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OpenCloudOS-Kernel/drivers/thermal/thermal_core.h

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drivers: thermal: Update license to SPDX format Update licences format for core thermal files. Signed-off-by: Lina Iyer <ilina@codeaurora.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-05-08 01:52:29 +08:00
/* SPDX-License-Identifier: GPL-2.0 */
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
/*
* thermal_core.h
*
* Copyright (C) 2012 Intel Corp
* Author: Durgadoss R <durgadoss.r@intel.com>
*/
#ifndef __THERMAL_CORE_H__
#define __THERMAL_CORE_H__
#include <linux/device.h>
#include <linux/thermal.h>
thermal: netlink: Fix compilation error when CONFIG_NET=n When the network is not configured, the netlink is disabled on all the system. The thermal framework assumed the netlink is always opt-in. Fix this by adding a Kconfig option for the netlink notification, defaulting to yes and depending on CONFIG_NET. As the change implies multiple stubs and in order to not pollute the internal thermal header, the thermal_nelink.h has been added and included in the thermal_core.h, so this one regain some kind of clarity. Reported-by: Randy Dunlap <rdunlap@infradead.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
2020-07-07 17:01:57 +08:00
#include "thermal_netlink.h"
thermal: Move default governor config option to the internal header The default governor set at compilation time is a thermal internal business, no need to export to the global thermal header. Move the config options to the internal header. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org
2020-04-02 22:27:39 +08:00
/* Default Thermal Governor */
#if defined(CONFIG_THERMAL_DEFAULT_GOV_STEP_WISE)
#define DEFAULT_THERMAL_GOVERNOR "step_wise"
#elif defined(CONFIG_THERMAL_DEFAULT_GOV_FAIR_SHARE)
#define DEFAULT_THERMAL_GOVERNOR "fair_share"
#elif defined(CONFIG_THERMAL_DEFAULT_GOV_USER_SPACE)
#define DEFAULT_THERMAL_GOVERNOR "user_space"
#elif defined(CONFIG_THERMAL_DEFAULT_GOV_POWER_ALLOCATOR)
#define DEFAULT_THERMAL_GOVERNOR "power_allocator"
thermal: Allow selecting the bang-bang governor as default For many setups the bang-bang governor is exactly what we want. Many ARM SoC-based devices use fans to cool down the entire SoC and that works well only with the bang-bang governor because it uses the hysteresis in order to let the fan run for a while to cool the SoC down below the trip point before switching it off again. The step-wise governor will behave strangely in these situations. It doesn't use the hysteresis, so it can lead to situations where the fan is turned on for only a very brief period and then is switched back off, only to get switched back on again very quickly because the SoC hasn't cooled down very much. Signed-off-by: Thierry Reding <treding@nvidia.com> Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-06-09 20:44:08 +08:00
#elif defined(CONFIG_THERMAL_DEFAULT_GOV_BANG_BANG)
#define DEFAULT_THERMAL_GOVERNOR "bang_bang"
thermal: Move default governor config option to the internal header The default governor set at compilation time is a thermal internal business, no need to export to the global thermal header. Move the config options to the internal header. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org
2020-04-02 22:27:39 +08:00
#endif
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
/* Initial state of a cooling device during binding */
#define THERMAL_NO_TARGET -1UL
thermal/drivers/core: Add init section table for self-encapsulation Currently the governors are declared in their respective files but they export their [un]register functions which in turn call the [un]register governors core's functions. That implies a cyclic dependency which is not desirable. There is a way to self-encapsulate the governors by letting them to declare themselves in a __init section table. Define the table in the asm generic linker description like the other tables and provide the specific macros to deal with. Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-06-13 04:13:24 +08:00
/* Init section thermal table */
extern struct thermal_governor *__governor_thermal_table[];
extern struct thermal_governor *__governor_thermal_table_end[];
#define THERMAL_TABLE_ENTRY(table, name) \
static typeof(name) *__thermal_table_entry_##name \
treewide: Convert macro and uses of __section(foo) to __section("foo") Use a more generic form for __section that requires quotes to avoid complications with clang and gcc differences. Remove the quote operator # from compiler_attributes.h __section macro. Convert all unquoted __section(foo) uses to quoted __section("foo"). Also convert __attribute__((section("foo"))) uses to __section("foo") even if the __attribute__ has multiple list entry forms. Conversion done using the script at: https://lore.kernel.org/lkml/75393e5ddc272dc7403de74d645e6c6e0f4e70eb.camel@perches.com/2-convert_section.pl Signed-off-by: Joe Perches <joe@perches.com> Reviewed-by: Nick Desaulniers <ndesaulniers@gooogle.com> Reviewed-by: Miguel Ojeda <ojeda@kernel.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2020-10-22 10:36:07 +08:00
