The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const. Thus the thermal_zone_of_device_ops structure itself can
be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
clk_prepare_enable() can fail here and we must check its return value.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
When register sensors into thermal zone during initialization phase, it
reports error for IRQ imbalance enabling:
[ 2.040713] WARNING: at kernel/irq/manage.c:513
[ 2.040719] Modules linked in:
[ 2.040721]
[ 2.040729] CPU: 1 PID: 804 Comm: irq/33-hisi_the Not tainted 4.5.0-rc4+ #505
[ 2.040732] Hardware name: HiKey Development Board (DT)
[ 2.040736] task: ffffffc03ae82580 ti: ffffffc0379c8000 task.ti: ffffffc0379c8000
[ 2.040745] PC is at __enable_irq+0x74/0x84
[ 2.040749] LR is at __enable_irq+0x74/0x84
This warning is for IRQ imbalance enabling, which is caused by
enable_irq() twice. During sensor's initialization it tries to enable
IRQ, the driver will call thermal_zone_of_sensor_register() to bind
sensors and read sensor's temperature. But at this moment the flag
"data->irq_enabled" has been not initialized as correct state, so it
finally introduces the function enabled_irq() to be called twice. In
essentially this is caused by the flag "data->irq_enabled" is
inconsistent with real hardware IRQ enabling state.
So this patch is to fix this issue, firstly init "irq_enabled" flag
before binding sensors to thermal zone. Also change to use the function
irq_get_irqchip_state() to read back real interrupt line state.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In current code sensor driver registers all 4 sensors together and if
any of them has not bound to thermal zone successfully then driver will
return failure for driver's initialization. As a result, if DT binds
thermal zone with only one sensor, then the thermal driver will not work
well anymore.
So this patch is to fix this issue. It allows the thermal sensor driver
can register any number sensors at initialization phase, and fix up code
for other related code to skip related sensor's accessing if the sensor
has not been enabled in initialization phase.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This changes the driver to use the devm_ version
of thermal_zone_of_sensor_register and cleans
up the local points and unregister calls.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When calculate temperature, old code firstly do division and then
convert to "millicelsius" unit. This will lose resolution and only can
read back temperature with "Celsius" unit.
So firstly scale step value to "millicelsius" and then do division, so
finally we can increase resolution for temperature value. Also refine
the calculation from temperature value to step value.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
platform_driver does not need to set an owner because
platform_driver_register() will set it.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Julia Lawall