OpenCloudOS-Kernel/drivers/thermal/cpu_cooling.c

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thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/*
* linux/drivers/thermal/cpu_cooling.c
*
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
* Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
*
* Copyright (C) 2014 Viresh Kumar <viresh.kumar@linaro.org>
*
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
* ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
* This program is free software; you can redistribute it and/or modify
* it under the terms of the GNU General Public License as published by
* the Free Software Foundation; version 2 of the License.
*
* This program is distributed in the hope that it will be useful, but
* WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU
* General Public License for more details.
*
* You should have received a copy of the GNU General Public License along
* with this program; if not, write to the Free Software Foundation, Inc.,
* 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA.
*
* ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
*/
#include <linux/module.h>
#include <linux/thermal.h>
#include <linux/cpufreq.h>
#include <linux/err.h>
#include <linux/idr.h>
#include <linux/pm_opp.h>
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
#include <linux/slab.h>
#include <linux/cpu.h>
#include <linux/cpu_cooling.h>
#include <trace/events/thermal.h>
/*
* Cooling state <-> CPUFreq frequency
*
* Cooling states are translated to frequencies throughout this driver and this
* is the relation between them.
*
* Highest cooling state corresponds to lowest possible frequency.
*
* i.e.
* level 0 --> 1st Max Freq
* level 1 --> 2nd Max Freq
* ...
*/
/**
* struct freq_table - frequency table along with power entries
* @frequency: frequency in KHz
* @power: power in mW
*
* This structure is built when the cooling device registers and helps
* in translating frequency to power and vice versa.
*/
struct freq_table {
u32 frequency;
u32 power;
};
/**
* struct time_in_idle - Idle time stats
* @time: previous reading of the absolute time that this cpu was idle
* @timestamp: wall time of the last invocation of get_cpu_idle_time_us()
*/
struct time_in_idle {
u64 time;
u64 timestamp;
};
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* struct cpufreq_cooling_device - data for cooling device with cpufreq
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
* @id: unique integer value corresponding to each cpufreq_cooling_device
* registered.
* @last_load: load measured by the latest call to cpufreq_get_requested_power()
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
* @cpufreq_state: integer value representing the current state of cpufreq
* cooling devices.
* @clipped_freq: integer value representing the absolute value of the clipped
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
* frequency.
* @max_level: maximum cooling level. One less than total number of valid
* cpufreq frequencies.
* @freq_table: Freq table in descending order of frequencies
* @cdev: thermal_cooling_device pointer to keep track of the
* registered cooling device.
* @policy: cpufreq policy.
* @node: list_head to link all cpufreq_cooling_device together.
* @idle_time: idle time stats
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*
* This structure is required for keeping information of each registered
* cpufreq_cooling_device.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
struct cpufreq_cooling_device {
int id;
u32 last_load;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
unsigned int cpufreq_state;
unsigned int clipped_freq;
unsigned int max_level;
struct freq_table *freq_table; /* In descending order */
struct thermal_cooling_device *cdev;
struct cpufreq_policy *policy;
thermal: cpu_cooling: Update always cpufreq policy with thermal constraints Existing code updates cupfreq policy only while executing cpufreq_apply_cooling() function (i.e. when notify_device != NOTIFY_INVALID). It doesn't apply constraints when cpufreq policy update happens from any other place but it should update the cpufreq policy with thermal constraints every time when there is a cpufreq policy update, to keep state of cpufreq_cooling_device and max_feq of cpufreq policy in sync. For instance while resuming cpufreq updates cpufreq_policy and it restores default policy->usr_policy values irrespective of cooling device's cpufreq_state since notification gets missed because (notify_device == NOTIFY_INVALID). Another problem, is that userspace is able to change max_freq irrespective of cooling device's state, as notification gets missed. This patch modifies code to maintain a global cpufreq_dev_list and applies constraints of all matching cooling devices for policy's cpu when there is any policy update(ends up applying the lowest max_freq among the matching cpu cooling devices). This patch also removes redundant check (max_freq > policy->user_policy.max), as cpufreq framework takes care of user_policy constraints already where ever required, otherwise its causing an issue while increasing max_freq in normal scenerio as it restores max_freq with policy->user_policy.max which is old (smaller) value. Signed-off-by: Yadwinder Singh Brar <yadi.brar@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-07 21:42:29 +08:00
struct list_head node;
struct time_in_idle *idle_time;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
};
static DEFINE_IDA(cpufreq_ida);
thermal: cpu_cooling: fix lockdep problems in cpu_cooling A recent change to the cpu_cooling code introduced a AB-BA deadlock scenario between the cpufreq_policy_notifier_list rwsem and the cooling_cpufreq_lock. This is caused by cooling_cpufreq_lock being held before the registration/removal of the notifier block (an operation which takes the rwsem), and the notifier code itself which takes the locks in the reverse order: ====================================================== [ INFO: possible circular locking dependency detected ] 3.18.0+ #1453 Not tainted ------------------------------------------------------- rc.local/770 is trying to acquire lock: (cooling_cpufreq_lock){+.+.+.}, at: [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc but task is already holding lock: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 which lock already depends on the new lock. the existing dependency chain (in reverse order) is: -> #1 ((cpufreq_policy_notifier_list).rwsem){++++.+}: [<c06bc3b0>] down_write+0x44/0x9c [<c0043444>] blocking_notifier_chain_register+0x28/0xd8 [<c04ad610>] cpufreq_register_notifier+0x68/0x90 [<c04abe4c>] __cpufreq_cooling_register.part.1+0x120/0x180 [<c04abf44>] __cpufreq_cooling_register+0x98/0xa4 [<c04abf8c>] cpufreq_cooling_register+0x18/0x1c [<bf0046f8>] imx_thermal_probe+0x1c0/0x470 [imx_thermal] [<c037cef8>] platform_drv_probe+0x50/0xac [<c037b710>] driver_probe_device+0x114/0x234 [<c037b8cc>] __driver_attach+0x9c/0xa0 [<c0379d68>] bus_for_each_dev+0x5c/0x90 [<c037b204>] driver_attach+0x24/0x28 [<c037ae7c>] bus_add_driver+0xe0/0x1d8 [<c037c0cc>] driver_register+0x80/0xfc [<c037cd80>] __platform_driver_register+0x50/0x64 [<bf007018>] 0xbf007018 [<c0008a5c>] do_one_initcall+0x88/0x1d8 [<c0095da4>] load_module+0x1768/0x1ef8 [<c0096614>] SyS_init_module+0xe0/0xf4 [<c000ec00>] ret_fast_syscall+0x0/0x48 -> #0 (cooling_cpufreq_lock){+.+.+.