Commit Graph

276 Commits

Author SHA1 Message Date
Rafael J. Wysocki 3bf1b15712 Merge branch 'thermal-core'
Merge thermal control core fixes for 6.0-rc3:

 - Fix missing required property for thermal zone description (Daniel
   Lezcano).

 - Add missing export symbol for
   thermal_zone_device_register_with_trips() (Daniel Lezcano).

* thermal-core:
  dt-bindings: thermal: Fix missing required property
  thermal/core: Add missing EXPORT_SYMBOL_GPL
2022-08-27 15:07:58 +02:00
Geert Uytterhoeven 8aa48ade7d dt-bindings: Fix incorrect "the the" corrections
Lots of double occurrences of "the" were replaced by single occurrences,
but some of them should become "to the" instead.

Fixes: 12e5bde18d ("dt-bindings: Fix typo in comment")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/c5743c0a1a24b3a8893797b52fed88b99e56b04b.1660755148.git.geert+renesas@glider.be
Signed-off-by: Jakub Kicinski <kuba@kernel.org>
2022-08-18 10:59:33 -07:00
Daniel Lezcano 8c59632423 dt-bindings: thermal: Fix missing required property
When the thermal zone description was converted to yaml schema, the
required 'trips' property was forgotten.

The initial text bindings was describing:

"
[ ... ]

* Thermal zone nodes

The thermal zone node is the node containing all the required info
for describing a thermal zone, including its cooling device bindings. The
thermal zone node must contain, apart from its own properties, one sub-node
containing trip nodes and one sub-node containing all the zone cooling maps.

Required properties:
- polling-delay:        The maximum number of milliseconds to wait between polls
  Type: unsigned        when checking this thermal zone.
  Size: one cell

- polling-delay-passive: The maximum number of milliseconds to wait
  Type: unsigned        between polls when performing passive cooling.
  Size: one cell

- thermal-sensors:      A list of thermal sensor phandles and sensor specifier
  Type: list of         used while monitoring the thermal zone.
  phandles + sensor
  specifier

- trips:                A sub-node which is a container of only trip point nodes
  Type: sub-node        required to describe the thermal zone.

Optional property:
- cooling-maps:         A sub-node which is a container of only cooling device
  Type: sub-node        map nodes, used to describe the relation between trips
                        and cooling devices.
  [ ... ]

"

Now the schema describes:

"
    [ ... ]

    required:
      - polling-delay
      - polling-delay-passive
      - thermal-sensors

    [ ... ]
"

Add the missing 'trips' property in the required properties.

Fixed: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
2022-08-15 20:38:40 +02:00
Linus Torvalds da8d07af4b Devicetree updates for v6.0:
Bindings:
 - Add spi-peripheral-props.yaml references to various SPI device
   bindings
 
 - Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
   skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm CCN
   PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and arm-firmware-suite
   bindings to DT schema format
 
 - New bindings for Arm virtual platforms display, Qualcomm IMEM memory
   region, Samsung S5PV210 ChipID, EM Microelectronic EM3027 RTC, and
   arm,cortex-a78ae
 
 - Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
   quanta, and densitron
 
 - Add missing MSI and IOMMU properties to host-generic-pci
 
 - Remove bindings for removed EFM32 platform
 
 - Remove old chosen.txt binding (replaced by schema)
 
 - Treewide add missing type information for properties
 
 - Treewide fixing of typos and its vs. it's in bindings. Its all good
   now.
 
 - Drop unnecessary quoting in power related schemas
 
 - Several LED binding updates which didn't get picked up
 
 - Move various bindings to proper directories
 
 DT core code:
 - Convert unittest GPIO related tests to use fwnode
 
 - Check ima-kexec-buffer against memory bounds
 
 - Print reserved-memory allocation/reservation failures as errors
 
 - Cleanup early_init_dt_reserve_memory_arch()
 
 - Simplify of_overlay_fdt_apply() tail
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Merge tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "Bindings:

   - Add spi-peripheral-props.yaml references to various SPI device
     bindings

   - Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
     skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
     CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
     arm-firmware-suite bindings to DT schema format

   - New bindings for Arm virtual platforms display, Qualcomm IMEM
     memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
     RTC, and arm,cortex-a78ae

   - Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
     quanta, and densitron

   - Add missing MSI and IOMMU properties to host-generic-pci

   - Remove bindings for removed EFM32 platform

   - Remove old chosen.txt binding (replaced by schema)

   - Treewide add missing type information for properties

   - Treewide fixing of typos and its vs. it's in bindings. Its all good
     now.

   - Drop unnecessary quoting in power related schemas

   - Several LED binding updates which didn't get picked up

   - Move various bindings to proper directories

  DT core code:

   - Convert unittest GPIO related tests to use fwnode

   - Check ima-kexec-buffer against memory bounds

   - Print reserved-memory allocation/reservation failures as errors

   - Cleanup early_init_dt_reserve_memory_arch()

   - Simplify of_overlay_fdt_apply() tail"

* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
  dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
  dt-bindings: power: supply: drop quotes when not needed
  dt-bindings: power: reset: drop quotes when not needed
  dt-bindings: power: drop quotes when not needed
  dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
  of/fdt: declared return type does not match actual return type
  devicetree/bindings: correct possessive "its" typos
  dt-bindings: net: convert emac_rockchip.txt to YAML
  dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
  dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
  dt-bindings: display: use spi-peripheral-props.yaml
  dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
  dt-bindings: power: reset: qcom,pon: use absolute path to other schema
  dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
  dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
  dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
  of/fdt: Clean up early_init_dt_reserve_memory_arch()
  dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
  dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
  dt-bindings: rtc: ds1307: Convert to json-schema
  ...
2022-08-04 18:08:34 -07:00
Linus Torvalds c1dbe9a1c8 Thermal control updates for 5.20-rc1
- Consolidate the thermal core code by beginning to move the thermal
    trip structure from the thermal OF code as a generic structure to be
    used by the different sensors when registering a thermal zone
    (Daniel Lezcano).
 
  - Make per cpufreq / devfreq cooling device ops instead of using a
    global variable, fix comments and rework the trace information
    (Lukasz Luba).
 
  - Add the include/dt-bindings/thermal.h under the area covered by the
    thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
 
  - Improve the error output by giving the sensor identification when a
    thermal zone failed to initialize, the DT bindings by changing the
    positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
    Sang).
 
  - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
    Kozlowski).
 
  - Remove the pointless get_trend() function in the QCom, Ux500 and
    tegra thermal drivers, along with the unused DROP_FULL and
    RAISE_FULL trends definitions. Simplify the code by using clamp()
    macros (Daniel Lezcano).
 
  - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
    (Bryan Brattlof).
 
  - Fix array underflow in prep_lookup_table (Dan Carpenter).
 
  - Add static annotation to the k3_j72xx_bandgap_j7* data structure
    (Jin Xiaoyun).
 
  - Fix typos in comments detected on sun8i by Coccinelle (Julia
    Lawall).
 
  - Fix typos in comments on rzg2l (Biju Das).
 
  - Remove as unnecessary call to dev_err() as the error is already
    printed by the failing function on u8500 (Yang Li).
 
  - Register the thermal zones as hwmon sensors for the Qcom thermal
    sensors (Dmitry Baryshkov).
 
  - Fix 'tmon' tool compilation issue by adding phtread.h include
    (Markus Mayer).
 
  - Fix typo in the comments for the 'tmon' tool (Slark Xiao).
 
  - Make the thermal core use ida_alloc()/free() directly instead of
    ida_simple_get()/ida_simple_remove() that have been deprecated
    (keliu).
 
  - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control
    driver (Rafael Wysocki).
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Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
 "These start a rework of the handling of trip points in the thermal
  core, improve the cpufreq/devfreq cooling device handling, update some
  thermal control drivers and the tmon utility and clean up code.

  Specifics:

   - Consolidate the thermal core code by beginning to move the thermal
     trip structure from the thermal OF code as a generic structure to
     be used by the different sensors when registering a thermal zone
     (Daniel Lezcano).

   - Make per cpufreq / devfreq cooling device ops instead of using a
     global variable, fix comments and rework the trace information
     (Lukasz Luba).

   - Add the include/dt-bindings/thermal.h under the area covered by the
     thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).

   - Improve the error output by giving the sensor identification when a
     thermal zone failed to initialize, the DT bindings by changing the
     positive logic and adding the r8a779f0 support on the rcar3
     (Wolfram Sang).

   - Convert the QCom tsens DT binding to the dtsformat format
     (Krzysztof Kozlowski).

   - Remove the pointless get_trend() function in the QCom, Ux500 and
     tegra thermal drivers, along with the unused DROP_FULL and
     RAISE_FULL trends definitions. Simplify the code by using clamp()
     macros (Daniel Lezcano).

   - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
     (Bryan Brattlof).

   - Fix array underflow in prep_lookup_table (Dan Carpenter).

   - Add static annotation to the k3_j72xx_bandgap_j7* data structure
     (Jin Xiaoyun).

   - Fix typos in comments detected on sun8i by Coccinelle (Julia
     Lawall).

   - Fix typos in comments on rzg2l (Biju Das).

   - Remove as unnecessary call to dev_err() as the error is already
     printed by the failing function on u8500 (Yang Li).

   - Register the thermal zones as hwmon sensors for the Qcom thermal
     sensors (Dmitry Baryshkov).

   - Fix 'tmon' tool compilation issue by adding phtread.h include
     (Markus Mayer).

   - Fix typo in the comments for the 'tmon' tool (Slark Xiao).

   - Make the thermal core use ida_alloc()/free() directly instead of
     ida_simple_get()/ida_simple_remove() that have been deprecated
     (keliu).

   - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
     control driver (Rafael Wysocki)"

* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
  thermal/of: Initialize trip points separately
  thermal/of: Use thermal trips stored in the thermal zone
  thermal/core: Add thermal_trip in thermal_zone
  thermal/core: Rename 'trips' to 'num_trips'
  thermal/core: Move thermal_set_delay_jiffies to static
  thermal/core: Remove unneeded EXPORT_SYMBOLS
  thermal/of: Move thermal_trip structure to thermal.h
  thermal/of: Remove the device node pointer for thermal_trip
  thermal/of: Replace device node match with device node search
  thermal/core: Remove duplicate information when an error occurs
  thermal/core: Avoid calling ->get_trip_temp() unnecessarily
  thermal/tools/tmon: Fix typo 'the the' in comment
  thermal/tools/tmon: Include pthread and time headers in tmon.h
  thermal/ti-soc-thermal: Fix comment typo
  thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
  thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
  thermal/drivers/u8500: Remove unnecessary print function dev_err()
  thermal/drivers/rzg2l: Fix comments
  thermal/drivers/sun8i: Fix typo in comment
  thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
  ...
2022-08-02 11:27:53 -07:00
Rafael J. Wysocki da9d01794e - Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
   (Lukasz Luba)
 
 - Add the include/dt-bindings/thermal.h under the area covered by the
   thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
 
 - Improve the error output by giving the sensor identification when a
   thermal zone failed to initialize, the DT bindings by changing the
   positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
   Sang)
 
 - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
   Kozlowski)
 
 - Remove the pointless get_trend() function in the QCom, Ux500 and
   tegra thermal drivers, along with the unused DROP_FULL and
   RAISE_FULL trends definitions. Simplify the code by using clamp()
   macros (Daniel Lezcano)
 
 - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
   (Bryan Brattlof)
 
 - Fix array underflow in prep_lookup_table (Dan Carpenter)
 
 - Add static annotation to the k3_j72xx_bandgap_j7* data structure
   (Jin Xiaoyun)
 
 - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
 
 - Fix typos in comments on rzg2l (Biju Das)
 
 - Remove as unnecessary call to dev_err() as the error is already
   printed by the failing function on u8500 (Yang Li)
 
 - Register the thermal zones as hwmon sensors for the Qcom thermal
   sensors (Dmitry Baryshkov)
 
 - Fix 'tmon' tool compilation issue by adding phtread.h include
   (Markus Mayer)
 
 - Fix typo in the comments for the 'tmon' tool (Slark Xiao)
 
 - Consolidate the thermal core code by beginning to move the thermal
   trip structure from the thermal OF code as a generic structure to be
   used by the different sensors when registering a thermal zone
   (Daniel Lezcano)
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Merge tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal control changes for 5.20-rc1 from Daniel Lezcano:

"- Make per cpufreq / devfreq cooling device ops instead of using a
   global variable, fix comments and rework the trace information
   (Lukasz Luba)

 - Add the include/dt-bindings/thermal.h under the area covered by the
   thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)

 - Improve the error output by giving the sensor identification when a
   thermal zone failed to initialize, the DT bindings by changing the
   positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
   Sang)

 - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
   Kozlowski)

 - Remove the pointless get_trend() function in the QCom, Ux500 and
   tegra thermal drivers, along with the unused DROP_FULL and
   RAISE_FULL trends definitions. Simplify the code by using clamp()
   macros (Daniel Lezcano)

 - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
   (Bryan Brattlof)

 - Fix array underflow in prep_lookup_table (Dan Carpenter)

