM8550 SCM
  dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
  soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
  dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
  soc: qcom: socinfo: Add support for new field in revision 17
  soc: qcom: smd-rpm: Add IPQ9574 compatible
  soc: qcom: pmic_glink: remove redundant calculation of svid
  soc: qcom: stats: Populate all subsystem debugfs files
  dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
  soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
  soc: qcom: pmic_glink: Introduce altmode support
  soc: qcom: pmic_glink: Introduce base PMIC GLINK driver
  dt-bindings: soc: qcom: Introduce PMIC GLINK binding
  soc: qcom: dcc: Drop driver for now

Link: https://lore.kernel.org/r/20230210182242.2023901-1-andersson@kernel.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
2023-02-13 16:22:33 +01:00
Srinivas Pandruvada ebf5197102 thermal: intel: powerclamp: Add two module parameters
In some use cases, it is desirable to only inject idle on certain set
of CPUs. For example on Alder Lake systems, it is possible that we force
idle only on P-Cores for thermal reasons. Also the idle percent can be
more than 50% if we only choose partial set of CPUs in the system.

Introduce 2 new module parameters for this purpose. They can be only
changed when the cooling device is inactive.

cpumask (Read/Write): A bit mask of CPUs to inject idle. The format of
this bitmask is same as used in other subsystems like in
/proc/irq/*/smp_affinity. The mask is comma separated 32 bit groups.
Each CPU is one bit. For example for 256 CPU system the full mask is:
ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff
The rightmost mask is for CPU 0-32.

max_idle (Read/Write): Maximum injected idle time to the total CPU time
ratio in percent range from 1 to 100. Even if the cooling device max_state
is always 100 (100%), this parameter allows to add a max idle percent
limit. The default is 50, to match the current implementation of powerclamp
driver. Also doesn't allow value more than 75, if the cpumask includes
every CPU present in the system.

Also when the cpumask doesn't include every CPU, there is no use of
compensation using package C-state idle counters. Hence don't start
package C-state polling thread even for a single package or a single die
system in this case.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 21:01:06 +01:00
ye xingchen 5bbafd4362 thermal: core: Use sysfs_emit_at() instead of scnprintf()
Follow the advice in Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.

Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 20:39:48 +01:00
Srinivas Pandruvada 966d0ab673 thermal: intel: powerclamp: Fix duration module parameter
After the switch to use the powercap/idle-inject framework in the Intel
powerclamp driver, the idle duration unit is microsecond.

However, the module parameter for idle duration is in milliseconds, so
convert it to microseconds in the "set" callback and back to milliseconds
in a new "get" callback.

While here, also use mutex protection for setting and getting "duration".

The other uses of "duration" are already protected by the mutex.

Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-09 19:57:35 +01:00
Elliot Berman 3bf90eca76 firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.

Suggested-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Elliot Berman <quic_eberman@quicinc.com>
Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com>
Acked-by: Mukesh Ojha <quic_mojha@quicinc.com>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
2023-02-08 19:15:16 -08:00
Srinivas Pandruvada 6210849654 thermal: intel: powerclamp: Return last requested state as cur_state
When the user is reading cur_state from the thermal cooling device for
Intel powerclamp device:
 - It returns the idle ratio from Package C-state counters when
   there is active idle injection session.
 - -1, when there is no active idle injection session.

This information is not very useful as the package C-state counters vary
a lot from read to read. Instead just return the last requested cur_state.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-07 20:51:15 +01:00
Daniel Lezcano 72ffc28f2f thermal: intel: quark_dts: Use generic trip points
Make the intel_quark_dts_thermal driver register an array of generic
trip points along with the thermal zone and drop the trip points
thermal zone callbacks that are not used any more from it.

Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-03 14:49:26 +01:00
Srinivas Pandruvada 8526eb7fc7 thermal: intel: powerclamp: Use powercap idle-inject feature
There are two idle injection implementation in the Linux kernel. One
via intel_powerclamp and the other using powercap/idle_inject. Both
implementation end up in calling play_idle* function from a FIFO
priority thread. Both can't be used at the same time.

It is better to use one idle injection framework for better
maintainability. In this way, there is only one caller for play_idle.

Here powercap/idle_inject can be used for both per-core and for system
wide idle injection. This framework has a well defined interface which
allow registry for per-core or for all CPUs (system wide).

This reduces code complexity in the intel powerclamp driver as all the
per CPU kthreads, delayed work and calls to play_idle can be removed.

The changes include:
 - Remove unneeded include files
 - Remove per CPU kthread workers: balancing_work and idle_injection_work.
 - Reuse the compensation related code by moving from previous worker
   thread to idle_injection callback.
 - Adjust the idle_duration and runtime by using powercap/idle_inject
   interface.
 - Remove all variables, which are not required once powercap/idle_inject
   is used.
 - Add mutex to avoid race during removal of idle injection during module
   unload and user action to change idle inject percent. Also for
   protection during dynamic adjustment of run and idle time from
   update() callback.
 - Remove online/offline callbacks to designate control CPU
 - Use cpu_present_mask global variable for CPU mask
 - Remove hot plug locks

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-03 14:48:34 +01:00
Srinivas Pandruvada 8e47363588 thermal: intel: powerclamp: Fix cur_state for multi package system
The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.