__used __section("__" #table "_thermal_table") = &name
thermal/drivers/core: Add init section table for self-encapsulation Currently the governors are declared in their respective files but they export their [un]register functions which in turn call the [un]register governors core's functions. That implies a cyclic dependency which is not desirable. There is a way to self-encapsulate the governors by letting them to declare themselves in a __init section table. Define the table in the asm generic linker description like the other tables and provide the specific macros to deal with. Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2019-06-13 04:13:24 +08:00
#define THERMAL_GOVERNOR_DECLARE(name) THERMAL_TABLE_ENTRY(governor, name)
#define for_each_governor_table(__governor) \
for (__governor = __governor_thermal_table; \
__governor < __governor_thermal_table_end; \
__governor++)
thermal: core: Add helpers to browse the cdev, tz and governor list The cdev, tz and governor list, as well as their respective locks are statically defined in the thermal_core.c file. In order to give a sane access to these list, like browsing all the thermal zones or all the cooling devices, let's define a set of helpers where we pass a callback as a parameter to be called for each thermal entity. We keep the self-encapsulation and ensure the locks are correctly taken when looking at the list. Acked-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200706105538.2159-1-daniel.lezcano@linaro.org
2020-07-06 18:55:35 +08:00
int for_each_thermal_zone(int (*cb)(struct thermal_zone_device *, void *),
void *);
int for_each_thermal_cooling_device(int (*cb)(struct thermal_cooling_device *,
void *), void *);
int for_each_thermal_governor(int (*cb)(struct thermal_governor *, void *),
void *thermal_governor);
thermal: core: Get thermal zone by id The next patch will introduce the generic netlink protocol to handle events, sampling and command from the thermal framework. In order to deal with the thermal zone, it uses its unique identifier to characterize it in the message. Passing an integer is more efficient than passing an entire string. This change provides a function returning back a thermal zone pointer corresponding to the identifier passed as parameter. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200706105538.2159-2-daniel.lezcano@linaro.org
2020-07-06 18:55:36 +08:00
struct thermal_zone_device *thermal_zone_get_by_id(int id);
thermal: Move struct thermal_attr to the private header The structure belongs to the thermal core internals but it is exported in the include/linux/thermal.h For better self-encapsulation and less impact for the compilation if a change is made on it. Move the structure in the thermal core internal header file. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-2-daniel.lezcano@linaro.org
2020-04-02 22:27:40 +08:00
struct thermal_attr {
struct device_attribute attr;
char name[THERMAL_NAME_LENGTH];
};
thermal: Move internal IPA functions The exported IPA functions are used by the IPA. It is pointless to declare the functions in the thermal.h file. For better self-encapsulation and less impact for the compilation if a change is made on it. Move the code in the thermal core internal header file. As the users depends on THERMAL then it is pointless to have the stub, remove them. Take also the opportunity to fix checkpatch warnings/errors when moving the code around. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
2020-04-02 22:27:41 +08:00
static inline bool cdev_is_power_actor(struct thermal_cooling_device *cdev)
{
return cdev->ops->get_requested_power && cdev->ops->state2power &&
cdev->ops->power2state;
}
thermal/core: Make cooling device state change private The change of the cooling device state should be used by the governor or at least by the core code, not by the drivers themselves. Remove the API usage and move the function declaration to the internal headers. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Guenter Roeck <linux@roeck-us.net> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20210118173824.9970-1-daniel.lezcano@linaro.org
2021-01-19 01:38:24 +08:00
void thermal_cdev_update(struct thermal_cooling_device *);
thermal/core: Create a helper __thermal_cdev_update() without a lock There is a need to have a helper function which updates cooling device state from the governors code. With this change governor can use lock and unlock while calling helper function. This avoid unnecessary second time lock/unlock which was in previous solution present in governor implementation. This new helper function must be called with mutex 'cdev->lock' hold. The changed been discussed and part of code presented in thread: https://lore.kernel.org/linux-pm/20210419084536.25000-1-lukasz.luba@arm.com/ Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20210422114308.29684-2-lukasz.luba@arm.com
2021-04-22 19:43:06 +08:00