 - Add static annotation to the k3_j72xx_bandgap_j7* data structure
   (Jin Xiaoyun)

 - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)

 - Fix typos in comments on rzg2l (Biju Das)

 - Remove as unnecessary call to dev_err() as the error is already
   printed by the failing function on u8500 (Yang Li)

 - Register the thermal zones as hwmon sensors for the Qcom thermal
   sensors (Dmitry Baryshkov)

 - Fix 'tmon' tool compilation issue by adding phtread.h include
   (Markus Mayer)

 - Fix typo in the comments for the 'tmon' tool (Slark Xiao)

 - Consolidate the thermal core code by beginning to move the thermal
   trip structure from the thermal OF code as a generic structure to be
   used by the different sensors when registering a thermal zone
   (Daniel Lezcano)"

* tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits)
  thermal/of: Initialize trip points separately
  thermal/of: Use thermal trips stored in the thermal zone
  thermal/core: Add thermal_trip in thermal_zone
  thermal/core: Rename 'trips' to 'num_trips'
  thermal/core: Move thermal_set_delay_jiffies to static
  thermal/core: Remove unneeded EXPORT_SYMBOLS
  thermal/of: Move thermal_trip structure to thermal.h
  thermal/of: Remove the device node pointer for thermal_trip
  thermal/of: Replace device node match with device node search
  thermal/core: Remove duplicate information when an error occurs
  thermal/core: Avoid calling ->get_trip_temp() unnecessarily
  thermal/tools/tmon: Fix typo 'the the' in comment
  thermal/tools/tmon: Include pthread and time headers in tmon.h
  thermal/ti-soc-thermal: Fix comment typo
  thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
  thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
  thermal/drivers/u8500: Remove unnecessary print function dev_err()
  thermal/drivers/rzg2l: Fix comments
  thermal/drivers/sun8i: Fix typo in comment
  thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
  ...
2022-07-29 19:10:56 +02:00
Wolfram Sang 83b4466b3f dt-bindings: thermal: rcar-gen3-thermal: Add r8a779f0 support
Add support for R-Car S4. The S4 IP differs a bit from its siblings in
such way that it has 3 out of 4 TSC nodes for Linux and the interrupts
are not routed to the INTC-AP but to the ECM.

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:45 +02:00
Wolfram Sang 3c1fa94cd0 dt-bindings: thermal: rcar-gen3-thermal: use positive logic
When handling the V3U/r8a779a0 exception, avoid using 'not:' because
then its subschemas are far away in the 'else:' branch. Keep them
together using positive logic.

Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220610201701.7946-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:44 +02:00
Krzysztof Kozlowski f16d37056b dt-bindings: thermal: qcom,spmi-temp-alarm: convert to dtschema
Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220608112702.80873-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28 17:29:44 +02:00
Slark Xiao 12e5bde18d dt-bindings: Fix typo in comment
Fix typo in the comment

Signed-off-by: Slark Xiao <slark_xiao@163.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220721011746.19663-1-slark_xiao@163.com
2022-07-21 13:14:27 -06:00
Abel Vesa 636ad31bd2 dt-bindings: thermal: Add fsl,scu-thermal yaml file
In order to replace the fsl,scu txt file from bindings/arm/freescale,
we need to split it between the right subsystems. This patch documents
separately the 'thermal' child node of the SCU main node.

Signed-off-by: Abel Vesa <abel.vesa@nxp.com>
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
2022-07-08 16:35:24 +08:00
Linus Torvalds 86c87bea6b Devicetree updates for v5.19:
Bindings:
 - Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm, qcom,i2c-qup,
   qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new props), qcom,smp2p, TI
   timer, Mediatek gnss, Mediatek topckgen, Mediatek apmixedsys, Mediatek
   infracfg, fsl,ls-extirq, fsl,layerscape-dcfg, QCom PMIC SPMI,
   rda,8810pl-timer, Xilinx zynqmp_ipi, uniphier-pcie, and Ilitek
   touchscreen controllers
 
 - Convert various Arm Ltd peripheral IP bindings to schemas
 
 - New bindings for Menlo board CPLD, DH electronics board CPLD,
   Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
   GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and Microchip/SMSC
   LAN95xx USB Ethernet controllers
 
 - Add vendor prefix for Enclustra
 
 - Add various compatible string additions
 
 - Various example fixes and cleanups
 
 - Remove unused hisilicon,hi6220-reset binding
 
 - Treewide fix properties missing type definition
 
 - Drop some empty and unreferenced .txt bindings
 
 - Documentation improvements for writing schemas
 
 DT driver core:
 - Drop static IRQ resources for DT platform devices as IRQ setup is
   dynamic and drivers have all been converted to use platform_get_irq()
   and friends
 
 - Rework memory allocations and frees for overlays
 
 - Continue overlay notifier callbacks on successful calls and add
   unittests
 
 - Handle 'interrupts-extended' in early DT IRQ setup
 
 - Fix of_property_read_string() errors to match documentation
 
 - Ignore disabled nodes in FDT API calls
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Merge tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "Bindings:

   - Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm,
     qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new
     props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen,
     Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq,
     fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx
     zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers

   - Convert various Arm Ltd peripheral IP bindings to schemas

   - New bindings for Menlo board CPLD, DH electronics board CPLD,
     Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
     GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and
     Microchip/SMSC LAN95xx USB Ethernet controllers

   - Add vendor prefix for Enclustra

   - Add various compatible string additions

   - Various example fixes and cleanups

   - Remove unused hisilicon,hi6220-reset binding

   - Treewide fix properties missing type definition

   - Drop some empty and unreferenced .txt bindings

   - Documentation improvements for writing schemas

  DT driver core:

   - Drop static IRQ resources for DT platform devices as IRQ setup is
     dynamic and drivers have all been converted to use
     platform_get_irq() and friends

   - Rework memory allocations and frees for overlays

   - Continue overlay notifier callbacks on successful calls and add
     unittests

   - Handle 'interrupts-extended' in early DT IRQ setup

   - Fix of_property_read_string() errors to match documentation

   - Ignore disabled nodes in FDT API calls"

* tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits)
  of/irq: fix typo in comment
  dt-bindings: Fix properties without any type
  Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example"
  dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings
  dt-bindings: timer: samsung,exynos4210-mct: define strict clock order
  dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems
  dt-bindings: timer: cdns,ttc: drop unneeded minItems
  dt-bindings: mailbox: zynqmp_ipi: convert to yaml
  dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller
  dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers
  dt-bindings: net: add schema for ASIX USB Ethernet controllers
  of/fdt: Ignore disabled memory nodes
  dt-bindings: arm: fix typos in compatible
  dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360
  dt-bindings: display: convert Arm Komeda to DT schema
  dt-bindings: display: convert Arm Mali-DP to DT schema
  dt-bindings: display: convert Arm HDLCD to DT schema
  dt-bindings: display: convert PL110/PL111 to DT schema
  dt-bindings: arm: convert vexpress-config to DT schema
  dt-bindings: arm: convert vexpress-sysregs to DT schema
  ...
2022-05-25 14:56:06 -07:00
Keerthy 031c2952d1 dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:53 +02:00
Bjorn Andersson 30988d3b31 dt-bindings: thermal: tsens: Add sc8280xp compatible
The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:52 +02:00
Bjorn Andersson b54d4dafc9 dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
Add compatible for the LMh blocks found in the Qualcomm sc8180x
platform.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:52 +02:00
Biju Das e126ce0bcc dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:52 +02:00
Dmitry Baryshkov a63fa2b601 dt-bindings: thermal: qcom-tsens.yaml: add msm8960 compat string
Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.

Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:51 +02:00
Jishnu Prakash e46e003a48 dt-bindings: thermal: qcom: add PMIC5 Gen2 ADC_TM bindings
Add documentation for PMIC5 Gen2 ADC_TM peripheral.
It is used for monitoring ADC channel thresholds for PMIC7-type
PMICs. It is present on PMK8350, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
on a target, through PBS(Programmable Boot Sequence).

Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:50 +02:00
Lad Prabhakar feef7f3252 dt-bindings: thermal: rzg2l-thermal: Document RZ/V2L bindings
Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.

Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:50 +02:00
Rob Herring 52bf4b7147 Merge branch 'dt/linus' into dt/next
Pick up new meta-schema fixes.
2022-05-09 11:50:27 -05:00
Linus Torvalds f47c960e93 Devicetree fixes for v5.18, part 3:
- Drop unused 'max-link-speed' in Apple PCIe
 
 - More redundant 'maxItems/minItems' schema fixes
 
 - Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
 
 - Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
 
 - Add missing 'power-domains' property to Cadence UFSHC
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Merge tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree fixes from Rob Herring:

 - Drop unused 'max-link-speed' in Apple PCIe

 - More redundant 'maxItems/minItems' schema fixes

 - Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'

 - Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding

 - Add missing 'power-domains' property to Cadence UFSHC

* tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux:
  dt-bindings: pci: apple,pcie: Drop max-link-speed from example
  dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas
  dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain
  dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties'
  dt-bindings: ufs: cdns,ufshc: Add power-domains
2022-05-05 15:50:27 -07:00
Rob Herring caf83e494d dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas
Another round of removing redundant minItems/maxItems when 'items' list is
specified. This time it is in if/then schemas as the meta-schema was
failing to check this case.

If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.

Signed-off-by: Rob Herring <robh@kernel.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for IIO
Link: https://lore.kernel.org/r/20220503162738.3827041-1-robh@kernel.org
2022-05-04 16:19:03 -05:00
Luca Weiss 0bd1767942 dt-bindings: thermal: tsens: Add SM6350 compatible
Add devicetree compatible for tsens on SM6350 SoC.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211213082614.22651-6-luca.weiss@fairphone.com
2022-04-08 09:24:07 -05:00
Krzysztof Kozlowski 8a1e6bb3f7 dt-bindings: update Krzysztof Kozlowski's email
Krzysztof Kozlowski's @canonical.com email stopped working, so switch to
generic @kernel.org account for all Devicetree bindings.

Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Link: https://lore.kernel.org/r/20220330074016.12896-2-krzysztof.kozlowski@linaro.org
2022-04-04 15:43:20 +02:00
Linus Torvalds 9bf3fc5007 Devicetree updates for v5.18:
- Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
   much needed help.
 
 - DT schema validation now takes DTB files as input rather than
   intermediate YAML files. This decouples the validation from the source
   level syntax information. There's a bunch of schema fixes as a result
   of switching to DTB based validation which exposed some errors
   and incomplete schemas and examples.
 
 - Kbuild improvements to explicitly warn users running 'make
   dt_binding_check' on missing yamllint
 
 - Expand DT_SCHEMA_FILES kbuild variable to take just a partial filename
   or path instead of the full path to 1 file.
 
 - Convert various bindings to schema format: mscc,vsc7514-switch,
   multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
   bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
   SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
   subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
   msm/mdp4, rda,8810pl-uart
 
 - New schemas for u-boot environment variable partition, TI clksel
 
 - New compatible strings for Renesas RZ/V2L SoC
 
 - Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated HiSilicon
 
 - Add/fix schemas for QEMU Arm 'virt' machine
 
 - Drop unused of_alias_get_alias_list() function
 
 - Add a script to check DT unittest EXPECT message output. Pass messages
   also now print by default at PR_INFO level to help test automation.
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Merge tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:

 - Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
   much needed help.

 - DT schema validation now takes DTB files as input rather than
   intermediate YAML files. This decouples the validation from the
   source level syntax information. There's a bunch of schema fixes as a
   result of switching to DTB based validation which exposed some errors
   and incomplete schemas and examples.

 - Kbuild improvements to explicitly warn users running 'make
   dt_binding_check' on missing yamllint

 - Expand DT_SCHEMA_FILES kbuild variable to take just a partial
   filename or path instead of the full path to 1 file.

 - Convert various bindings to schema format: mscc,vsc7514-switch,
   multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
   bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
   SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
   subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
   msm/mdp4, rda,8810pl-uart

 - New schemas for u-boot environment variable partition, TI clksel

 - New compatible strings for Renesas RZ/V2L SoC

 - Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated
   HiSilicon

 - Add/fix schemas for QEMU Arm 'virt' machine

 - Drop unused of_alias_get_alias_list() function

 - Add a script to check DT unittest EXPECT message output. Pass
   messages also now print by default at PR_INFO level to help test
   automation.

* tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (96 commits)
  dt-bindings: kbuild: Make DT_SCHEMA_LINT a recursive variable
  dt-bindings: nvmem: add U-Boot environment variables binding
  dt-bindings: ufs: qcom: Add SM6350 compatible string
  dt-bindings: dmaengine: sifive,fu540-c000: include generic schema
  dt-bindings: gpio: pca95xx: drop useless consumer example
  Revert "of: base: Introduce of_alias_get_alias_list() to check alias IDs"
  dt-bindings: virtio,mmio: Allow setting devices 'dma-coherent'
  dt-bindings: gnss: Add two more chips
  dt-bindings: gnss: Rewrite sirfstar binding in YAML
  dt-bindings: gnss: Modify u-blox to use common bindings
  dt-bindings: gnss: Rewrite common bindings in YAML
  dt-bindings: ata: ahci-platform: Add rk3568-dwc-ahci compatible
  dt-bindings: ata: ahci-platform: Add power-domains property
  dt-bindings: ata: ahci-platform: Convert DT bindings to yaml
  dt-bindings: kbuild: Use DTB files for validation
  dt-bindings: kbuild: Pass DT_SCHEMA_FILES to dt-validate
  dt-bindings: Add QEMU virt machine compatible
  dt-bindings: arm: Convert QEMU fw-cfg to DT schema
  dt-bindings: i2c: at91: Add SAMA7G5 compatible strings list
  dt-bindings: i2c: convert i2c-at91 to json-schema
  ...
2022-03-26 11:41:53 -07:00
Luca Weiss e8ec6bb302 dt-bindings: thermal: tsens: Add msm8953 compatible
Document the compatible string for tsens found in msm8953.

Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-03-08 21:26:09 +01:00
Thara Gopinath 1f43fad101 dt-bindings: thermal: Add sm8150 compatible string for LMh
Extend the LMh dt binding document to include compatible string
supporting sm8150 SoC.

Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220106173138.411097-4-thara.gopinath@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-03-08 21:26:09 +01:00
Krzysztof Kozlowski 0fb74d0d21 dt-bindings: thermal: samsung: Convert to dtschema
Convert the Samsung Exynos SoC Thermal Management Unit bindings to DT
schema format.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220122132554.65192-2-krzysztof.kozlowski@canonical.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-03-08 21:26:08 +01:00
Rob Herring 39bd2b6a37 dt-bindings: Improve phandle-array schemas
The 'phandle-array' type is a bit ambiguous. It can be either just an
array of phandles or an array of phandles plus args. Many schemas for
phandle-array properties aren't clear in the schema which case applies
though the description usually describes it.

The array of phandles case boils down to needing:

items:
  maxItems: 1

The phandle plus args cases should typically take this form:

items:
  - items:
      - description: A phandle
      - description: 1st arg cell
      - description: 2nd arg cell

With this change, some examples need updating so that the bracketing of
property values matches the schema.

Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Stephen Boyd <sboyd@kernel.org>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Link: https://lore.kernel.org/r/20220119015038.2433585-1-robh@kernel.org
2022-02-04 09:43:42 -06:00
Linus Torvalds 4eb766f64d Devicetree updates for v5.17:
Bindings:
 - DT schema conversions for Samsung clocks, RNG bindings, Qcom Command
   DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl, Tegra I2C
   and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
 
 - DT schema conversions for Broadcom platforms: interrupt controllers,
   STB GPIO, STB waketimer, STB reset, iProc MDIO mux, iProc PCIe,
   Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON, SYSTEMPORT, AMAC,
   Northstar 2 PCIe PHY, GENET, moca PHY, GISB arbiter, and SATA
 
 - Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
 
 - Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
 
 - More fixes due to 'unevaluatedProperties' enabling
 
 - Data type fixes and clean-ups of binding examples found in preparation
   to move to validating DTB files directly (instead of intermediate YAML
   representation.
 
 - Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
 
 - Add various new compatible strings
 
 DT core:
 - Silence a warning for overlapping reserved memory regions
 
 - Reimplement unittest overlay tracking
 
 - Fix stack frame size warning in unittest
 
 - Clean-ups of early FDT scanning functions
 
 - Fix handling of "linux,usable-memory-range" on EFI booted systems
 
 - Add support for 'fail' status on CPU nodes
 
 - Improve error message in of_phandle_iterator_next()
 
 - kbuild: Disable duplicate unit-address warnings for disabled nodes
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Merge tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "Bindings:

   - DT schema conversions for Samsung clocks, RNG bindings, Qcom
     Command DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl,
     Tegra I2C and BPMP, pwm-vibrator, Arm DSU, and Cadence macb

   - DT schema conversions for Broadcom platforms: interrupt
     controllers, STB GPIO, STB waketimer, STB reset, iProc MDIO mux,
     iProc PCIe, Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON,
     SYSTEMPORT, AMAC, Northstar 2 PCIe PHY, GENET, moca PHY, GISB
     arbiter, and SATA

   - Add binding schemas for Tegra210 EMC table, TI DC-DC converters,

   - Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues

   - More fixes due to 'unevaluatedProperties' enabling

   - Data type fixes and clean-ups of binding examples found in
     preparation to move to validating DTB files directly (instead of
     intermediate YAML representation.

   - Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus

   - Add various new compatible strings

  DT core:

   - Silence a warning for overlapping reserved memory regions

   - Reimplement unittest overlay tracking

   - Fix stack frame size warning in unittest

   - Clean-ups of early FDT scanning functions

   - Fix handling of "linux,usable-memory-range" on EFI booted systems

   - Add support for 'fail' status on CPU nodes

   - Improve error message in of_phandle_iterator_next()

   - kbuild: Disable duplicate unit-address warnings for disabled nodes"

* tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (114 commits)
  dt-bindings: net: mdio: Drop resets/reset-names child properties
  dt-bindings: clock: samsung: convert S5Pv210 to dtschema
  dt-bindings: clock: samsung: convert Exynos5410 to dtschema
  dt-bindings: clock: samsung: convert Exynos5260 to dtschema
  dt-bindings: clock: samsung: extend Exynos7 bindings with UFS
  dt-bindings: clock: samsung: convert Exynos7 to dtschema
  dt-bindings: clock: samsung: convert Exynos5433 to dtschema
  dt-bindings: i2c: maxim,max96712: Add bindings for Maxim Integrated MAX96712
  dt-bindings: iio: adi,ltc2983: Fix 64-bit property sizes
  dt-bindings: power: maxim,max17040: Fix incorrect type for 'maxim,rcomp'
  dt-bindings: interrupt-controller: arm,gic-v3: Fix 'interrupts' cell size in example
  dt-bindings: iio/magnetometer: yamaha,yas530: Fix invalid 'interrupts' in example
  dt-bindings: clock: imx5: Drop clock consumer node from example
  dt-bindings: Drop required 'interrupt-parent'
  dt-bindings: net: ti,dp83869: Drop value on boolean 'ti,max-output-impedance'
  dt-bindings: net: wireless: mt76: Fix 8-bit property sizes
  dt-bindings: PCI: snps,dw-pcie-ep: Drop conflicting 'max-functions' schema
  dt-bindings: i2c: st,stm32-i2c: Make each example a separate entry
  dt-bindings: net: stm32-dwmac: Make each example a separate entry
  dt-bindings: net: Cleanup MDIO node schemas
  ...
2022-01-12 16:47:05 -08:00
Linus Torvalds fe2437ccbd Thermal control updates for 5.17-rc1
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
    (Biju Das).
 
