The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-22-daniel.lezcano@linexp.org
Reviewed-by: Bryan Brattlof <bb@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Expose the thermal sensors on K3 AM654 as hwmon devices, so that
temperatures could be read using lm-sensors.
Signed-off-by: Massimiliano Minella <massimiliano.minella@gmail.com>
Link: https://lore.kernel.org/r/20220401151656.913166-1-massimiliano.minella@se.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
Daniel Lezcano