}: [<c00619f8>] lock_acquire+0xb0/0x124 [<c06ba3b4>] mutex_lock_nested+0x5c/0x3d8 [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc [<c0042bf4>] notifier_call_chain+0x4c/0x8c [<c0042f20>] __blocking_notifier_call_chain+0x50/0x68 [<c0042f58>] blocking_notifier_call_chain+0x20/0x28 [<c04ae62c>] cpufreq_set_policy+0x7c/0x1d0 [<c04af3cc>] store_scaling_governor+0x74/0x9c [<c04ad418>] store+0x90/0xc0 [<c0175384>] sysfs_kf_write+0x54/0x58 [<c01746b4>] kernfs_fop_write+0xdc/0x190 [<c010dcc0>] vfs_write+0xac/0x1b4 [<c010dfec>] SyS_write+0x44/0x90 [<c000ec00>] ret_fast_syscall+0x0/0x48 other info that might help us debug this: Possible unsafe locking scenario: CPU0 CPU1 ---- ---- lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); *** DEADLOCK *** 7 locks held by rc.local/770: #0: (sb_writers#6){.+.+.+}, at: [<c010dda0>] vfs_write+0x18c/0x1b4 #1: (&of->mutex){+.+.+.}, at: [<c0174678>] kernfs_fop_write+0xa0/0x190 #2: (s_active#52){.+.+.+}, at: [<c0174680>] kernfs_fop_write+0xa8/0x190 #3: (cpu_hotplug.lock){++++++}, at: [<c0026a60>] get_online_cpus+0x34/0x90 #4: (cpufreq_rwsem){.+.+.+}, at: [<c04ad3e0>] store+0x58/0xc0 #5: (&policy->rwsem){+.+.+.}, at: [<c04ad3f8>] store+0x70/0xc0 #6: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 stack backtrace: CPU: 0 PID: 770 Comm: rc.local Not tainted 3.18.0+ #1453 Hardware name: Freescale i.MX6 Quad/DualLite (Device Tree) Backtrace: [<c00121c8>] (dump_backtrace) from [<c0012360>] (show_stack+0x18/0x1c) r6:c0b85a80 r5:c0b75630 r4:00000000 r3:00000000 [<c0012348>] (show_stack) from [<c06b6c48>] (dump_stack+0x7c/0x98) [<c06b6bcc>] (dump_stack) from [<c06b42a4>] (print_circular_bug+0x28c/0x2d8) r4:c0b85a80 r3:d0071d40 [<c06b4018>] (print_circular_bug) from [<c00613b0>] (__lock_acquire+0x1acc/0x1bb0) r10:c0b50660 r8:c09e6d80 r7:d0071d40 r6:c11d0f0c r5:00000007 r4:d0072240 [<c005f8e4>] (__lock_acquire) from [<c00619f8>] (lock_acquire+0xb0/0x124) r10:00000000 r9:c04abfc4 r8:00000000 r7:00000000 r6:00000000 r5:c0a06f0c r4:00000000 [<c0061948>] (lock_acquire) from [<c06ba3b4>] (mutex_lock_nested+0x5c/0x3d8) r10:ec853800 r9:c0a06ed4 r8:d0071d40 r7:c0a06ed4 r6:c11d0f0c r5:00000000 r4:c04abfc4 [<c06ba358>] (mutex_lock_nested) from [<c04abfc4>] (cpufreq_thermal_notifier+0x34/0xfc) r10:ec853800 r9:ec85380c r8:d00d7d3c r7:c0a06ed4 r6:d00d7d3c r5:00000000 r4:fffffffe [<c04abf90>] (cpufreq_thermal_notifier) from [<c0042bf4>] (notifier_call_chain+0x4c/0x8c) r7:00000000 r6:00000000 r5:00000000 r4:fffffffe [<c0042ba8>] (notifier_call_chain) from [<c0042f20>] (__blocking_notifier_call_chain+0x50/0x68) r8:c0a072a4 r7:00000000 r6:d00d7d3c r5:ffffffff r4:c0a06fc8 r3:ffffffff [<c0042ed0>] (__blocking_notifier_call_chain) from [<c0042f58>] (blocking_notifier_call_chain+0x20/0x28) r7:ec98b540 r6:c13ebc80 r5:ed76e600 r4:d00d7d3c [<c0042f38>] (blocking_notifier_call_chain) from [<c04ae62c>] (cpufreq_set_policy+0x7c/0x1d0) [<c04ae5b0>] (cpufreq_set_policy) from [<c04af3cc>] (store_scaling_governor+0x74/0x9c) r7:ec98b540 r6:0000000c r5:ec98b540 r4:ed76e600 [<c04af358>] (store_scaling_governor) from [<c04ad418>] (store+0x90/0xc0) r6:0000000c r5:ed76e6d4 r4:ed76e600 [<c04ad388>] (store) from [<c0175384>] (sysfs_kf_write+0x54/0x58) r8:0000000c r7:d00d7f78 r6:ec98b540 r5:0000000c r4:ec853800 r3:0000000c [<c0175330>] (sysfs_kf_write) from [<c01746b4>] (kernfs_fop_write+0xdc/0x190) r6:ec98b540 r5:00000000 r4:00000000 r3:c0175330 [<c01745d8>] (kernfs_fop_write) from [<c010dcc0>] (vfs_write+0xac/0x1b4) r10:0162aa70 r9:d00d6000 r8:0000000c r7:d00d7f78 r6:0162aa70 r5:0000000c r4:eccde500 [<c010dc14>] (vfs_write) from [<c010dfec>] (SyS_write+0x44/0x90) r10:0162aa70 r8:0000000c r7:eccde500 r6:eccde500 r5:00000000 r4:00000000 [<c010dfa8>] (SyS_write) from [<c000ec00>] (ret_fast_syscall+0x0/0x48) r10:00000000 r8:c000edc4 r7:00000004 r6:000216cc r5:0000000c r4:0162aa70 Solve this by moving to finer grained locking - use one mutex to protect the cpufreq_dev_list as a whole, and a separate lock to ensure correct ordering of cpufreq notifier registration and removal. cooling_list_lock is taken within cooling_cpufreq_lock on (un)registration to preserve the behavior of the code, i.e. to atomically add/remove to the list and (un)register the notifier. Fixes: 2dcd851fe4b4 ("thermal: cpu_cooling: Update always cpufreq policy with Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-12 17:52:16 +08:00
static DEFINE_MUTEX(cooling_list_lock);
static LIST_HEAD(cpufreq_cdev_list);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/* Below code defines functions to be used for cpufreq as cooling device */
/**
* get_level: Find the level for a particular frequency
* @cpufreq_cdev: cpufreq_cdev for which the property is required
* @freq: Frequency
*
* Return: level corresponding to the frequency.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
static unsigned long get_level(struct cpufreq_cooling_device *cpufreq_cdev,
unsigned int freq)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
{
struct freq_table *freq_table = cpufreq_cdev->freq_table;
unsigned long level;
for (level = 1; level <= cpufreq_cdev->max_level; level++)
if (freq > freq_table[level].frequency)
break;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
return level - 1;
}
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* cpufreq_thermal_notifier - notifier callback for cpufreq policy change.
* @nb: struct notifier_block * with callback info.
* @event: value showing cpufreq event for which this function invoked.
* @data: callback-specific data
*
* Callback to hijack the notification on cpufreq policy transition.
* Every time there is a change in policy, we will intercept and
* update the cpufreq policy with thermal constraints.
*
* Return: 0 (success)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
static int cpufreq_thermal_notifier(struct notifier_block *nb,
unsigned long event, void *data)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
{
struct cpufreq_policy *policy = data;
unsigned long clipped_freq;
struct cpufreq_cooling_device *cpufreq_cdev;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
if (event != CPUFREQ_ADJUST)
return NOTIFY_DONE;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
mutex_lock(&cooling_list_lock);
list_for_each_entry(cpufreq_cdev, &cpufreq_cdev_list, node) {
/*
* A new copy of the policy is sent to the notifier and can't
* compare that directly.
*/
if (policy->cpu != cpufreq_cdev->policy->cpu)
continue;
/*
* policy->max is the maximum allowed frequency defined by user
* and clipped_freq is the maximum that thermal constraints
* allow.
*
* If clipped_freq is lower than policy->max, then we need to
* readjust policy->max.
*
* But, if clipped_freq is greater than policy->max, we don't
* need to do anything.
*/
clipped_freq = cpufreq_cdev->clipped_freq;
if (policy->max > clipped_freq)
cpufreq_verify_within_limits(policy, 0, clipped_freq);
break;
}
mutex_unlock(&cooling_list_lock);
return NOTIFY_OK;
}
/**
* update_freq_table() - Update the freq table with power numbers
* @cpufreq_cdev: the cpufreq cooling device in which to update the table
* @capacitance: dynamic power coefficient for these cpus
*
* Update the freq table with power numbers. This table will be used in
* cpu_power_to_freq() and cpu_freq_to_power() to convert between power and
* frequency efficiently. Power is stored in mW, frequency in KHz. The
* resulting table is in descending order.