void __thermal_cdev_update(struct thermal_cooling_device *cdev);
thermal/core: Make cooling device state change private The change of the cooling device state should be used by the governor or at least by the core code, not by the drivers themselves. Remove the API usage and move the function declaration to the internal headers. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Guenter Roeck <linux@roeck-us.net> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20210118173824.9970-1-daniel.lezcano@linaro.org
2021-01-19 01:38:24 +08:00
thermal: core: Rework .get_trend() thermal zone callback Passing a struct thermal_trip pointer instead of a trip index to the .get_trend() thermal zone callback allows one of its 2 implementations, the thermal_get_trend() function in the ACPI thermal driver, to be simplified quite a bit, and the other implementation of it in the ti-soc-thermal driver does not even use the relevant callback argument. For this reason, change the .get_trend() thermal zone callback definition and adjust the related code accordingly. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-08-22 19:40:06 +08:00
int get_tz_trend(struct thermal_zone_device *tz, int trip_index);
thermal: Move get_tz_trend to the internal header The function is not used any place other than the thermal directory. It does not make sense to export its definition in the global header as there is no use of it. Move the definition to the internal header and allow better self-encapsulation. Take the opportunity to add the parameter names to make checkpatch happy and remove the pointless stubs. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
2020-04-02 22:27:43 +08:00
thermal: Move get_thermal_instance to the internal header The function is not used any place other than the thermal directory. It does not make sense to export its definition in the global header as there is no use of it. Move the definition to the internal header and allow better self-encapsulation. Take the opportunity to add the parameter names to make checkpatch happy and remove the pointless stubs. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
2020-04-02 22:27:44 +08:00
struct thermal_instance *
get_thermal_instance(struct thermal_zone_device *tz,
struct thermal_cooling_device *cdev,
int trip);
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
/*
* This structure is used to describe the behavior of
* a certain cooling device on a certain trip point
* in a certain thermal zone
*/
struct thermal_instance {
int id;
char name[THERMAL_NAME_LENGTH];
struct thermal_zone_device *tz;
struct thermal_cooling_device *cdev;
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org>
2023-09-22 01:52:44 +08:00
const struct thermal_trip *trip;
Thermal: initialize thermal zone device correctly After thermal zone device registered, as we have not read any temperature before, thus tz->temperature should not be 0, which actually means 0C, and thermal trend is not available. In this case, we need specially handling for the first thermal_zone_device_update(). Both thermal core framework and step_wise governor is enhanced to handle this. And since the step_wise governor is the only one that uses trends, so it's the only thermal governor that needs to be updated. CC: <stable@vger.kernel.org> #3.18+ Tested-by: Manuel Krause <manuelkrause@netscape.net> Tested-by: szegad <szegadlo@poczta.onet.pl> Tested-by: prash <prash.n.rao@gmail.com> Tested-by: amish <ammdispose-arch@yahoo.com> Tested-by: Matthias <morpheusxyz123@yahoo.de> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Chen Yu <yu.c.chen@intel.com>
2015-10-30 16:31:47 +08:00
bool initialized;
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
unsigned long upper; /* Highest cooling state for this trip point */
unsigned long lower; /* Lowest cooling state for this trip point */
unsigned long target; /* expected cooling state */
char attr_name[THERMAL_NAME_LENGTH];
struct device_attribute attr;
thermal: export weight to sysfs It's useful to have access to the weights for the cooling devices for thermal zones and change them if needed. Export them to sysfs. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-19 00:04:24 +08:00
char weight_attr_name[THERMAL_NAME_LENGTH];
struct device_attribute weight_attr;
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
struct list_head tz_node; /* node in tz->thermal_instances */
struct list_head cdev_node; /* node in cdev->thermal_instances */
thermal: of: fix cooling device weights in device tree Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-19 00:04:21 +08:00
unsigned int weight; /* The weight of the cooling device */