It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.

For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.

Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.

Fixes: b721ca0d19 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-02 21:08:32 +01:00
Rafael J. Wysocki 2153a87ff9 thermal: intel: intel_pch: Drop struct board_info
Because the only member of struct board_info is the name, the
board_info[] array of struct board_info elements can be replaced with
an array of strings.

Modify the code accordingly and drop struct board_info.

No intentional functional impact.

Suggested-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:06:24 +01:00
Rafael J. Wysocki ae98e57a6e thermal: intel: intel_pch: Rename board ID symbols
Use capitals in the names of the board ID symbols and add the PCH_
prefix to each of them for consistency.

Also rename the board_ids enum accordingly.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:06:15 +01:00
Rafael J. Wysocki c5f43242f4 thermal: intel: intel_pch: Fold suspend and resume routines into their callers
Fold pch_suspend() and pch_resume(), that each have only one caller,
into their respective callers to make the code somewhat easier to
follow.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:06:09 +01:00
Rafael J. Wysocki 35c87f948d thermal: intel: intel_pch: Fold two functions into their callers
Fold two functions, pch_hw_init() and pch_get_temp(), that each have
only one caller, into their respective callers to make the code somewhat
easier to follow.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 21:04:01 +01:00
Rafael J. Wysocki 86cb1004b6 thermal: intel: intel_pch: Eliminate device operations object
The same device operations object is pointed to by all of the board
configurations in the driver, so effectively the same operations
callbacks are used by all of them which only adds overhead (that can
be significant due to retpolines) for no real purpose.

For this reason, drop the device operations object and replace the
respective callback invocations by direct calls to the specific
functions that were previously pointed to by callback pointers.

No intentional change in behavior.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki 1aa4f925d8 thermal: intel: intel_pch: Rename device operations callbacks
Because the same device operations callbacks are used for all supported
boards, they are in fact generic, so rename them to reflect that.

Also rename the operations object itself for consistency.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki 558718f4d3 thermal: intel: intel_pch: Eliminate redundant return pointers
Both pch_wpt_init() and pch_wpt_get_temp() can return the proper
result via their return values, so they do not need to use return
pointers.

Modify them accordingly.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki 2cee73568e thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
Modify pch_wpt_add_acpi_psv_trip() to return an int value instead of
using a return pointer for that.

While at it, drop an excessive empty code line.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:40:39 +01:00
Rafael J. Wysocki 1bcebcab88 thermal: intel: int340x: Improve int340x_thermal_set_trip_temp()
Instead of using snprintf() to populate the ACPI object name in
int340x_thermal_set_trip_temp(), use an appropriate initializer
and make the function fail if its trip argument is greater than 9,
because ACPI object names can only be 4 characters long and it does
not make sense to even try to evaluate objects with longer names (that
argument is guaranteed to be non-negative, because it comes from the
thermal code that will not pass negative trip numbers to zone
callbacks).

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki d0009d14e9 thermal: intel: int340x: Drop pointless cast to unsigned long
The explicit casting from int to unsigned long in
int340x_thermal_get_zone_temp() is pointless, becuase the multiplication
result is cast back to int by the assignment in the same statement, so
drop it.

No expected functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki 67c6945867 thermal: intel: int340x: Rename variable in int340x_thermal_zone_add()
Rename local variables int34x_thermal_zone in int340x_thermal_zone_add()
and int340x_thermal_zone_remove() to int34x_zone which allows a number
of code lines to be shorter and easier to read and adjust some white
space for consistency.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki be014c789c thermal: intel: int340x: Assorted minor cleanups
Improve some inconsistent usage of white space in int340x_thermal_zone.c,
fix up one coding style issue in it (missing braces around an else
branch of a conditional) and while at it replace a !ACPI_FAILURE()
check with an equivalent ACPI_SUCCESS() one.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-02-02 15:31:04 +01:00
Rafael J. Wysocki dd3b3d160e thermal: ACPI: Make helpers retrieve temperature only
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.

Modify the ACPI thermal helpers accordingly and update their users.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-02-02 15:26:45 +01:00
Rafael J. Wysocki f364beb5b6 Merge branch 'thermal-intel'
Merge changes affecting thermal control on Intel platforms for 6.3-rc1:

 - Consolidate code accessing the Intel TCC (Thermal Control Circuitry)
   MSRs by introducing library functions for that and making the
   TCC-related code in thermal drivers use them (Zhang Rui).

 - Enhance the x86_pkg_temp_thermal driver to support dynamic tjmax
   changes (Zhang Rui).

 - Address an "unsigned expression compared with zero" warning in the
   intel_soc_dts_iosf thermal driver (Yang Li).

 - Update comments regarding two functions in the Intel Menlow thermal
   driver (Deming Wang).