*
* Return: 0 on success, -EINVAL if there are no OPPs for any CPUs,
* or -ENOMEM if we run out of memory.
*/
static int update_freq_table(struct cpufreq_cooling_device *cpufreq_cdev,
u32 capacitance)
{
struct freq_table *freq_table = cpufreq_cdev->freq_table;
struct dev_pm_opp *opp;
struct device *dev = NULL;
int num_opps = 0, cpu = cpufreq_cdev->policy->cpu, i;
dev = get_cpu_device(cpu);
if (unlikely(!dev)) {
dev_warn(&cpufreq_cdev->cdev->device,
"No cpu device for cpu %d\n", cpu);
return -ENODEV;
}
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
num_opps = dev_pm_opp_get_opp_count(dev);
if (num_opps < 0)
return num_opps;
/*
* The cpufreq table is also built from the OPP table and so the count
* should match.
*/
if (num_opps != cpufreq_cdev->max_level + 1) {
dev_warn(dev, "Number of OPPs not matching with max_levels\n");
return -EINVAL;
}
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
for (i = 0; i <= cpufreq_cdev->max_level; i++) {
unsigned long freq = freq_table[i].frequency * 1000;
u32 freq_mhz = freq_table[i].frequency / 1000;
u64 power;
u32 voltage_mv;
/*
* Find ceil frequency as 'freq' may be slightly lower than OPP
* freq due to truncation while converting to kHz.
*/
opp = dev_pm_opp_find_freq_ceil(dev, &freq);
if (IS_ERR(opp)) {
dev_err(dev, "failed to get opp for %lu frequency\n",
freq);
return -EINVAL;
}
voltage_mv = dev_pm_opp_get_voltage(opp) / 1000;
dev_pm_opp_put(opp);
/*
* Do the multiplication with MHz and millivolt so as
* to not overflow.
*/
power = (u64)capacitance * freq_mhz * voltage_mv * voltage_mv;
do_div(power, 1000000000);
/* power is stored in mW */
freq_table[i].power = power;
}
return 0;
}
static u32 cpu_freq_to_power(struct cpufreq_cooling_device *cpufreq_cdev,
u32 freq)
{
int i;
struct freq_table *freq_table = cpufreq_cdev->freq_table;
for (i = 1; i <= cpufreq_cdev->max_level; i++)
if (freq > freq_table[i].frequency)
break;
return freq_table[i - 1].power;
}
static u32 cpu_power_to_freq(struct cpufreq_cooling_device *cpufreq_cdev,
u32 power)
{
int i;
struct freq_table *freq_table = cpufreq_cdev->freq_table;
for (i = 1; i <= cpufreq_cdev->max_level; i++)
if (power > freq_table[i].power)
break;
return freq_table[i - 1].frequency;
}
/**
* get_load() - get load for a cpu since last updated
* @cpufreq_cdev: &struct cpufreq_cooling_device for this cpu
* @cpu: cpu number
* @cpu_idx: index of the cpu in time_in_idle*
*
* Return: The average load of cpu @cpu in percentage since this
* function was last called.
*/
static u32 get_load(struct cpufreq_cooling_device *cpufreq_cdev, int cpu,
int cpu_idx)
{
u32 load;
u64 now, now_idle, delta_time, delta_idle;
struct time_in_idle *idle_time = &cpufreq_cdev->idle_time[cpu_idx];
now_idle = get_cpu_idle_time(cpu, &now, 0);
delta_idle = now_idle - idle_time->time;
delta_time = now - idle_time->timestamp;
if (delta_time <= delta_idle)
load = 0;
else
load = div64_u64(100 * (delta_time - delta_idle), delta_time);
idle_time->time = now_idle;
idle_time->timestamp = now;
return load;
}
/**
* get_dynamic_power() - calculate the dynamic power
* @cpufreq_cdev: &cpufreq_cooling_device for this cdev
* @freq: current frequency
*
* Return: the dynamic power consumed by the cpus described by
* @cpufreq_cdev.
*/
static u32 get_dynamic_power(struct cpufreq_cooling_device *cpufreq_cdev,
unsigned long freq)
{
u32 raw_cpu_power;
raw_cpu_power = cpu_freq_to_power(cpufreq_cdev, freq);
return (raw_cpu_power * cpufreq_cdev->last_load) / 100;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
/* cpufreq cooling device callback functions are defined below */
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* cpufreq_get_max_state - callback function to get the max cooling state.
* @cdev: thermal cooling device pointer.
* @state: fill this variable with the max cooling state.
*
* Callback for the thermal cooling device to return the cpufreq
* max cooling state.
*
* Return: 0 on success, an error code otherwise.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
static int cpufreq_get_max_state(struct thermal_cooling_device *cdev,
unsigned long *state)
{
struct cpufreq_cooling_device *cpufreq_cdev = cdev->devdata;
*state = cpufreq_cdev->max_level;
return 0;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
/**
* cpufreq_get_cur_state - callback function to get the current cooling state.
* @cdev: thermal cooling device pointer.
* @state: fill this variable with the current cooling state.
*
* Callback for the thermal cooling device to return the cpufreq
* current cooling state.
*
* Return: 0 on success, an error code otherwise.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
static int cpufreq_get_cur_state(struct thermal_cooling_device *cdev,
unsigned long *state)
{
struct cpufreq_cooling_device *cpufreq_cdev = cdev->devdata;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*state = cpufreq_cdev->cpufreq_state;
return 0;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
/**
* cpufreq_set_cur_state - callback function to set the current cooling state.
* @cdev: thermal cooling device pointer.
* @state: set this variable to the current cooling state.
*
* Callback for the thermal cooling device to change the cpufreq
* current cooling state.
*
* Return: 0 on success, an error code otherwise.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
static int cpufreq_set_cur_state(struct thermal_cooling_device *cdev,
unsigned long state)
{
struct cpufreq_cooling_device *cpufreq_cdev = cdev->devdata;
unsigned int clip_freq;
/* Request state should be less than max_level */
if (WARN_ON(state > cpufreq_cdev->max_level))
return -EINVAL;
/* Check if the old cooling action is same as new cooling action */
if (cpufreq_cdev->cpufreq_state == state)
return 0;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
clip_freq = cpufreq_cdev->freq_table[state].frequency;
cpufreq_cdev->cpufreq_state = state;
cpufreq_cdev->clipped_freq = clip_freq;
cpufreq_update_policy(cpufreq_cdev->policy->cpu);
return 0;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
/**
* cpufreq_get_requested_power() - get the current power
* @cdev: &thermal_cooling_device pointer
* @tz: a valid thermal zone device pointer
* @power: pointer in which to store the resulting power
*
* Calculate the current power consumption of the cpus in milliwatts
* and store it in @power. This function should actually calculate
* the requested power, but it's hard to get the frequency that
* cpufreq would have assigned if there were no thermal limits.
* Instead, we calculate the current power on the assumption that the
* immediate future will look like the immediate past.
*
* We use the current frequency and the average load since this
* function was last called. In reality, there could have been
* multiple opps since this function was last called and that affects
* the load calculation. While it's not perfectly accurate, this
* simplification is good enough and works. REVISIT this, as more
* complex code may be needed if experiments show that it's not
* accurate enough.
*
* Return: 0 on success, -E* if getting the static power failed.