thermal: core: Introduce thermal_cooling_device_update() Introduce a core thermal API function, thermal_cooling_device_update(), for updating the max_state value for a cooling device and rearranging its statistics in sysfs after a possible change of its ->get_max_state() callback return value. That callback is now invoked only once, during cooling device registration, to populate the max_state field in the cooling device object, so if its return value changes, it needs to be invoked again and the new return value needs to be stored as max_state. Moreover, the statistics presented in sysfs need to be rearranged in general, because there may not be enough room in them to store data for all of the possible states (in the case when max_state grows). The new function takes care of that (and some other minor things related to it), but some extra locking and lockdep annotations are added in several places too to protect against crashes in the cases when the statistics are not present or when a stale max_state value might be used by sysfs attributes. Note that the actual user of the new function will be added separately. Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Tested-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-03-18 01:01:26 +08:00
bool upper_no_limit;
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
};
thermal: core: move to_thermal_zone() macro to header file Simply making this macro available to other thermal core files. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:08:57 +08:00
#define to_thermal_zone(_dev) \
container_of(_dev, struct thermal_zone_device, device)
thermal: core: move to_cooling_device macro to header file Make the to_cooling_device() macro available across files in thermal core. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:09:01 +08:00
#define to_cooling_device(_dev) \
container_of(_dev, struct thermal_cooling_device, device)
Thermal: build thermal governors into thermal_sys module The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-03-26 16:38:29 +08:00
int thermal_register_governor(struct thermal_governor *);
void thermal_unregister_governor(struct thermal_governor *);
thermal: core: split policy_store Similarly to passive_store, policy_store now is split between thermal core data structure handling and sysfs handling. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:08:55 +08:00
int thermal_zone_device_set_policy(struct thermal_zone_device *, char *);
thermal: core: split available_policies_show() This patch creates a helper to build a list of available governors. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:08:56 +08:00
int thermal_build_list_of_policies(char *buf);
thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex Protect access to thermal operations against thermal zone removal by acquiring the thermal zone device mutex. After acquiring the mutex, check if the thermal zone device is registered and abort the operation if not. With this change, we can call __thermal_zone_device_update() instead of thermal_zone_device_update() from trip_point_temp_store() and from emul_temp_store(). Similar, we can call __thermal_zone_set_trips() instead of thermal_zone_set_trips() from trip_point_hyst_store(). Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-10 23:24:58 +08:00
void __thermal_zone_device_update(struct thermal_zone_device *tz,
enum thermal_notify_event event);
Thermal: build thermal governors into thermal_sys module The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-03-26 16:38:29 +08:00
thermal: core: Make thermal_zone_set_trips private The function thermal_zone_set_trips() is used by the thermal core code in order to update the next trip points, there are no other users. Move the function definition in the thermal_core.h, remove the EXPORT_SYMBOL_GPL and document the function. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200331165449.30355-1-daniel.lezcano@linaro.org
2020-04-01 00:54:48 +08:00
/* Helpers */
thermal/core: Move the mutex inside the thermal_zone_device_update() function All the different calls inside the thermal_zone_device_update() function take the mutex. The previous changes move the mutex out of the different functions, like the throttling ops. Now that the mutexes are all at the same level in the call stack for the thermal_zone_device_update() function, they can be moved inside this one. That has the benefit of: 1. Simplify the code by not having a plethora of places where the lock is taken 2. Probably closes more race windows because releasing the lock from one line to another can give the opportunity to the thermal zone to change its state in the meantime. For example, the thermal zone can be enabled right after checking it is disabled. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20220805153834.2510142-5-daniel.lezcano@linaro.org
2022-08-05 23:38:34 +08:00
void __thermal_zone_set_trips(struct thermal_zone_device *tz);
