dt-bindings: thermal: Add yaml bindings for thermal sensors
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
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# SPDX-License-Identifier: (GPL-2.0)
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# Copyright 2020 Linaro Ltd.
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: Thermal sensor binding
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maintainers:
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- Amit Kucheria <amitk@kernel.org>
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description: |
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Thermal management is achieved in devicetree by describing the sensor hardware
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and the software abstraction of thermal zones required to take appropriate
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action to mitigate thermal overloads.
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The following node types are used to completely describe a thermal management
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system in devicetree:
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- thermal-sensor: device that measures temperature, has SoC-specific bindings
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- cooling-device: device used to dissipate heat either passively or actively
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- thermal-zones: a container of the following node types used to describe all
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thermal data for the platform
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This binding describes the thermal-sensor.
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Thermal sensor devices provide temperature sensing capabilities on thermal
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zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
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devices may control one or more internal sensors.
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properties:
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"#thermal-sensor-cells":
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description:
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Used to uniquely identify a thermal sensor instance within an IC. Will be
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0 on sensor nodes with only a single sensor and at least 1 on nodes
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containing several internal sensors.
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enum: [0, 1]
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examples:
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- |
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#include <dt-bindings/interrupt-controller/arm-gic.h>
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// Example 1: SDM845 TSENS
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soc: soc@0 {
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#address-cells = <2>;
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#size-cells = <2>;
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/* ... */
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tsens0: thermal-sensor@c263000 {
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compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
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reg = <0 0x0c263000 0 0x1ff>, /* TM */
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<0 0x0c222000 0 0x1ff>; /* SROT */
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#qcom,sensors = <13>;
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interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
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<GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
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interrupt-names = "uplow", "critical";
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#thermal-sensor-cells = <1>;
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};
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tsens1: thermal-sensor@c265000 {
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compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
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reg = <0 0x0c265000 0 0x1ff>, /* TM */
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<0 0x0c223000 0 0x1ff>; /* SROT */
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#qcom,sensors = <8>;
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interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
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<GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
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interrupt-names = "uplow", "critical";
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#thermal-sensor-cells = <1>;
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};
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};
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...
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