*/
static int cpufreq_get_requested_power(struct thermal_cooling_device *cdev,
struct thermal_zone_device *tz,
u32 *power)
{
unsigned long freq;
int i = 0, cpu;
u32 total_load = 0;
struct cpufreq_cooling_device *cpufreq_cdev = cdev->devdata;
struct cpufreq_policy *policy = cpufreq_cdev->policy;
u32 *load_cpu = NULL;
freq = cpufreq_quick_get(policy->cpu);
if (trace_thermal_power_cpu_get_power_enabled()) {
u32 ncpus = cpumask_weight(policy->related_cpus);
load_cpu = kcalloc(ncpus, sizeof(*load_cpu), GFP_KERNEL);
}
for_each_cpu(cpu, policy->related_cpus) {
u32 load;
if (cpu_online(cpu))
load = get_load(cpufreq_cdev, cpu, i);
else
load = 0;
total_load += load;
if (trace_thermal_power_cpu_limit_enabled() && load_cpu)
load_cpu[i] = load;
i++;
}
cpufreq_cdev->last_load = total_load;
*power = get_dynamic_power(cpufreq_cdev, freq);
if (load_cpu) {
trace_thermal_power_cpu_get_power(policy->related_cpus, freq,
load_cpu, i, *power);
kfree(load_cpu);
}
return 0;
}
/**
* cpufreq_state2power() - convert a cpu cdev state to power consumed
* @cdev: &thermal_cooling_device pointer
* @tz: a valid thermal zone device pointer
* @state: cooling device state to be converted
* @power: pointer in which to store the resulting power
*
* Convert cooling device state @state into power consumption in
* milliwatts assuming 100% load. Store the calculated power in
* @power.
*
* Return: 0 on success, -EINVAL if the cooling device state could not
* be converted into a frequency or other -E* if there was an error
* when calculating the static power.
*/
static int cpufreq_state2power(struct thermal_cooling_device *cdev,
struct thermal_zone_device *tz,
unsigned long state, u32 *power)
{
unsigned int freq, num_cpus;
struct cpufreq_cooling_device *cpufreq_cdev = cdev->devdata;
/* Request state should be less than max_level */
if (WARN_ON(state > cpufreq_cdev->max_level))
return -EINVAL;
num_cpus = cpumask_weight(cpufreq_cdev->policy->cpus);
freq = cpufreq_cdev->freq_table[state].frequency;
*power = cpu_freq_to_power(cpufreq_cdev, freq) * num_cpus;
return 0;
}
/**
* cpufreq_power2state() - convert power to a cooling device state
* @cdev: &thermal_cooling_device pointer
* @tz: a valid thermal zone device pointer
* @power: power in milliwatts to be converted
* @state: pointer in which to store the resulting state
*
* Calculate a cooling device state for the cpus described by @cdev
* that would allow them to consume at most @power mW and store it in
* @state. Note that this calculation depends on external factors
* such as the cpu load or the current static power. Calling this
* function with the same power as input can yield different cooling
* device states depending on those external factors.
*
* Return: 0 on success, -ENODEV if no cpus are online or -EINVAL if
* the calculated frequency could not be converted to a valid state.
* The latter should not happen unless the frequencies available to
* cpufreq have changed since the initialization of the cpu cooling
* device.
*/
static int cpufreq_power2state(struct thermal_cooling_device *cdev,
struct thermal_zone_device *tz, u32 power,
unsigned long *state)
{
unsigned int cur_freq, target_freq;
u32 last_load, normalised_power;
struct cpufreq_cooling_device *cpufreq_cdev = cdev->devdata;
struct cpufreq_policy *policy = cpufreq_cdev->policy;
cur_freq = cpufreq_quick_get(policy->cpu);
power = power > 0 ? power : 0;
last_load = cpufreq_cdev->last_load ?: 1;
normalised_power = (power * 100) / last_load;
target_freq = cpu_power_to_freq(cpufreq_cdev, normalised_power);
*state = get_level(cpufreq_cdev, target_freq);
trace_thermal_power_cpu_limit(policy->related_cpus, target_freq, *state,
power);
return 0;
}
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/* Bind cpufreq callbacks to thermal cooling device ops */
static struct thermal_cooling_device_ops cpufreq_cooling_ops = {
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
.get_max_state = cpufreq_get_max_state,
.get_cur_state = cpufreq_get_cur_state,
.set_cur_state = cpufreq_set_cur_state,
};
static struct thermal_cooling_device_ops cpufreq_power_cooling_ops = {
.get_max_state = cpufreq_get_max_state,
.get_cur_state = cpufreq_get_cur_state,
.set_cur_state = cpufreq_set_cur_state,
.get_requested_power = cpufreq_get_requested_power,
.state2power = cpufreq_state2power,
.power2state = cpufreq_power2state,
};
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/* Notifier for cpufreq policy change */
static struct notifier_block thermal_cpufreq_notifier_block = {
.notifier_call = cpufreq_thermal_notifier,
};
static unsigned int find_next_max(struct cpufreq_frequency_table *table,
unsigned int prev_max)
{
struct cpufreq_frequency_table *pos;
unsigned int max = 0;
cpufreq_for_each_valid_entry(pos, table) {
if (pos->frequency > max && pos->frequency < prev_max)
max = pos->frequency;
}
return max;
}
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* __cpufreq_cooling_register - helper function to create cpufreq cooling device
* @np: a valid struct device_node to the cooling device device tree node
* @policy: cpufreq policy
* Normally this should be same as cpufreq policy->related_cpus.
* @capacitance: dynamic power coefficient for these cpus
*
* This interface function registers the cpufreq cooling device with the name
* "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
* cooling devices. It also gives the opportunity to link the cooling device
* with a device tree node, in order to bind it via the thermal DT code.
*
* Return: a valid struct thermal_cooling_device pointer on success,
* on failure, it returns a corresponding ERR_PTR().