  - Fix missing check when calling reset_control_deassert() in the
    rz2gl thermal driver (Biju Das).
 
  - In preparation for FORTIFY_SOURCE performing compile-time and
    run-time field bounds checking for memcpy(), avoid intentionally
    writing across neighboring fields in the int340x thermal control
    driver (Kees Cook).
 
  - Fix RFIM mailbox write commands handling in the int340x thermal
    control driver (Sumeet Pawnikar).
 
  - Fix PM issue occurring in the iMX thermal control driver during
    suspend/resume by implementing PM runtime support in it (Oleksij
    Rempel).
 
  - Add 'const' annotation to thermal_cooling_ops in the Intel
    powerclamp driver (Rikard Falkeborn).
 
  - Fix missing ADC bit set in the iMX8MP thermal driver to enable the
    sensor (Paul Gerber).
 
  - Drop unused local variable definition from tmon (ran jianping).
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Merge tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
 "These add a new driver for Renesas RZ/G2L TSU, update a few existing
  thermal control drivers and clean up the tmon utility.

  Specifics:

   - Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
     (Biju Das).

   - Fix missing check when calling reset_control_deassert() in the
     rz2gl thermal driver (Biju Das).

   - In preparation for FORTIFY_SOURCE performing compile-time and
     run-time field bounds checking for memcpy(), avoid intentionally
     writing across neighboring fields in the int340x thermal control
     driver (Kees Cook).

   - Fix RFIM mailbox write commands handling in the int340x thermal
     control driver (Sumeet Pawnikar).

   - Fix PM issue occurring in the iMX thermal control driver during
     suspend/resume by implementing PM runtime support in it (Oleksij
     Rempel).

   - Add 'const' annotation to thermal_cooling_ops in the Intel
     powerclamp driver (Rikard Falkeborn).

   - Fix missing ADC bit set in the iMX8MP thermal driver to enable the
     sensor (Paul Gerber).

   - Drop unused local variable definition from tmon (ran jianping)"

* tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal/drivers/int340x: Fix RFIM mailbox write commands
  thermal/drivers/rz2gl: Add error check for reset_control_deassert()
  thermal/drivers/imx8mm: Enable ADC when enabling monitor
  thermal/drivers: Add TSU driver for RZ/G2L
  dt-bindings: thermal: Document Renesas RZ/G2L TSU
  thermal/drivers/intel_powerclamp: Constify static thermal_cooling_device_ops
  thermal/drivers/imx: Implement runtime PM support
  thermal: tools: tmon: remove unneeded local variable
  thermal: int340x: Use struct_group() for memcpy() region
2022-01-10 20:43:54 -08:00
Thierry Reding a12e1b7812 dt-bindings: thermal: tegra186-bpmp: Convert to json-schema
Convert the Tegra186 (and later) BPMP thermal device tree bindings from
the free-form text format to json-schema.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
2021-12-17 14:58:05 +01:00
Florian Fainelli e4fa9dedc5 dt-bindings: thermal: Convert Broadcom TMON to YAML
Convert the Broadcom AVS TMON Device Tree binding to YAML to help with
validation.

Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20211208003727.3596577-12-f.fainelli@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
2021-12-14 14:27:58 -06:00
Biju Das 9460347192 dt-bindings: thermal: Document Renesas RZ/G2L TSU
Document the Thermal Sensor Unit(TSU) in the RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211130155757.17837-2-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-11-30 17:27:45 +01:00
Niklas Söderlund 49bcb1506f dt-bindings: thermal: Fix definition of cooling-maps contribution property
When converting the thermal-zones bindings to yaml the definition of the
contribution property changed. The intention is the same, an integer
value expressing a ratio of a sum on how much cooling is provided by the
device to the zone. But after the conversion the integer value is
limited to the range 0 to 100 and expressed as a percentage.

This is problematic for two reasons.

- This do not match how the binding is used. Out of the 18 files that
  make use of the property only two (ste-dbx5x0.dtsi and
  ste-hrefv60plus.dtsi) sets it at a value that satisfy the binding,
  100. The remaining 16 files set the value higher and fail to validate.

- Expressing the value as a percentage instead of a ratio of the sum is
  confusing as there is nothing to enforce the sum in the zone is not
  greater then 100.

This patch restore the pre yaml conversion description and removes the
value limitation allowing the usage of the bindings to validate.

Fixes: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Reported-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20211109103045.1403686-1-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Rob Herring <robh@kernel.org>
2021-11-29 14:30:20 -06:00
Patrice Chotard f4eedebdbf dt-bindings: treewide: Update @st.com email address to @foss.st.com
Not all @st.com email address are concerned, only people who have
a specific @foss.st.com email will see their entry updated.
For some people, who left the company, remove their email.

Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Cc: Arnaud Pouliquen <arnaud.pouliquen@foss.st.com>
Cc: Fabien Dessenne <fabien.dessenne@foss.st.com>
Cc: Christophe Roullier <christophe.roullier@foss.st.com>
Cc: Gabriel Fernandez <gabriel.fernandez@foss.st.com>
Cc: Lionel Debieve <lionel.debieve@foss.st.com>
Cc: Amelie Delaunay <amelie.delaunay@foss.st.com>
Cc: Pierre-Yves MORDRET <pierre-yves.mordret@foss.st.com>
Cc: Ludovic Barre <ludovic.barre@foss.st.com>
Cc: Christophe Kerello <christophe.kerello@foss.st.com>
Cc: pascal Paillet <p.paillet@foss.st.com>
Cc: Erwan Le Ray <erwan.leray@foss.st.com>
Cc: Philippe CORNU <philippe.cornu@foss.st.com>
Cc: Yannick Fertre <yannick.fertre@foss.st.com>
Cc: Fabrice Gasnier <fabrice.gasnier@foss.st.com>
Cc: Olivier Moysan <olivier.moysan@foss.st.com>
Cc: Hugues Fruchet <hugues.fruchet@foss.st.com>
Signed-off-by: Patrice Chotard <patrice.chotard@foss.st.com>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20211110150144.18272-6-patrice.chotard@foss.st.com
Signed-off-by: Rob Herring <robh@kernel.org>
2021-11-11 22:27:16 -06:00
Kunihiko Hayashi 5041e63aaf dt-bindings: thermal: uniphier: Add binding for NX1 SoC
Update thermal binding document for UniPhier NX1 SoC.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Link: https://lore.kernel.org/r/1634520891-16801-2-git-send-email-hayashi.kunihiko@socionext.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-18 13:59:57 +02:00
Johan Jonker 5f553ac232 dt-bindings: thermal: remove redundant comments from rockchip-thermal.yaml
Remove redundent comments from rockchip-thermal.yaml
Sort compatibles in alphabetical order.

Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-2-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-17 00:14:55 +02:00
Johan Jonker 07c54d9a40 dt-bindings: thermal: allow more resets for tsadc node in rockchip-thermal.yaml
The tsadc node in rk356x.dtsi has more resets defined then currently
allowed by rockchip-thermal.yaml, so fix that in the documentation.
The driver now uses the devm_reset_control_array_get() function,
so reset-names is no longer required, but keep it for legacy reasons.

Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-1-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-17 00:14:55 +02:00
Bjorn Andersson db03874b85 dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindings
The HC generation of the ADC Thermal Monitor is quite similar to the 5th
generation, but differs in valid values for a few properties. Create a
new binding for the HC version of the hardware, rather than sprinkle
conditionals throughout the existing binding.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211005032531.2251928-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-10-15 09:13:55 +02:00
Linus Torvalds dd4703876e - Add the tegra3 thermal sensor and fix the compilation testing on
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
   (Dmitry Osipenko)
 
 - Fix the error code for the exynos when devm_get_clk() fails (Dan
   Carpenter)
 
 - Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
 
 - Add support for hardware trip points for the rcar gen3 thermal
   driver and store TSC id as unsigned int (Niklas Söderlund)
 
 - Replace the deprecated CPU-hotplug functions get_online_cpus() and
   put_online_cpus (Sebastian Andrzej Siewior)
 
 - Add the thermal tools directory in the MAINTAINERS file (Daniel
   Lezcano)
 
 - Fix the Makefile and the cross compilation flags for the userspace
   'tmon' tool (Rolf Eike Beer)
 
 - Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
   Pawnikar)
 
 - Fix the stub thermal_cooling_device_register() function prototype
   which does not match the real function (Arnd Bergmann)
 
 - Make the thermal trip point optional in the DT bindings (Maxime
   Ripard)
 
 - Fix a typo in a comment in the core code (Geert Uytterhoeven)
 
 - Reduce the verbosity of the trace in the SoC thermal tegra driver
   (Dmitry Osipenko)
 
 - Add the support for the LMh (Limit Management hardware) driver on
   the QCom platforms (Thara Gopinath)
 
 - Allow processing of HWP interrupt by adding a weak function in the
   Intel driver (Srinivas Pandruvada)
 
 - Prevent an abort of the sensor probe is a channel is not used
   (Matthias Kaehlcke)
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Merge tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

 - Add the tegra3 thermal sensor and fix the compilation testing on
   tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
   (Dmitry Osipenko)

 - Fix the error code for the exynos when devm_get_clk() fails (Dan
   Carpenter)

 - Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)

 - Add support for hardware trip points for the rcar gen3 thermal driver
   and store TSC id as unsigned int (Niklas Söderlund)

 - Replace the deprecated CPU-hotplug functions get_online_cpus() and
   put_online_cpus (Sebastian Andrzej Siewior)

 - Add the thermal tools directory in the MAINTAINERS file (Daniel
   Lezcano)

 - Fix the Makefile and the cross compilation flags for the userspace
   'tmon' tool (Rolf Eike Beer)

 - Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
   Pawnikar)

 - Fix the stub thermal_cooling_device_register() function prototype
   which does not match the real function (Arnd Bergmann)

 - Make the thermal trip point optional in the DT bindings (Maxime
   Ripard)

 - Fix a typo in a comment in the core code (Geert Uytterhoeven)

 - Reduce the verbosity of the trace in the SoC thermal tegra driver
   (Dmitry Osipenko)

 - Add the support for the LMh (Limit Management hardware) driver on the
   QCom platforms (Thara Gopinath)

 - Allow processing of HWP interrupt by adding a weak function in the
   Intel driver (Srinivas Pandruvada)

 - Prevent an abort of the sensor probe is a channel is not used
   (Matthias Kaehlcke)

* tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
  thermal/drivers/qcom/spmi-adc-tm5: Don't abort probing if a sensor is not used
  thermal/drivers/intel: Allow processing of HWP interrupt
  dt-bindings: thermal: Add dt binding for QCOM LMh
  thermal/drivers/qcom: Add support for LMh driver
  firmware: qcom_scm: Introduce SCM calls to access LMh
  thermal/drivers/tegra-soctherm: Silence message about clamped temperature
  thermal: Spelling s/scallbacks/callbacks/
  dt-bindings: thermal: Make trips node optional
  thermal/core: Fix thermal_cooling_device_register() prototype
  thermal/drivers/int340x: Use IMOK independently
  tools/thermal/tmon: Add cross compiling support
  thermal/tools/tmon: Improve the Makefile
  MAINTAINERS: Add missing userspace thermal tools to the thermal section
  thermal/drivers/intel_powerclamp: Replace deprecated CPU-hotplug functions.
  thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int
  thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points
  drivers/thermal/intel: Add TCC cooling support for AlderLake platform
  thermal/drivers/exynos: Fix an error code in exynos_tmu_probe()
  thermal/drivers/tegra: Correct compile-testing of drivers
  thermal/drivers/tegra: Add driver for Tegra30 thermal sensor
2021-09-11 09:20:57 -07:00
Thara Gopinath 0284b52e85 dt-bindings: thermal: Add dt binding for QCOM LMh
Add dt binding documentation to describe Qualcomm
Limits Management Hardware node.

Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210809191605.3742979-8-thara.gopinath@linaro.org
2021-08-18 17:53:37 +02:00
Maxime Ripard 22fc857538 dt-bindings: thermal: Make trips node optional
Even though the previous binding made it a required child node, the
implementation in Linux never made it mandatory and just ignored thermal
zones without trip points.

This was even effectively encouraged, since the thermal core wouldn't
allow a thermal sensor to probe without a thermal zone.

In the case where you had a thermal device that had multiple sensors but
with enough knowledge to provide trip points for only a few of them,
this meant that the only way to make that driver probe was to provide a
thermal zone without the trips node required by the binding.

This obviously led to a fair number of device trees doing exactly that,
making the initial binding requirement ineffective.

Let's make it clear by dropping that requirement.

Cc: Amit Kucheria <amitk@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210721140424.725744-34-maxime@cerno.tech
2021-08-14 15:42:30 +02:00
Konrad Dybcio 7c54b82b45 arm64: dts: qcom: sdm630: Add TSENS node
This will enable temperature reporting for various SoC
components.

Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2021-08-04 15:07:03 -05:00
Linus Torvalds f7ea4be434 - Add rk3568 sensor support (Finley Xiao)
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
   Zhang)
 
 - Export additionnal attributes for the int340x thermal processor
   (Srinivas Pandruvada)
 
 - Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
   Kamble)
 
 - Fix kernel documentation for thermal_zone_device_unregister()	and
   use devm_platform_get_and_ioremap_resource() (Yang Yingliang)
 
 - Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
   Söderlund)
 
 - Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
 
 - Add missing of_node_put() for the iMX and Spreadtrum sensors
   (Krzysztof Kozlowski)
 
 - Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
 
 - Stop the thermal zone monitoring when unregistering it to prevent a
   temperature update without the 'get_temp' callback (Dmitry Osipenko)
 
 - Add rk3568 DT bindings, convert bindings to yaml schemas and add the
   corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
 
 - Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
 
 - Use the find_first_zero_bit()	function instead of custom code (Andy
   Shevchenko)
 
 - Fix the kernel doc for the device cooling device (Yang Li)
 
 - Reorg the processor thermal int340x to set the scene for the PCI
   mmio driver (Srinivas Pandruvada)
 
 - Add PCI MMIO driver for the int340x processor thermal driver
   (Srinivas Pandruvada)
 
 - Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
 
 - Fix warning for return value reported by Smatch for the int340x
   thermal processor (Srinivas Pandruvada)
 
 - Fix wrong register access and decoding for the int340x thermal
   processor (Srinivas Pandruvada)
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Merge tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

 - Add rk3568 sensor support (Finley Xiao)

 - Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
   Zhang)

 - Export additionnal attributes for the int340x thermal processor
   (Srinivas Pandruvada)

 - Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
   Kamble)

 - Fix kernel documentation for thermal_zone_device_unregister() and use
   devm_platform_get_and_ioremap_resource() (Yang Yingliang)

 - Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
   Söderlund)

 - Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)

 - Add missing of_node_put() for the iMX and Spreadtrum sensors
   (Krzysztof Kozlowski)

 - Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)

 - Stop the thermal zone monitoring when unregistering it to prevent a
   temperature update without the 'get_temp' callback (Dmitry Osipenko)

 - Add rk3568 DT bindings, convert bindings to yaml schemas and add the
   corresponding compatible in the Rockchip sensor (Ezequiel Garcia)

 - Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)

 - Use the find_first_zero_bit() function instead of custom code (Andy
   Shevchenko)

 - Fix the kernel doc for the device cooling device (Yang Li)

 - Reorg the processor thermal int340x to set the scene for the PCI mmio
   driver (Srinivas Pandruvada)

 - Add PCI MMIO driver for the int340x processor thermal driver
   (Srinivas Pandruvada)

 - Add hwmon sensors for the mediatek sensor (Frank Wunderlich)

 - Fix warning for return value reported by Smatch for the int340x
   thermal processor (Srinivas Pandruvada)

 - Fix wrong register access and decoding for the int340x thermal
   processor (Srinivas Pandruvada)

* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
  thermal/drivers/int340x/processor_thermal: Fix tcc setting
  thermal/drivers/int340x/processor_thermal: Fix warning for return value
  thermal/drivers/mediatek: Add sensors-support
  thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
  thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
  thermal: devfreq_cooling: Fix kernel-doc
  thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
  dt-bindings: thermal: tsens: Add sc8180x compatible
  dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
  dt-bindings: thermal: convert rockchip-thermal to json-schema
  thermal/core/thermal_of: Stop zone device before unregistering it
  dt-bindings: thermal: Add binding for Tegra30 thermal sensor
  thermal/drivers/sprd: Add missing of_node_put for loop iteration
  thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
  thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
  thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
  thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
  thermal/core: Correct function name thermal_zone_device_unregister()
  dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
  thermal/drivers/int340x: processor_thermal: Export additional attributes
  ...
2021-07-10 11:43:25 -07:00
Bjorn Andersson 481bd29729 dt-bindings: thermal: tsens: Add sc8180x compatible
The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
for this.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
2021-07-04 18:28:04 +02:00
Ezequiel Garcia 4b14c055a6 dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
Add a new compatible for the thermal sensor device on RK3568 SoCs.

Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-4-ezequiel@collabora.com
2021-07-04 18:28:04 +02:00
Ezequiel Garcia 7d70aa141e dt-bindings: thermal: convert rockchip-thermal to json-schema
Convert Rockchip Thermal sensor dt-bindings to YAML.

Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-3-ezequiel@collabora.com
2021-07-04 18:28:04 +02:00
Dmitry Osipenko 1aab6b81af dt-bindings: thermal: Add binding for Tegra30 thermal sensor
All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature
and voltage of the SoC. Sensors also controls CPU x2 freq throttle and
emits emergency shutdown signal. TSENSOR has has two separate channels
for each sensor placed in a different parts of the SoC. Add binding for
the sensor hardware.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com
2021-07-04 18:28:04 +02:00
Rob Herring 972d6a7dce dt-bindings: Drop redundant minItems/maxItems
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.

This condition is partially checked with the meta-schema already, but
only if both 'minItems' and 'maxItems' are equal to the 'items' length.
An improved meta-schema is pending.

Cc: Jens Axboe <axboe@kernel.dk>
Cc: Stephen Boyd <sboyd@kernel.org>
Cc: Herbert Xu <herbert@gondor.apana.org.au>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: David Airlie <airlied@linux.ie>
Cc: Daniel Vetter <daniel@ffwll.ch>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Kamal Dasu <kdasu.kdev@gmail.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Marc Zyngier <maz@kernel.org>
Cc: Joerg Roedel <joro@8bytes.org>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Wolfgang Grandegger <wg@grandegger.com>
Cc: Andrew Lunn <andrew@lunn.ch>
Cc: Vivien Didelot <vivien.didelot@gmail.com>
Cc: Vladimir Oltean <olteanv@gmail.com>
Cc: Bjorn Helgaas <bhelgaas@google.com>
Cc: Kishon Vijay Abraham I <kishon@ti.com>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: "Uwe Kleine-König" <u.kleine-koenig@pengutronix.de>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Paul Walmsley <paul.walmsley@sifive.com>
Cc: Palmer Dabbelt <palmer@dabbelt.com>
Cc: Albert Ou <aou@eecs.berkeley.edu>
Cc: Alessandro Zummo <a.zummo@towertech.it>
Cc: Alexandre Belloni <alexandre.belloni@bootlin.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Wim Van Sebroeck <wim@linux-watchdog.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # for MMC
Acked-by: Jassi Brar <jassisinghbrar@gmail.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Arnaud Pouliquen <arnaud.pouliquen@st.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Wolfram Sang <wsa@kernel.org> # for I2C
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20210615191543.1043414-1-robh@kernel.org
2021-06-21 13:56:46 -06:00