This reverts commit cf411bcc65.
Revert to facilitate integration of higher version drivers: 1.3.11
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Chun Liu <kaicliu@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
PTP feature of ice NIC is depend on x86 cpu feature of known
Constant TSC frequency there is no tsc on arm64, so do not
init the PTP callback function on arm64.
btw: we compile the ice driver as modules from now on
Reviewed-by: yuehongwu <yuehongwu@tencent.com>
Signed-off-by: MengEn Sun <mengensun@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: mengensun <mengensun@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
enabel CONFIG_RDS to support Reliable Datagram Sockets.
Reviewed-by: Mengen Sun <mengensun@tencent.com>
Signed-off-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
by default to potentially improve performance metrics in UnixBench tests
Signed-off-by: yuehongwu <yuehongwu@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
nt_cpy_mini_len is used by get_nt_block_copy_mini_len function，and return
to nt_blk_cpy_mini_len variable. nt_blk_cpy_mini_len will be used in
arch/x86/include/asm/uaccess_64.h, if it is 0, kernel will not call
copy_user_large_memory_generic_string function.
Signed-off-by: yuehongwu <yuehongwu@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add using fpu in kernel nonatomic context function and using sse2
memcpy for copy_user_generic_string
Signed-off-by: yuehongwu <yuehongwu@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
For performance considerations, the hygon platform defaults to using HLT as the C1 state.
Signed-off-by: yuehognwu yuehongwu@tencent.com
Reviewed-by: caelli caelli@tencent.com
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
On Hygon family 18h model 5h controller, some registers such as
GCTL, SD_CTL and SD_CTL_3B should be accessed in dword, or the
writing will fail.
Conflicts:
sound/pci/hda/hda_intel.c
Signed-off-by: fuhao <fuh@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add the new PCI ID 0x1d94 0x14a9 for Hygon family 18h model 5h
HDA controller.
Conflicts:
sound/pci/hda/hda_intel.c
Signed-off-by: fuhao <fuh@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Hygon family 18h model 6h has 2 cs mapped to 1 umc, so adjust for it.
Fixes: 6cf6141e
("EDAC/amd64: Add support for Hygon family 18h model 6h")
Signed-off-by: fuhao <fuh@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
The DF ID should be get from DF F5 device for Hygon family 18h
model 6h processor.
Fixes: 3e980dd8
("x86/amd_nb: Add support for Hygon family 18h model 6h")
Signed-off-by: fuhao <fuh@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Make the modification in commit 0ac06d63 to intlv_num_chan only
for Hygon family 18h model 4h.
Fixes: 0ac06d63
("EDAC/amd64: Adjust address translation for Hygon family 18h model 4h")
Signed-off-by: fuhao <fuh@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
The HiAddrOffset is always the top 4 bits of normalized address,
so revert the modification in commit 0ac06d63 to the original
implementation.
Fixes: 0ac06d63
("EDAC/amd64: Adjust address translation for Hygon family 18h model 4h")
Signed-off-by: fuhao <fuh@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add F0/F6 device IDs for Hygon family 18h model 6h processor.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Hygon family 18h model 6h processor has the same DF F1 device ID
as M05H_DF_F1.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add support to derive CPU topology for Hygon family 18h model 6h
processor.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add 18H_M05H DF F3 device ID to get the temperature for Hygon
family 18h model 5h processor.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Hygon family 18h model 5h processor has the same F0/F6 device IDs as
F17h_M30h, and the syndrome size is the same as model 4h processor.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add root and DF F1/F3/F4 device IDs for Hygon family 18h model
5h processors. But some model 5h processors have the legacy(M04H)
DF devices, so add a if conditional to read the df1 register.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add support to derive CPU topology for Hygon family 18h model 5h
processor, and calculate LLC ID for it from the number of threads
sharing the cache.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
The DF F3 device ID used to get the temperature for Hygon family 18h
model 4h processor is the same as 17H_M30H, but with different offsets,
which may span two distributed ranges. The second offset range can be
considered as private for Hygon, so use struct hygon_private to describe
it.
Add a pointer priv in k10temp_data to point to the private data.