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
static struct thermal_cooling_device *
__cpufreq_cooling_register(struct device_node *np,
struct cpufreq_policy *policy, u32 capacitance)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
{
struct thermal_cooling_device *cdev;
struct cpufreq_cooling_device *cpufreq_cdev;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
char dev_name[THERMAL_NAME_LENGTH];
unsigned int freq, i, num_cpus;
int ret;
struct thermal_cooling_device_ops *cooling_ops;
bool first;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
if (IS_ERR_OR_NULL(policy)) {
pr_err("%s: cpufreq policy isn't valid: %p\n", __func__, policy);
return ERR_PTR(-EINVAL);
}
i = cpufreq_table_count_valid_entries(policy);
if (!i) {
pr_debug("%s: CPUFreq table not found or has no valid entries\n",
__func__);
return ERR_PTR(-ENODEV);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
cpufreq_cdev = kzalloc(sizeof(*cpufreq_cdev), GFP_KERNEL);
if (!cpufreq_cdev)
return ERR_PTR(-ENOMEM);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
cpufreq_cdev->policy = policy;
num_cpus = cpumask_weight(policy->related_cpus);
cpufreq_cdev->idle_time = kcalloc(num_cpus,
sizeof(*cpufreq_cdev->idle_time),
GFP_KERNEL);
if (!cpufreq_cdev->idle_time) {
cdev = ERR_PTR(-ENOMEM);
goto free_cdev;
}
/* max_level is an index, not a counter */
cpufreq_cdev->max_level = i - 1;
cpufreq_cdev->freq_table = kmalloc_array(i,
sizeof(*cpufreq_cdev->freq_table),
GFP_KERNEL);
if (!cpufreq_cdev->freq_table) {
cdev = ERR_PTR(-ENOMEM);
goto free_idle_time;
}
ret = ida_simple_get(&cpufreq_ida, 0, 0, GFP_KERNEL);
if (ret < 0) {
cdev = ERR_PTR(ret);
goto free_table;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
cpufreq_cdev->id = ret;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
snprintf(dev_name, sizeof(dev_name), "thermal-cpufreq-%d",
cpufreq_cdev->id);
/* Fill freq-table in descending order of frequencies */
for (i = 0, freq = -1; i <= cpufreq_cdev->max_level; i++) {
freq = find_next_max(policy->freq_table, freq);
cpufreq_cdev->freq_table[i].frequency = freq;
/* Warn for duplicate entries */
if (!freq)
pr_warn("%s: table has duplicate entries\n", __func__);
else
pr_debug("%s: freq:%u KHz\n", __func__, freq);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
if (capacitance) {
ret = update_freq_table(cpufreq_cdev, capacitance);
if (ret) {
cdev = ERR_PTR(ret);
goto remove_ida;
}
cooling_ops = &cpufreq_power_cooling_ops;
} else {
cooling_ops = &cpufreq_cooling_ops;
}
cdev = thermal_of_cooling_device_register(np, dev_name, cpufreq_cdev,
cooling_ops);
if (IS_ERR(cdev))
goto remove_ida;
cpufreq_cdev->clipped_freq = cpufreq_cdev->freq_table[0].frequency;
cpufreq_cdev->cdev = cdev;
thermal: cpu_cooling: fix lockdep problems in cpu_cooling A recent change to the cpu_cooling code introduced a AB-BA deadlock scenario between the cpufreq_policy_notifier_list rwsem and the cooling_cpufreq_lock. This is caused by cooling_cpufreq_lock being held before the registration/removal of the notifier block (an operation which takes the rwsem), and the notifier code itself which takes the locks in the reverse order: ====================================================== [ INFO: possible circular locking dependency detected ] 3.18.0+ #1453 Not tainted ------------------------------------------------------- rc.local/770 is trying to acquire lock: (cooling_cpufreq_lock){+.+.+.}, at: [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc but task is already holding lock: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 which lock already depends on the new lock. the existing dependency chain (in reverse order) is: -> #1 ((cpufreq_policy_notifier_list).rwsem){++++.+}: [<c06bc3b0>] down_write+0x44/0x9c [<c0043444>] blocking_notifier_chain_register+0x28/0xd8 [<c04ad610>] cpufreq_register_notifier+0x68/0x90 [<c04abe4c>] __cpufreq_cooling_register.part.1+0x120/0x180 [<c04abf44>] __cpufreq_cooling_register+0x98/0xa4 [<c04abf8c>] cpufreq_cooling_register+0x18/0x1c [<bf0046f8>] imx_thermal_probe+0x1c0/0x470 [imx_thermal] [<c037cef8>] platform_drv_probe+0x50/0xac [<c037b710>] driver_probe_device+0x114/0x234 [<c037b8cc>] __driver_attach+0x9c/0xa0 [<c0379d68>] bus_for_each_dev+0x5c/0x90 [<c037b204>] driver_attach+0x24/0x28 [<c037ae7c>] bus_add_driver+0xe0/0x1d8 [<c037c0cc>] driver_register+0x80/0xfc [<c037cd80>] __platform_driver_register+0x50/0x64 [<bf007018>] 0xbf007018 [<c0008a5c>] do_one_initcall+0x88/0x1d8 [<c0095da4>] load_module+0x1768/0x1ef8 [<c0096614>] SyS_init_module+0xe0/0xf4 [<c000ec00>] ret_fast_syscall+0x0/0x48 -> #0 (cooling_cpufreq_lock){+.+.+.}: [<c00619f8>] lock_acquire+0xb0/0x124 [<c06ba3b4>] mutex_lock_nested+0x5c/0x3d8 [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc [<c0042bf4>] notifier_call_chain+0x4c/0x8c [<c0042f20>] __blocking_notifier_call_chain+0x50/0x68 [<c0042f58>] blocking_notifier_call_chain+0x20/0x28 [<c04ae62c>] cpufreq_set_policy+0x7c/0x1d0 [<c04af3cc>] store_scaling_governor+0x74/0x9c [<c04ad418>] store+0x90/0xc0 [<c0175384>] sysfs_kf_write+0x54/0x58 [<c01746b4>] kernfs_fop_write+0xdc/0x190 [<c010dcc0>] vfs_write+0xac/0x1b4 [<c010dfec>] SyS_write+0x44/0x90 [<c000ec00>] ret_fast_syscall+0x0/0x48 other info that might help us debug this: Possible unsafe locking scenario: CPU0 CPU1 ---- ---- lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); *** DEADLOCK *** 7 locks held by rc.local/770: #0: (sb_writers#6){.+.+.+}, at: [<c010dda0>] vfs_write+0x18c/0x1b4 #1: (&of->mutex){+.+.+.}, at: [<c0174678>] kernfs_fop_write+0xa0/0x190 #2: (s_active#52){.+.+.+}, at: [<c0174680>] kernfs_fop_write+0xa8/0x190 #3: (cpu_hotplug.lock){++++++}, at: [<c0026a60>] get_online_cpus+0x34/0x90 #4: (cpufreq_rwsem){.+.+.+}, at: [<c04ad3e0>] store+0x58/0xc0 #5: (&policy->rwsem){+.+.+.