ASoC: Intel: Skylake: Combine snd_soc_skl_ipc and snd_soc_skl
As both modules are core part of Skylake driver and none can live without the other, combine snd_soc_skl_ipc and snd_soc_skl. It's highly probable IPC module was to be treated as an interface for platform specific code implementations e.g.: possibility of existence of BXT specific code without SKL one. However, most funtionalities are being inherited from one DSP firmware to another, and thus this assumption fails. skl-sst, bxt-sst and cnl-sst are not individuals pointing respectively to SKL (cAVS 1.5), BXT (cAVS 1.5+) & CNL (cAVS 1.8) standalone implementations. Code found within these is shared among all platforms whenever necessary to avoid code duplication and reduce development burden. Merge also helps in cleaning up internal code in future changes. Signed-off-by: Amadeusz Sławiński <amadeuszx.slawinski@intel.com> Signed-off-by: Cezary Rojewski <cezary.rojewski@intel.com> Link: https://lore.kernel.org/r/20190723145854.8527-3-cezary.rojewski@intel.com Signed-off-by: Mark Brown <broonie@kernel.org>
This commit is contained in:
parent
bcc2a2dc3b
commit
88abcc90cb
|
@ -1,6 +1,7 @@
|
|||
# SPDX-License-Identifier: GPL-2.0
|
||||
snd-soc-skl-objs := skl.o skl-pcm.o skl-nhlt.o skl-messages.o \
|
||||
skl-topology.o
|
||||
snd-soc-skl-objs := skl.o skl-pcm.o skl-nhlt.o skl-messages.o skl-topology.o \
|
||||
skl-sst-ipc.o skl-sst-dsp.o cnl-sst-dsp.o skl-sst-cldma.o \
|
||||
skl-sst.o bxt-sst.o cnl-sst.o skl-sst-utils.o
|
||||
|
||||
ifdef CONFIG_DEBUG_FS
|
||||
snd-soc-skl-objs += skl-debug.o
|
||||
|
@ -8,13 +9,6 @@ endif
|
|||
|
||||
obj-$(CONFIG_SND_SOC_INTEL_SKYLAKE) += snd-soc-skl.o
|
||||
|
||||
# Skylake IPC Support
|
||||
snd-soc-skl-ipc-objs := skl-sst-ipc.o skl-sst-dsp.o cnl-sst-dsp.o \
|
||||
skl-sst-cldma.o skl-sst.o bxt-sst.o cnl-sst.o \
|
||||
skl-sst-utils.o
|
||||
|
||||
obj-$(CONFIG_SND_SOC_INTEL_SKYLAKE) += snd-soc-skl-ipc.o
|
||||
|
||||
#Skylake Clock device support
|
||||
snd-soc-skl-ssp-clk-objs := skl-ssp-clk.o
|
||||
|
||||
|
|
Loading…
Reference in New Issue