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treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 167 Based on 1 normalized pattern(s): this program is free software you can redistribute it and or modify it under the terms of the gnu general public license as published by the free software foundation version 2 of the license this program is distributed in the hope that it will be useful but without any warranty without even the implied warranty of merchantability or fitness for a particular purpose see the gnu general public license for more details you should have received a copy of the gnu general public license along with this program if not write to the free software foundation inc 59 temple place suite 330 boston ma 02111 1307 usa extracted by the scancode license scanner the SPDX license identifier GPL-2.0-only has been chosen to replace the boilerplate/reference in 83 file(s). Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Richard Fontana <rfontana@redhat.com> Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org> Reviewed-by: Allison Randal <allison@lohutok.net> Cc: linux-spdx@vger.kernel.org Link: https://lkml.kernel.org/r/20190527070034.021731668@linutronix.de Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-05-27 14:55:15 +08:00
/* SPDX-License-Identifier: GPL-2.0-only */
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/*
* linux/include/linux/cpu_cooling.h
*
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
* Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
*
* ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
*
* ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
*/
#ifndef __CPU_COOLING_H__
#define __CPU_COOLING_H__
thermal: cpu_cooling: introduce of_cpufreq_cooling_register This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-13 07:26:45 +08:00
#include <linux/of.h>
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
#include <linux/thermal.h>
thermal: cpu_cooling: add needed header for cpu_cooling.h Update header list for cpu_cooling.h. Missing definition of cpumask. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24 23:10:28 +08:00
#include <linux/cpumask.h>
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
thermal: cpu_cooling: use cpufreq_policy to register cooling device The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the frequency table, etc. Most of the callers of CPU cooling driver's registration routines have the cpufreq policy with them, but they only pass the policy->related_cpus cpumask. The __cpufreq_cooling_register() routine then gets the policy by itself and uses it. It would be much better if the callers can pass the policy instead directly. This also fixes a basic design flaw, where the policy can be freed while the CPU cooling driver is still active. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-25 18:27:14 +08:00
struct cpufreq_policy;
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 23:39:27 +08:00
#ifdef CONFIG_CPU_FREQ_THERMAL
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* cpufreq_cooling_register - function to create cpufreq cooling device.
thermal: cpu_cooling: use cpufreq_policy to register cooling device The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the frequency table, etc. Most of the callers of CPU cooling driver's registration routines have the cpufreq policy with them, but they only pass the policy->related_cpus cpumask. The __cpufreq_cooling_register() routine then gets the policy by itself and uses it. It would be much better if the callers can pass the policy instead directly. This also fixes a basic design flaw, where the policy can be freed while the CPU cooling driver is still active. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-25 18:27:14 +08:00
* @policy: cpufreq policy.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
*/
thermal: cpu_cooling: improve line breaking To improve code readiness, change the way the lines are broken in this file. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-18 01:12:23 +08:00
struct thermal_cooling_device *
thermal: cpu_cooling: use cpufreq_policy to register cooling device The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the frequency table, etc. Most of the callers of CPU cooling driver's registration routines have the cpufreq policy with them, but they only pass the policy->related_cpus cpumask. The __cpufreq_cooling_register() routine then gets the policy by itself and uses it. It would be much better if the callers can pass the policy instead directly. This also fixes a basic design flaw, where the policy can be freed while the CPU cooling driver is still active. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-25 18:27:14 +08:00
cpufreq_cooling_register(struct cpufreq_policy *policy);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
/**
* cpufreq_cooling_unregister - function to remove cpufreq cooling device.
* @cdev: thermal cooling device pointer.
*/
void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev);
Thermal: exynos: fix cooling state translation Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-02-08 14:52:06 +08:00
thermal: cpu_cooling: Reorder the header file As the conditions are simplified and unified, it is useless to have different blocks of definitions under the same compiler condition, let's merge the blocks. There is no functional change. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20191030091038.678-2-daniel.lezcano@linaro.org
2019-10-30 17:10:37 +08:00
/**
* of_cpufreq_cooling_register - create cpufreq cooling device based on DT.
* @policy: cpufreq policy.