}, at: [<c04ad3f8>] store+0x70/0xc0 #6: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 stack backtrace: CPU: 0 PID: 770 Comm: rc.local Not tainted 3.18.0+ #1453 Hardware name: Freescale i.MX6 Quad/DualLite (Device Tree) Backtrace: [<c00121c8>] (dump_backtrace) from [<c0012360>] (show_stack+0x18/0x1c) r6:c0b85a80 r5:c0b75630 r4:00000000 r3:00000000 [<c0012348>] (show_stack) from [<c06b6c48>] (dump_stack+0x7c/0x98) [<c06b6bcc>] (dump_stack) from [<c06b42a4>] (print_circular_bug+0x28c/0x2d8) r4:c0b85a80 r3:d0071d40 [<c06b4018>] (print_circular_bug) from [<c00613b0>] (__lock_acquire+0x1acc/0x1bb0) r10:c0b50660 r8:c09e6d80 r7:d0071d40 r6:c11d0f0c r5:00000007 r4:d0072240 [<c005f8e4>] (__lock_acquire) from [<c00619f8>] (lock_acquire+0xb0/0x124) r10:00000000 r9:c04abfc4 r8:00000000 r7:00000000 r6:00000000 r5:c0a06f0c r4:00000000 [<c0061948>] (lock_acquire) from [<c06ba3b4>] (mutex_lock_nested+0x5c/0x3d8) r10:ec853800 r9:c0a06ed4 r8:d0071d40 r7:c0a06ed4 r6:c11d0f0c r5:00000000 r4:c04abfc4 [<c06ba358>] (mutex_lock_nested) from [<c04abfc4>] (cpufreq_thermal_notifier+0x34/0xfc) r10:ec853800 r9:ec85380c r8:d00d7d3c r7:c0a06ed4 r6:d00d7d3c r5:00000000 r4:fffffffe [<c04abf90>] (cpufreq_thermal_notifier) from [<c0042bf4>] (notifier_call_chain+0x4c/0x8c) r7:00000000 r6:00000000 r5:00000000 r4:fffffffe [<c0042ba8>] (notifier_call_chain) from [<c0042f20>] (__blocking_notifier_call_chain+0x50/0x68) r8:c0a072a4 r7:00000000 r6:d00d7d3c r5:ffffffff r4:c0a06fc8 r3:ffffffff [<c0042ed0>] (__blocking_notifier_call_chain) from [<c0042f58>] (blocking_notifier_call_chain+0x20/0x28) r7:ec98b540 r6:c13ebc80 r5:ed76e600 r4:d00d7d3c [<c0042f38>] (blocking_notifier_call_chain) from [<c04ae62c>] (cpufreq_set_policy+0x7c/0x1d0) [<c04ae5b0>] (cpufreq_set_policy) from [<c04af3cc>] (store_scaling_governor+0x74/0x9c) r7:ec98b540 r6:0000000c r5:ec98b540 r4:ed76e600 [<c04af358>] (store_scaling_governor) from [<c04ad418>] (store+0x90/0xc0) r6:0000000c r5:ed76e6d4 r4:ed76e600 [<c04ad388>] (store) from [<c0175384>] (sysfs_kf_write+0x54/0x58) r8:0000000c r7:d00d7f78 r6:ec98b540 r5:0000000c r4:ec853800 r3:0000000c [<c0175330>] (sysfs_kf_write) from [<c01746b4>] (kernfs_fop_write+0xdc/0x190) r6:ec98b540 r5:00000000 r4:00000000 r3:c0175330 [<c01745d8>] (kernfs_fop_write) from [<c010dcc0>] (vfs_write+0xac/0x1b4) r10:0162aa70 r9:d00d6000 r8:0000000c r7:d00d7f78 r6:0162aa70 r5:0000000c r4:eccde500 [<c010dc14>] (vfs_write) from [<c010dfec>] (SyS_write+0x44/0x90) r10:0162aa70 r8:0000000c r7:eccde500 r6:eccde500 r5:00000000 r4:00000000 [<c010dfa8>] (SyS_write) from [<c000ec00>] (ret_fast_syscall+0x0/0x48) r10:00000000 r8:c000edc4 r7:00000004 r6:000216cc r5:0000000c r4:0162aa70 Solve this by moving to finer grained locking - use one mutex to protect the cpufreq_dev_list as a whole, and a separate lock to ensure correct ordering of cpufreq notifier registration and removal. cooling_list_lock is taken within cooling_cpufreq_lock on (un)registration to preserve the behavior of the code, i.e. to atomically add/remove to the list and (un)register the notifier. Fixes: 2dcd851fe4b4 ("thermal: cpu_cooling: Update always cpufreq policy with Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-12 17:52:16 +08:00
mutex_lock(&cooling_list_lock);
/* Register the notifier for first cpufreq cooling device */
first = list_empty(&cpufreq_cdev_list);
list_add(&cpufreq_cdev->node, &cpufreq_cdev_list);
mutex_unlock(&cooling_list_lock);
thermal: cpu_cooling: fix lockdep problems in cpu_cooling A recent change to the cpu_cooling code introduced a AB-BA deadlock scenario between the cpufreq_policy_notifier_list rwsem and the cooling_cpufreq_lock. This is caused by cooling_cpufreq_lock being held before the registration/removal of the notifier block (an operation which takes the rwsem), and the notifier code itself which takes the locks in the reverse order: ====================================================== [ INFO: possible circular locking dependency detected ] 3.18.0+ #1453 Not tainted ------------------------------------------------------- rc.local/770 is trying to acquire lock: (cooling_cpufreq_lock){+.+.+.}, at: [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc but task is already holding lock: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 which lock already depends on the new lock. the existing dependency chain (in reverse order) is: -> #1 ((cpufreq_policy_notifier_list).rwsem){++++.+}: [<c06bc3b0>] down_write+0x44/0x9c [<c0043444>] blocking_notifier_chain_register+0x28/0xd8 [<c04ad610>] cpufreq_register_notifier+0x68/0x90 [<c04abe4c>] __cpufreq_cooling_register.part.1+0x120/0x180 [<c04abf44>] __cpufreq_cooling_register+0x98/0xa4 [<c04abf8c>] cpufreq_cooling_register+0x18/0x1c [<bf0046f8>] imx_thermal_probe+0x1c0/0x470 [imx_thermal] [<c037cef8>] platform_drv_probe+0x50/0xac [<c037b710>] driver_probe_device+0x114/0x234 [<c037b8cc>] __driver_attach+0x9c/0xa0 [<c0379d68>] bus_for_each_dev+0x5c/0x90 [<c037b204>] driver_attach+0x24/0x28 [<c037ae7c>] bus_add_driver+0xe0/0x1d8 [<c037c0cc>] driver_register+0x80/0xfc [<c037cd80>] __platform_driver_register+0x50/0x64 [<bf007018>] 0xbf007018 [<c0008a5c>] do_one_initcall+0x88/0x1d8 [<c0095da4>] load_module+0x1768/0x1ef8 [<c0096614>] SyS_init_module+0xe0/0xf4 [<c000ec00>] ret_fast_syscall+0x0/0x48 -> #0 (cooling_cpufreq_lock){+.+.+.}: [<c00619f8>] lock_acquire+0xb0/0x124 [<c06ba3b4>] mutex_lock_nested+0x5c/0x3d8 [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc [<c0042bf4>] notifier_call_chain+0x4c/0x8c [<c0042f20>] __blocking_notifier_call_chain+0x50/0x68 [<c0042f58>] blocking_notifier_call_chain+0x20/0x28 [<c04ae62c>] cpufreq_set_policy+0x7c/0x1d0 [<c04af3cc>] store_scaling_governor+0x74/0x9c [<c04ad418>] store+0x90/0xc0 [<c0175384>] sysfs_kf_write+0x54/0x58 [<c01746b4>] kernfs_fop_write+0xdc/0x190 [<c010dcc0>] vfs_write+0xac/0x1b4 [<c010dfec>] SyS_write+0x44/0x90 [<c000ec00>] ret_fast_syscall+0x0/0x48 other info that might help us debug this: Possible unsafe locking scenario: CPU0 CPU1 ---- ---- lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); *** DEADLOCK *** 7 locks held by rc.local/770: #0: (sb_writers#6){.+.+.+}, at: [<c010dda0>] vfs_write+0x18c/0x1b4 #1: (&of->mutex){+.+.+.}, at: [<c0174678>] kernfs_fop_write+0xa0/0x190 #2: (s_active#52){.+.+.