Add functions k10temp_get_ccd_support_2nd() and hygon_read_temp()
to support reading the second offset range.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
The cpuinfo_x86.cpu_die_id is get from CPUID or MSR in the commit
028c221ed1 ("x86/CPU/AMD: Save AMD NodeId as cpu_die_id"). But the
value may not be continuous for Hygon model 4h~6h processors.
Use cpuinfo_x86.logical_die_id will always format continuous die
(or node) IDs, because it will convert the physical die ID to logical
die ID.
So use topology_logical_die_id() instead of topology_die_id() to
decode UMC ECC errors for Hygon processors.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add Hygon family 18h model 4h processor support for DramOffset and
HiAddrOffset, and get the socket interleaving number from DramBase-
Address(D18F0x110).
Update intlv_num_chan and num_intlv_bits support for Hygon family 18h
model 4h processor.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Hygon family 18h model 4h processor has the same F0/F6 device IDs
as F17h_M30h.
Add support to determine which DDR memory types it supports, but
determine syndrome sizes from different bits of the DRAM ECC control
reg.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
On Hygon family 18h platforms, we look at the 6th nibble(bit 20~23)
in the instance_id to derive the channel number.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
The SB IOAPIC is on the device 0xb from Hygon family 18h model 4h.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add dedicated functions to initialize the northbridge for Hygon family
18h model 4h processors.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add the PCI device IDs for Hygon family 18h model 4h processors.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Add support for loading Hygon microcode, which is compatible with AMD one.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Hygon processors before model 4h have not use the CPUID leaf 0xB, so use
commit e0ceeae708 ("x86/CPU/hygon: Fix phys_proc_id calculation logic
for multi-die processors") to derive the socket ID when running on host.
If kernel running on guest, use the hypervisor's default.
For model 4h, Hygon processors use CPUID leaf 0xB to identify SMT and
CORE level types, so use function detect_extended_topology() to derive
the core ID, socket ID and APIC ID. But it still set __max_die_per_package
to nodes_per_socket because it lacks the DIE level type.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit 4c1cdec319 upstream.
Thee maximum number of MCA banks is 64 (MAX_NR_BANKS), see
a0bc32b3ca ("x86/mce: Increase maximum number of banks to 64").
However, the bank_map which contains a bitfield of which banks to
initialize is of type unsigned int and that overflows when those bit
numbers are >= 32, leading to UBSAN complaining correctly:
UBSAN: shift-out-of-bounds in arch/x86/kernel/cpu/mce/amd.c:1365:38
shift exponent 32 is too large for 32-bit type 'int'
Change the bank_map to a u64 and use the proper BIT_ULL() macro when
modifying bits in there.
[ bp: Rewrite commit message. ]
Fixes: a0bc32b3ca ("x86/mce: Increase maximum number of banks to 64")
Signed-off-by: Muralidhara M K <muralimk@amd.com>
Signed-off-by: Borislav Petkov (AMD) <bp@alien8.de>
Link: https://lore.kernel.org/r/20230127151601.1068324-1-muralimk@amd.com
[fix conflict during backport]
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit 02a2484cf8 upstream.
Tdie is an offset calculation that should only be shown when temp_offset
is actually put into a table. This is useless to show for all CPU/APU.
Show it only when necessary.
Signed-off-by: Mario Limonciello <mario.limonciello@amd.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit 280b68a3b3 upstream.
Hygon systems support the MONITOR/MWAIT instructions and these can be
used for ACPI C1 in the same way as on AMD and Intel systems.
The BIOS declares a C1 state in _CST to use FFH and CPUID_Fn00000005_EDX
is non-zero on Hygon systems.
Allow ffh_cstate_init() to succeed on Hygon systems to default using FFH
MWAIT instead of HALT for ACPI C1.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Borislav Petkov <bp@suse.de>
Link: https://lkml.kernel.org/r/20210528081417.31474-1-puwen@hygon.cn
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit 59eca2fa19 upstream.
Set the maximum DIE per package variable on Hygon using the
nodes_per_socket value in order to do per-DIE manipulations for drivers
such as powercap.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Ingo Molnar <mingo@kernel.org>
Link: https://lkml.kernel.org/r/20210302020217.1827-1-puwen@hygon.cn
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit cb09a37972 upstream.