 - Use sysfs_emit_at() instead of scnprintf() in the int340x thermal
   driver (ye xingchen).

 - Make the intel_pch thermal driver support the Wellsburg PCH (Tim
   Zimmermann).

 - Add trip point initialization helper functions for ACPI-defined trip
   points and modify two thermal drivers to use them (Rafael Wysocki,
   Daniel Lezcano).

 - Modify the intel_pch and processor_thermal_device_pci thermal drivers
   use generic trip point tables instead of thermal zone trip point
   callbacks (Daniel Lezcano).

 - Add production mode attribute sysfs attribute to the int340x thermal
   driver (Srinivas Pandruvada).

 - Rework dynamic trip point updates handling and locking in the int340x
   thermal driver (Rafael Wysocki).

 - Make the int340x thermal driver use a generic trip points table
   instead of thermal zone trip point callbacks (Rafael Wysocki, Daniel
   Lezcano).

* thermal-intel:
  thermal: intel: int340x: Use generic trip points table
  thermal: intel: int340x: Use zone lock for synchronization
  thermal: intel: int340x: Rework updating trip points
  thermal: ACPI: Initialize trips if temperature is out of range
  thermal: intel: processor_thermal_device_pci: Use generic trip point
  thermal: intel: int340x: Add production mode attribute
  thermal: intel: intel_pch: Use generic trip points
  thermal: ACPI: Add ACPI trip point routines
  thermal: intel: intel_pch: Add support for Wellsburg PCH
  thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()
  thermal: intel: menlow: Update function descriptions
  thermal: intel: Fix unsigned comparison with less than zero
  thermal/x86_pkg_temp_thermal: Add support for handling dynamic tjmax
  thermal/x86_pkg_temp_thermal: Use Intel TCC library
  thermal/intel/intel_tcc_cooling: Use Intel TCC library
  thermal/intel/intel_soc_dts_iosf: Use Intel TCC library
  thermal/int340x/processor_thermal: Use Intel TCC library
  thermal/intel: Introduce Intel TCC library
2023-01-30 14:13:26 +01:00
Rafael J. Wysocki 79b2027097 Merge back thermal control material for 6.3. 2023-01-27 15:55:23 +01:00
Rafael J. Wysocki f4118dbe61 thermal: intel: int340x: Use generic trip points table
Modify int340x_thermal_zone_add() to register the thermal zone along
with a trip points table, which allows the trip-related zone callbacks
to be dropped, because they are not needed any more.

In order to consolidate the code, use ACPI trip library functions to
populate generic trip points in int340x_thermal_read_trips() and to
update them in int340x_thermal_update_trips().

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:11:12 +01:00
Rafael J. Wysocki 9e9b7e182c thermal: intel: int340x: Use zone lock for synchronization
Because the ->get_trip_temp() and ->get_trip_type() thermal zone
callbacks are only invoked from __thermal_zone_get_trip() which is
always called by the thermal core under the zone lock, it is sufficient
for int340x_thermal_update_trips() to acquire the zone lock for mutual
exclusion with those callbacks.

Accordingly, modify int340x_thermal_update_trips() to use the zone lock
instead of the internal trip_mutex and drop the latter which is not
necessary any more.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:11:12 +01:00
Rafael J. Wysocki b1bf9dbffc thermal: intel: int340x: Rework updating trip points
It is generally invalid to change the trip point indices after they have
been exposed via sysfs.

Moreover, the thermal objects in the ACPI namespace cannot go away and
appear on the fly.  In practice, the only thing that can happen when the
INT3403_PERF_TRIP_POINT_CHANGED notification is sent by the platform
firmware is a change of the return values of those thermal objects.

For this reason, add a special function for updating the trip point
temperatures after re-evaluating the respective ACPI thermal objects
and change int3403_notify() to invoke it instead of
int340x_thermal_read_trips() that would change the trip point indices
on errors.  Also remove the locking from the latter, because it is only
called before registering the thermal zone and it cannot race with the
zone's callbacks.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:11:12 +01:00
Rafael J. Wysocki 97efecfdbf thermal: ACPI: Initialize trips if temperature is out of range
In some cases it is still useful to register a trip point if the
temperature returned by the corresponding ACPI thermal object (for
example, _HOT) is invalid to start with, because the same ACPI
thermal object may start to return a valid temperature after a
system configuration change (for example, from an AC power source
to battery an vice versa).

For this reason, if the ACPI thermal object evaluated by
thermal_acpi_trip_init() successfully returns a temperature value that
is out of the range of values taken into account, initialize the trip
point using THERMAL_TEMP_INVALID as the temperature value instead of
returning an error to allow the user of the trip point to decide what
to do with it.

Also update pch_wpt_add_acpi_psv_trip() to reject trip points with
invalid temperature values.

Fixes: 7a0e397488 ("thermal: ACPI: Add ACPI trip point routines")
Reported-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-27 15:09:47 +01:00
Rafael J. Wysocki a5c926acd0 Merge back Intel thermal control changes for 6.3. 2023-01-27 15:08:08 +01:00