+}, at: [<c0174680>] kernfs_fop_write+0xa8/0x190 #3: (cpu_hotplug.lock){++++++}, at: [<c0026a60>] get_online_cpus+0x34/0x90 #4: (cpufreq_rwsem){.+.+.+}, at: [<c04ad3e0>] store+0x58/0xc0 #5: (&policy->rwsem){+.+.+.}, at: [<c04ad3f8>] store+0x70/0xc0 #6: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 stack backtrace: CPU: 0 PID: 770 Comm: rc.local Not tainted 3.18.0+ #1453 Hardware name: Freescale i.MX6 Quad/DualLite (Device Tree) Backtrace: [<c00121c8>] (dump_backtrace) from [<c0012360>] (show_stack+0x18/0x1c) r6:c0b85a80 r5:c0b75630 r4:00000000 r3:00000000 [<c0012348>] (show_stack) from [<c06b6c48>] (dump_stack+0x7c/0x98) [<c06b6bcc>] (dump_stack) from [<c06b42a4>] (print_circular_bug+0x28c/0x2d8) r4:c0b85a80 r3:d0071d40 [<c06b4018>] (print_circular_bug) from [<c00613b0>] (__lock_acquire+0x1acc/0x1bb0) r10:c0b50660 r8:c09e6d80 r7:d0071d40 r6:c11d0f0c r5:00000007 r4:d0072240 [<c005f8e4>] (__lock_acquire) from [<c00619f8>] (lock_acquire+0xb0/0x124) r10:00000000 r9:c04abfc4 r8:00000000 r7:00000000 r6:00000000 r5:c0a06f0c r4:00000000 [<c0061948>] (lock_acquire) from [<c06ba3b4>] (mutex_lock_nested+0x5c/0x3d8) r10:ec853800 r9:c0a06ed4 r8:d0071d40 r7:c0a06ed4 r6:c11d0f0c r5:00000000 r4:c04abfc4 [<c06ba358>] (mutex_lock_nested) from [<c04abfc4>] (cpufreq_thermal_notifier+0x34/0xfc) r10:ec853800 r9:ec85380c r8:d00d7d3c r7:c0a06ed4 r6:d00d7d3c r5:00000000 r4:fffffffe [<c04abf90>] (cpufreq_thermal_notifier) from [<c0042bf4>] (notifier_call_chain+0x4c/0x8c) r7:00000000 r6:00000000 r5:00000000 r4:fffffffe [<c0042ba8>] (notifier_call_chain) from [<c0042f20>] (__blocking_notifier_call_chain+0x50/0x68) r8:c0a072a4 r7:00000000 r6:d00d7d3c r5:ffffffff r4:c0a06fc8 r3:ffffffff [<c0042ed0>] (__blocking_notifier_call_chain) from [<c0042f58>] (blocking_notifier_call_chain+0x20/0x28) r7:ec98b540 r6:c13ebc80 r5:ed76e600 r4:d00d7d3c [<c0042f38>] (blocking_notifier_call_chain) from [<c04ae62c>] (cpufreq_set_policy+0x7c/0x1d0) [<c04ae5b0>] (cpufreq_set_policy) from [<c04af3cc>] (store_scaling_governor+0x74/0x9c) r7:ec98b540 r6:0000000c r5:ec98b540 r4:ed76e600 [<c04af358>] (store_scaling_governor) from [<c04ad418>] (store+0x90/0xc0) r6:0000000c r5:ed76e6d4 r4:ed76e600 [<c04ad388>] (store) from [<c0175384>] (sysfs_kf_write+0x54/0x58) r8:0000000c r7:d00d7f78 r6:ec98b540 r5:0000000c r4:ec853800 r3:0000000c [<c0175330>] (sysfs_kf_write) from [<c01746b4>] (kernfs_fop_write+0xdc/0x190) r6:ec98b540 r5:00000000 r4:00000000 r3:c0175330 [<c01745d8>] (kernfs_fop_write) from [<c010dcc0>] (vfs_write+0xac/0x1b4) r10:0162aa70 r9:d00d6000 r8:0000000c r7:d00d7f78 r6:0162aa70 r5:0000000c r4:eccde500 [<c010dc14>] (vfs_write) from [<c010dfec>] (SyS_write+0x44/0x90) r10:0162aa70 r8:0000000c r7:eccde500 r6:eccde500 r5:00000000 r4:00000000 [<c010dfa8>] (SyS_write) from [<c000ec00>] (ret_fast_syscall+0x0/0x48) r10:00000000 r8:c000edc4 r7:00000004 r6:000216cc r5:0000000c r4:0162aa70 Solve this by moving to finer grained locking - use one mutex to protect the cpufreq_dev_list as a whole, and a separate lock to ensure correct ordering of cpufreq notifier registration and removal. cooling_list_lock is taken within cooling_cpufreq_lock on (un)registration to preserve the behavior of the code, i.e. to atomically add/remove to the list and (un)register the notifier. Fixes: 2dcd851fe4b4 ("thermal: cpu_cooling: Update always cpufreq policy with Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-12 17:52:16 +08:00
if (first)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
cpufreq_register_notifier(&thermal_cpufreq_notifier_block,
CPUFREQ_POLICY_NOTIFIER);
return cdev;
remove_ida:
ida_simple_remove(&cpufreq_ida, cpufreq_cdev->id);
free_table:
kfree(cpufreq_cdev->freq_table);
free_idle_time:
kfree(cpufreq_cdev->idle_time);
free_cdev:
kfree(cpufreq_cdev);
return cdev;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
/**
* cpufreq_cooling_register - function to create cpufreq cooling device.
* @policy: cpufreq policy
*
* This interface function registers the cpufreq cooling device with the name
* "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
* cooling devices.
*
* Return: a valid struct thermal_cooling_device pointer on success,
* on failure, it returns a corresponding ERR_PTR().
*/
struct thermal_cooling_device *
cpufreq_cooling_register(struct cpufreq_policy *policy)
{
return __cpufreq_cooling_register(NULL, policy, 0);
}
EXPORT_SYMBOL_GPL(cpufreq_cooling_register);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* of_cpufreq_cooling_register - function to create cpufreq cooling device.
* @policy: cpufreq policy
*
* This interface function registers the cpufreq cooling device with the name
* "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
* cooling devices. Using this API, the cpufreq cooling device will be
* linked to the device tree node provided.
*
* Using this function, the cooling device will implement the power
* extensions by using a simple cpu power model. The cpus must have
* registered their OPPs using the OPP library.
*
* It also takes into account, if property present in policy CPU node, the
* static power consumed by the cpu.
*
* Return: a valid struct thermal_cooling_device pointer on success,
* and NULL on failure.
*/
struct thermal_cooling_device *
of_cpufreq_cooling_register(struct cpufreq_policy *policy)
{
struct device_node *np = of_get_cpu_node(policy->cpu, NULL);
struct thermal_cooling_device *cdev = NULL;
u32 capacitance = 0;
if (!np) {
pr_err("cpu_cooling: OF node not available for cpu%d\n",
policy->cpu);
return NULL;
}
if (of_find_property(np, "#cooling-cells", NULL)) {
of_property_read_u32(np, "dynamic-power-coefficient",
&capacitance);
cdev = __cpufreq_cooling_register(np, policy, capacitance);
if (IS_ERR(cdev)) {
pr_err("cpu_cooling: cpu%d is not running as cooling device: %ld\n",
policy->cpu, PTR_ERR(cdev));
cdev = NULL;
}
}
of_node_put(np);
return cdev;
}
EXPORT_SYMBOL_GPL(of_cpufreq_cooling_register);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* cpufreq_cooling_unregister - function to remove cpufreq cooling device.
* @cdev: thermal cooling device pointer.