CPUID Leaf 0x1F defines a DIE_TYPE level (nb: ECX[8:15] level type == 0x5),
but CPUID Leaf 0xB does not. However, detect_extended_topology() will
set struct cpuinfo_x86.cpu_die_id regardless of whether a valid Die ID
was found.
Only set cpu_die_id if a DIE_TYPE level is found. CPU topology code may
use another value for cpu_die_id, e.g. the AMD NodeId on AMD-based
systems. Code ordering should be maintained so that the CPUID Leaf 0x1F
Die ID value will take precedence on systems that may use another value.
Suggested-by: Borislav Petkov <bp@alien8.de>
Signed-off-by: Yazen Ghannam <yazen.ghannam@amd.com>
Signed-off-by: Borislav Petkov <bp@suse.de>
Link: https://lkml.kernel.org/r/20201109210659.754018-5-Yazen.Ghannam@amd.com
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit a0bc32b3ca upstream.
...because future AMD systems will support up to 64 MCA banks per CPU.
MAX_NR_BANKS is used to allocate a number of data structures, and it is
used as a ceiling for values read from MCG_CAP[Count]. Therefore, this
change will have no functional effect on existing systems with 32 or
fewer MCA banks per CPU.
However, this will increase the size of the following structures:
Global bitmaps:
- core.c / mce_banks_ce_disabled
- core.c / all_banks
- core.c / valid_banks
- core.c / toclear
- Total: 32 new bits * 4 bitmaps = 16 new bytes
Per-CPU bitmaps:
- core.c / mce_poll_banks
- intel.c / mce_banks_owned
- Total: 32 new bits * 2 bitmaps = 8 new bytes
The bitmaps are arrays of longs. So this change will only affect 32-bit
execution, since there will be one additional long used. There will be
no additional memory use on 64-bit execution, because the size of long
is 64 bits.
Global structs:
- amd.c / struct smca_bank smca_banks[]: 16 bytes per bank
- core.c / struct mce_bank_dev mce_bank_devs[]: 56 bytes per bank
- Total: 32 new banks * (16 + 56) bytes = 2304 new bytes
Per-CPU structs:
- core.c / struct mce_bank mce_banks_array[]: 16 bytes per bank
- Total: 32 new banks * 16 bytes = 512 new bytes
32-bit
Total global size increase: 2320 bytes
Total per-CPU size increase: 520 bytes
64-bit
Total global size increase: 2304 bytes
Total per-CPU size increase: 512 bytes
This additional memory should still fit within the existing .data
section of the kernel binary. However, in the case where it doesn't
fit, an additional page (4kB) of memory will be added to the binary to
accommodate the extra data which will be the maximum size increase of
vmlinux.
Signed-off-by: Akshay Gupta <Akshay.Gupta@amd.com>
[ Adjust commit message and code comment. ]
Signed-off-by: Yazen Ghannam <yazen.ghannam@amd.com>
Signed-off-by: Borislav Petkov <bp@suse.de>
Link: https://lkml.kernel.org/r/20200828192412.320052-1-Yazen.Ghannam@amd.com
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
commit 384b02d6b8 upstream.
Add device HID HYGO0010 to match the Hygon ACPI Vendor ID (HYGO) that
was registered in http://www.uefi.org/acpi_id_list, and the I2C
controller on Hygon paltform will use the HID.
Signed-off-by: Pu Wen <puwen@hygon.cn>
Acked-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Acked-by: Wolfram Sang <wsa@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
[fix conflict during backport]
Signed-off-by: Pu Wen <puwen@hygon.cn>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: Bin Lai <robinlai@tencent.com>
Signed-off-by: Jinliang Zheng <alexjlzheng@tencent.com>
Reviewed-by: caelli <caelli@tencent.com>
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Qemu not support iommu, PCG want using vfio ko with
enable_unsafe_noiommu_mode=1 to improve the speed.
Signed-off-by: Jianping Liu <frankjpliu@tencent.com>
Reviewed-by: Jason Xing <kernelxing@tencent.com>
Reviewed-by: aurelianliu <aurelianliu@tencent.com>
Signed-off-by: Yongliang Gao <leonylgao@tencent.com>
Jinliang Zheng