*/
struct thermal_cooling_device *
of_cpufreq_cooling_register(struct cpufreq_policy *policy);
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 23:39:27 +08:00
#else /* !CONFIG_CPU_FREQ_THERMAL */
thermal: cpu_cooling: improve line breaking To improve code readiness, change the way the lines are broken in this file. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-18 01:12:23 +08:00
static inline struct thermal_cooling_device *
thermal: cpu_cooling: use cpufreq_policy to register cooling device The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the frequency table, etc. Most of the callers of CPU cooling driver's registration routines have the cpufreq policy with them, but they only pass the policy->related_cpus cpumask. The __cpufreq_cooling_register() routine then gets the policy by itself and uses it. It would be much better if the callers can pass the policy instead directly. This also fixes a basic design flaw, where the policy can be freed while the CPU cooling driver is still active. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-25 18:27:14 +08:00
cpufreq_cooling_register(struct cpufreq_policy *policy)
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
{
thermal: cpu_cooling: return ERR_PTR() for !CPU_THERMAL or !THERMAL_OF The documentation of of_cpufreq_cooling_register() and cpufreq_cooling_register() say that they return ERR_PTR() on error. Accordingly, callers only check for IS_ERR(). Therefore, make them return ERR_PTR(-ENOSYS) as is customary in the kernel when config options are missing. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-17 19:11:24 +08:00
return ERR_PTR(-ENOSYS);
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
}
thermal: cpu_cooling: implement the power cooling device API Add a basic power model to the cpu cooling device to implement the power cooling device API. The power model uses the current frequency, current load and OPPs for the power calculations. The cpus must have registered their OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-27 03:00:29 +08:00
cpu_cooling: Keep only one of_cpufreq*cooling_register() helper of_cpufreq_cooling_register() isn't used by anyone and so can be removed, but then we would be left with two routines: cpufreq_cooling_register() and of_cpufreq_power_cooling_register() that would look odd. Remove current implementation of of_cpufreq_cooling_register() and rename of_cpufreq_power_cooling_register() as of_cpufreq_cooling_register(). This simplifies lots of stuff. Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-12-05 13:32:45 +08:00
static inline
void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
thermal: cpu_cooling: introduce of_cpufreq_cooling_register This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-13 07:26:45 +08:00
{
cpu_cooling: Keep only one of_cpufreq*cooling_register() helper of_cpufreq_cooling_register() isn't used by anyone and so can be removed, but then we would be left with two routines: cpufreq_cooling_register() and of_cpufreq_power_cooling_register() that would look odd. Remove current implementation of of_cpufreq_cooling_register() and rename of_cpufreq_power_cooling_register() as of_cpufreq_cooling_register(). This simplifies lots of stuff. Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-12-05 13:32:45 +08:00
return;
thermal: cpu_cooling: introduce of_cpufreq_cooling_register This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-13 07:26:45 +08:00
}
thermal: cpu_cooling: implement the power cooling device API Add a basic power model to the cpu cooling device to implement the power cooling device API. The power model uses the current frequency, current load and OPPs for the power calculations. The cpus must have registered their OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-27 03:00:29 +08:00
static inline struct thermal_cooling_device *
cpu_cooling: Keep only one of_cpufreq*cooling_register() helper of_cpufreq_cooling_register() isn't used by anyone and so can be removed, but then we would be left with two routines: cpufreq_cooling_register() and of_cpufreq_power_cooling_register() that would look odd. Remove current implementation of of_cpufreq_cooling_register() and rename of_cpufreq_power_cooling_register() as of_cpufreq_cooling_register(). This simplifies lots of stuff. Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-12-05 13:32:45 +08:00
of_cpufreq_cooling_register(struct cpufreq_policy *policy)
thermal: cpu_cooling: implement the power cooling device API Add a basic power model to the cpu cooling device to implement the power cooling device API. The power model uses the current frequency, current load and OPPs for the power calculations. The cpus must have registered their OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-27 03:00:29 +08:00
{
return NULL;
}
thermal/drivers/Kconfig: Convert the CPU cooling device to a choice The next changes will add a new way to cool down a CPU by injecting idle cycles. With the current configuration, a CPU cooling device is the cpufreq cooling device. As we want to add a new CPU cooling device, let's convert the CPU cooling to a choice giving a list of CPU cooling devices. At this point, there is obviously only one CPU cooling device. There is no functional changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2019-12-04 23:39:27 +08:00
#endif /* CONFIG_CPU_FREQ_THERMAL */
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
2019-12-20 06:53:16 +08:00
struct cpuidle_driver;
#ifdef CONFIG_CPU_IDLE_THERMAL
thermal/drivers/cpuidle_cooling: Change the registration function Today, there is no user for the cpuidle cooling device. The targetted platform is ARM and ARM64. The cpuidle and the cpufreq cooling device are based on the device tree. As the cpuidle cooling device can have its own configuration depending on the platform and the available idle states. The DT node description will give the optional properties to set the cooling device up. Do no longer rely on the CPU node which is prone to error and will lead to a confusion in the DT because the cpufreq cooling device is also using it. Let initialize the cpuidle cooling device with the DT binding. This was tested on: - hikey960 - hikey6220 - rock960 - db845c Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Tested-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200429103644.5492-3-daniel.lezcano@linaro.org
2020-04-29 18:36:41 +08:00
void cpuidle_cooling_register(struct cpuidle_driver *drv);
thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
2019-12-20 06:53:16 +08:00
#else /* CONFIG_CPU_IDLE_THERMAL */
thermal/drivers/cpuidle_cooling: Change the registration function Today, there is no user for the cpuidle cooling device. The targetted platform is ARM and ARM64. The cpuidle and the cpufreq cooling device are based on the device tree. As the cpuidle cooling device can have its own configuration depending on the platform and the available idle states. The DT node description will give the optional properties to set the cooling device up. Do no longer rely on the CPU node which is prone to error and will lead to a confusion in the DT because the cpufreq cooling device is also using it. Let initialize the cpuidle cooling device with the DT binding. This was tested on: - hikey960 - hikey6220 - rock960 - db845c Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Tested-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200429103644.5492-3-daniel.lezcano@linaro.org
2020-04-29 18:36:41 +08:00
static inline void cpuidle_cooling_register(struct cpuidle_driver *drv)
thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
2019-12-20 06:53:16 +08:00
{
}
#endif /* CONFIG_CPU_IDLE_THERMAL */
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
#endif /* __CPU_COOLING_H__ */