thermal/core: Add a generic thermal_zone_get_trip() function The thermal_zone_device_ops structure defines a set of ops family, get_trip_temp(), get_trip_hyst(), get_trip_type(). Each of them is returning a property of a trip point. The result is the code is calling the ops everywhere to get a trip point which is supposed to be defined in the backend driver. It is a non-sense as a thermal trip can be generic and used by the backend driver to declare its trip points. Part of the thermal framework has been changed and all the OF thermal drivers are using the same definition for the trip point and use a thermal zone registration variant to pass those trip points which are part of the thermal zone device structure. Consequently, we can use a generic function to get the trip points when they are stored in the thermal zone device structure. This approach can be generalized to all the drivers and we can get rid of the ops->get_trip_*. That will result to a much more simpler code and make possible to rework how the thermal trip are handled in the thermal core framework as discussed previously. This change adds a function thermal_zone_get_trip() where we get the thermal trip point structure which contains all the properties (type, temp, hyst) instead of doing multiple calls to ops->get_trip_*. That opens the door for trip point extension with more attributes. For instance, replacing the trip points disabled bitmask with a 'disabled' field in the structure. Here we replace all the calls to ops->get_trip_* in the thermal core code with a call to the thermal_zone_get_trip() function. The thermal zone ops defines a callback to retrieve the critical temperature. As the trip handling is being reworked, all the trip points will be the same whatever the driver and consequently finding the critical trip temperature will be just a loop to search for a critical trip point type. Provide such a generic function, so we encapsulate the ops get_crit_temp() which can be removed when all the backend drivers are using the generic trip points handling. While at it, add the thermal_zone_get_num_trips() to encapsulate the code more and reduce the grip with the thermal framework internals. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20221003092602.1323944-2-daniel.lezcano@linaro.org
2022-10-03 17:25:34 +08:00
int __thermal_zone_get_trip(struct thermal_zone_device *tz, int trip_id,
struct thermal_trip *trip);
thermal: core: Store trip pointer in struct thermal_instance [ Upstream commit 2c7b4bfadef08cc0995c24a7b9eb120fe897165f ] Replace the integer trip number stored in struct thermal_instance with a pointer to the relevant trip and adjust the code using the structure in question accordingly. The main reason for making this change is to allow the trip point to cooling device binding code more straightforward, as illustrated by subsequent modifications of the ACPI thermal driver, but it also helps to clarify the overall design and allows the governor code overhead to be reduced (through subsequent modifications). The only case in which it adds complexity is trip_point_show() that needs to walk the trips[] table to find the index of the given trip point, but this is not a critical path and the interface that trip_point_show() belongs to is problematic anyway (for instance, it doesn't cover the case when the same cooling devices is associated with multiple trip points). This is a preliminary change and the affected code will be refined by a series of subsequent modifications of thermal governors, the core and the ACPI thermal driver. The general functionality is not expected to be affected by this change. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Stable-dep-of: e95fa7404716 ("thermal: gov_power_allocator: avoid inability to reset a cdev") Signed-off-by: Sasha Levin <sashal@kernel.org>
2023-09-22 01:52:44 +08:00
int thermal_zone_trip_id(struct thermal_zone_device *tz,
const struct thermal_trip *trip);
thermal/core: Move the mutex inside the thermal_zone_device_update() function All the different calls inside the thermal_zone_device_update() function take the mutex. The previous changes move the mutex out of the different functions, like the throttling ops. Now that the mutexes are all at the same level in the call stack for the thermal_zone_device_update() function, they can be moved inside this one. That has the benefit of: 1. Simplify the code by not having a plethora of places where the lock is taken 2. Probably closes more race windows because releasing the lock from one line to another can give the opportunity to the thermal zone to change its state in the meantime. For example, the thermal zone can be enabled right after checking it is disabled. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20220805153834.2510142-5-daniel.lezcano@linaro.org
2022-08-05 23:38:34 +08:00
int __thermal_zone_get_temp(struct thermal_zone_device *tz, int *temp);
thermal: core: Make thermal_zone_set_trips private The function thermal_zone_set_trips() is used by the thermal core code in order to update the next trip points, there are no other users. Move the function definition in the thermal_core.h, remove the EXPORT_SYMBOL_GPL and document the function. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200331165449.30355-1-daniel.lezcano@linaro.org
2020-04-01 00:54:48 +08:00
thermal: core: move thermal_zone sysfs to thermal_sysfs.c This is a code reorganization, simply to concentrate the code handling sysfs in a specific file: thermal_sysfs.c. Right now, moving only the sysfs entries of thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:09:00 +08:00