*
* This interface function unregisters the "thermal-cpufreq-%x" cooling device.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
{
struct cpufreq_cooling_device *cpufreq_cdev;
bool last;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
if (!cdev)
return;
cpufreq_cdev = cdev->devdata;
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
mutex_lock(&cooling_list_lock);
list_del(&cpufreq_cdev->node);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/* Unregister the notifier for the last cpufreq cooling device */
last = list_empty(&cpufreq_cdev_list);
mutex_unlock(&cooling_list_lock);
if (last)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
cpufreq_unregister_notifier(&thermal_cpufreq_notifier_block,
CPUFREQ_POLICY_NOTIFIER);
thermal: cpu_cooling: fix lockdep problems in cpu_cooling A recent change to the cpu_cooling code introduced a AB-BA deadlock scenario between the cpufreq_policy_notifier_list rwsem and the cooling_cpufreq_lock. This is caused by cooling_cpufreq_lock being held before the registration/removal of the notifier block (an operation which takes the rwsem), and the notifier code itself which takes the locks in the reverse order: ====================================================== [ INFO: possible circular locking dependency detected ] 3.18.0+ #1453 Not tainted ------------------------------------------------------- rc.local/770 is trying to acquire lock: (cooling_cpufreq_lock){+.+.+.}, at: [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc but task is already holding lock: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 which lock already depends on the new lock. the existing dependency chain (in reverse order) is: -> #1 ((cpufreq_policy_notifier_list).rwsem){++++.+}: [<c06bc3b0>] down_write+0x44/0x9c [<c0043444>] blocking_notifier_chain_register+0x28/0xd8 [<c04ad610>] cpufreq_register_notifier+0x68/0x90 [<c04abe4c>] __cpufreq_cooling_register.part.1+0x120/0x180 [<c04abf44>] __cpufreq_cooling_register+0x98/0xa4 [<c04abf8c>] cpufreq_cooling_register+0x18/0x1c [<bf0046f8>] imx_thermal_probe+0x1c0/0x470 [imx_thermal] [<c037cef8>] platform_drv_probe+0x50/0xac [<c037b710>] driver_probe_device+0x114/0x234 [<c037b8cc>] __driver_attach+0x9c/0xa0 [<c0379d68>] bus_for_each_dev+0x5c/0x90 [<c037b204>] driver_attach+0x24/0x28 [<c037ae7c>] bus_add_driver+0xe0/0x1d8 [<c037c0cc>] driver_register+0x80/0xfc [<c037cd80>] __platform_driver_register+0x50/0x64 [<bf007018>] 0xbf007018 [<c0008a5c>] do_one_initcall+0x88/0x1d8 [<c0095da4>] load_module+0x1768/0x1ef8 [<c0096614>] SyS_init_module+0xe0/0xf4 [<c000ec00>] ret_fast_syscall+0x0/0x48 -> #0 (cooling_cpufreq_lock){+.+.+.}: [<c00619f8>] lock_acquire+0xb0/0x124 [<c06ba3b4>] mutex_lock_nested+0x5c/0x3d8 [<c04abfc4>] cpufreq_thermal_notifier+0x34/0xfc [<c0042bf4>] notifier_call_chain+0x4c/0x8c [<c0042f20>] __blocking_notifier_call_chain+0x50/0x68 [<c0042f58>] blocking_notifier_call_chain+0x20/0x28 [<c04ae62c>] cpufreq_set_policy+0x7c/0x1d0 [<c04af3cc>] store_scaling_governor+0x74/0x9c [<c04ad418>] store+0x90/0xc0 [<c0175384>] sysfs_kf_write+0x54/0x58 [<c01746b4>] kernfs_fop_write+0xdc/0x190 [<c010dcc0>] vfs_write+0xac/0x1b4 [<c010dfec>] SyS_write+0x44/0x90 [<c000ec00>] ret_fast_syscall+0x0/0x48 other info that might help us debug this: Possible unsafe locking scenario: CPU0 CPU1 ---- ---- lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); lock((cpufreq_policy_notifier_list).rwsem); lock(cooling_cpufreq_lock); *** DEADLOCK *** 7 locks held by rc.local/770: #0: (sb_writers#6){.+.+.+}, at: [<c010dda0>] vfs_write+0x18c/0x1b4 #1: (&of->mutex){+.+.+.}, at: [<c0174678>] kernfs_fop_write+0xa0/0x190 #2: (s_active#52){.+.+.+}, at: [<c0174680>] kernfs_fop_write+0xa8/0x190 #3: (cpu_hotplug.lock){++++++}, at: [<c0026a60>] get_online_cpus+0x34/0x90 #4: (cpufreq_rwsem){.+.+.+}, at: [<c04ad3e0>] store+0x58/0xc0 #5: (&policy->rwsem){+.+.+.}, at: [<c04ad3f8>] store+0x70/0xc0 #6: ((cpufreq_policy_notifier_list).rwsem){++++.+}, at: [<c0042f04>] __blocking_notifier_call_chain+0x34/0x68 stack backtrace: CPU: 0 PID: 770 Comm: rc.local Not tainted 3.18.0+ #1453 Hardware name: Freescale i.MX6 Quad/DualLite (Device Tree) Backtrace: [<c00121c8>] (dump_backtrace) from [<c0012360>] (show_stack+0x18/0x1c) r6:c0b85a80 r5:c0b75630 r4:00000000 r3:00000000 [<c0012348>] (show_stack) from [<c06b6c48>] (dump_stack+0x7c/0x98) [<c06b6bcc>] (dump_stack) from [<c06b42a4>] (print_circular_bug+0x28c/0x2d8) r4:c0b85a80 r3:d0071d40 [<c06b4018>] (print_circular_bug) from [<c00613b0>] (__lock_acquire+0x1acc/0x1bb0) r10:c0b50660 r8:c09e6d80 r7:d0071d40 r6:c11d0f0c r5:00000007 r4:d0072240 [<c005f8e4>] (__lock_acquire) from [<c00619f8>] (lock_acquire+0xb0/0x124) r10:00000000 r9:c04abfc4 r8:00000000 r7:00000000 r6:00000000 r5:c0a06f0c r4:00000000 [<c0061948>] (lock_acquire) from [<c06ba3b4>] (mutex_lock_nested+0x5c/0x3d8) r10:ec853800 r9:c0a06ed4 r8:d0071d40 r7:c0a06ed4 r6:c11d0f0c r5:00000000 r4:c04abfc4 [<c06ba358>] (mutex_lock_nested) from [<c04abfc4>] (cpufreq_thermal_notifier+0x34/0xfc) r10:ec853800 r9:ec85380c r8:d00d7d3c r7:c0a06ed4 r6:d00d7d3c r5:00000000 r4:fffffffe [<c04abf90>] (cpufreq_thermal_notifier) from [<c0042bf4>] (notifier_call_chain+0x4c/0x8c) r7:00000000 r6:00000000 r5:00000000 r4:fffffffe [<c0042ba8>] (notifier_call_chain) from [<c0042f20>] (__blocking_notifier_call_chain+0x50/0x68) r8:c0a072a4 r7:00000000 r6:d00d7d3c r5:ffffffff r4:c0a06fc8 r3:ffffffff [<c0042ed0>] (__blocking_notifier_call_chain) from [<c0042f58>] (blocking_notifier_call_chain+0x20/0x28) r7:ec98b540 r6:c13ebc80 r5:ed76e600 r4:d00d7d3c [<c0042f38>] (blocking_notifier_call_chain) from [<c04ae62c>] (cpufreq_set_policy+0x7c/0x1d0) [<c04ae5b0>] (cpufreq_set_policy) from [<c04af3cc>] (store_scaling_governor+0x74/0x9c) r7:ec98b540 r6:0000000c r5:ec98b540 r4:ed76e600 [<c04af358>] (store_scaling_governor) from [<c04ad418>] (store+0x90/0xc0) r6:0000000c r5:ed76e6d4 r4:ed76e600 [<c04ad388>] (store) from [<c0175384>] (sysfs_kf_write+0x54/0x58) r8:0000000c r7:d00d7f78 r6:ec98b540 r5:0000000c r4:ec853800 r3:0000000c [<c0175330>] (sysfs_kf_write) from [<c01746b4>] (kernfs_fop_write+0xdc/0x190) r6:ec98b540 r5:00000000 r4:00000000 r3:c0175330 [<c01745d8>] (kernfs_fop_write) from [<c010dcc0>] (vfs_write+0xac/0x1b4) r10:0162aa70 r9:d00d6000 r8:0000000c r7:d00d7f78 r6:0162aa70 r5:0000000c r4:eccde500 [<c010dc14>] (vfs_write) from [<c010dfec>] (SyS_write+0x44/0x90) r10:0162aa70 r8:0000000c r7:eccde500 r6:eccde500 r5:00000000 r4:00000000 [<c010dfa8>] (SyS_write) from [<c000ec00>] (ret_fast_syscall+0x0/0x48) r10:00000000 r8:c000edc4 r7:00000004 r6:000216cc r5:0000000c r4:0162aa70 Solve this by moving to finer grained locking - use one mutex to protect the cpufreq_dev_list as a whole, and a separate lock to ensure correct ordering of cpufreq notifier registration and removal. cooling_list_lock is taken within cooling_cpufreq_lock on (un)registration to preserve the behavior of the code, i.e. to atomically add/remove to the list and (un)register the notifier. Fixes: 2dcd851fe4b4 ("thermal: cpu_cooling: Update always cpufreq policy with Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-12 17:52:16 +08:00
thermal_cooling_device_unregister(cpufreq_cdev->cdev);
ida_simple_remove(&cpufreq_ida, cpufreq_cdev->id);
kfree(cpufreq_cdev->idle_time);
kfree(cpufreq_cdev->freq_table);
kfree(cpufreq_cdev);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
EXPORT_SYMBOL_GPL(cpufreq_cooling_unregister);