/* sysfs I/F */
int thermal_zone_create_device_groups(struct thermal_zone_device *, int);
thermal: core: Add some new helper functions to free resources In order to easily free resources allocated by 'thermal_zone_create_device_groups()' we need 2 new helper functions. The first one undoes 'thermal_zone_create_device_groups()'. The 2nd one undoes 'create_trip_attrs()', which is a function called by 'thermal_zone_create_device_groups()'. Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 22:39:52 +08:00
void thermal_zone_destroy_device_groups(struct thermal_zone_device *);
thermal: core: move cooling device sysfs to thermal_sysfs.c This is a code reorganization, simply to concentrate the sysfs handling functions in thermal_sysfs.c. This patch moves the cooling device handling functions. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:09:02 +08:00
void thermal_cooling_device_setup_sysfs(struct thermal_cooling_device *);
thermal: Add cooling device's statistics in sysfs This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-04-02 18:56:25 +08:00
void thermal_cooling_device_destroy_sysfs(struct thermal_cooling_device *cdev);
thermal: core: Introduce thermal_cooling_device_update() Introduce a core thermal API function, thermal_cooling_device_update(), for updating the max_state value for a cooling device and rearranging its statistics in sysfs after a possible change of its ->get_max_state() callback return value. That callback is now invoked only once, during cooling device registration, to populate the max_state field in the cooling device object, so if its return value changes, it needs to be invoked again and the new return value needs to be stored as max_state. Moreover, the statistics presented in sysfs need to be rearranged in general, because there may not be enough room in them to store data for all of the possible states (in the case when max_state grows). The new function takes care of that (and some other minor things related to it), but some extra locking and lockdep annotations are added in several places too to protect against crashes in the cases when the statistics are not present or when a stale max_state value might be used by sysfs attributes. Note that the actual user of the new function will be added separately. Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Tested-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Zhang Rui <rui.zhang@intel.com>
2023-03-18 01:01:26 +08:00
void thermal_cooling_device_stats_reinit(struct thermal_cooling_device *cdev);
thermal: core: move cooling device sysfs to thermal_sysfs.c This is a code reorganization, simply to concentrate the sysfs handling functions in thermal_sysfs.c. This patch moves the cooling device handling functions. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:09:02 +08:00
/* used only at binding time */
thermal: Shorten name of sysfs callbacks The naming isn't consistent across all sysfs callbacks in the thermal core, some have a short name like type_show() and others have long names like thermal_cooling_device_weight_show(). This patch tries to make it consistent by shortening the name of sysfs callbacks. Some of the sysfs files are named similarly for both thermal zone and cooling device (like: type) and to avoid name clash between their show/store routines, the cooling device specific sysfs callbacks are prefixed with "cdev_". Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-04-03 17:49:03 +08:00
ssize_t trip_point_show(struct device *, struct device_attribute *, char *);
ssize_t weight_show(struct device *, struct device_attribute *, char *);
ssize_t weight_store(struct device *, struct device_attribute *, const char *,
size_t);
thermal: core: move thermal_zone sysfs to thermal_sysfs.c This is a code reorganization, simply to concentrate the code handling sysfs in a specific file: thermal_sysfs.c. Right now, moving only the sysfs entries of thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-08 13:09:00 +08:00
thermal: Add cooling device's statistics in sysfs This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-04-02 18:56:25 +08:00
#ifdef CONFIG_THERMAL_STATISTICS
void thermal_cooling_device_stats_update(struct thermal_cooling_device *cdev,
unsigned long new_state);
#else
static inline void
thermal_cooling_device_stats_update(struct thermal_cooling_device *cdev,
unsigned long new_state) {}
#endif /* CONFIG_THERMAL_STATISTICS */
thermal: introduce device tree parser This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-04 03:35:39 +08:00
/* device tree support */
thermal: Make thermal_zone_device_is_enabled() available to core only This function is not needed by drivers. Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200703104354.19657-4-andrzej.p@collabora.com
2020-07-03 18:43:54 +08:00
int thermal_zone_device_is_enabled(struct thermal_zone_device *tz);
Thermal: Move thermal_instance to thermal_core.h This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:34:53 +08:00
#endif /* __THERMAL_CORE_H__ */